SG66361A1 - Solder ball loading mechanism - Google Patents
Solder ball loading mechanismInfo
- Publication number
- SG66361A1 SG66361A1 SG1997001173A SG1997001173A SG66361A1 SG 66361 A1 SG66361 A1 SG 66361A1 SG 1997001173 A SG1997001173 A SG 1997001173A SG 1997001173 A SG1997001173 A SG 1997001173A SG 66361 A1 SG66361 A1 SG 66361A1
- Authority
- SG
- Singapore
- Prior art keywords
- solder ball
- loading mechanism
- ball loading
- solder
- loading
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG1997001173A SG66361A1 (en) | 1997-04-11 | 1997-04-11 | Solder ball loading mechanism |
TW087104988A TW405194B (en) | 1997-04-11 | 1998-04-02 | Solder ball loading mechanism |
PCT/SG1998/000025 WO1998047330A1 (en) | 1997-04-11 | 1998-04-09 | Solder ball loading mechanism |
MYPI98002503A MY133099A (en) | 1997-04-11 | 1998-06-04 | Solder ball loading mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG1997001173A SG66361A1 (en) | 1997-04-11 | 1997-04-11 | Solder ball loading mechanism |
Publications (1)
Publication Number | Publication Date |
---|---|
SG66361A1 true SG66361A1 (en) | 1999-07-20 |
Family
ID=20429621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1997001173A SG66361A1 (en) | 1997-04-11 | 1997-04-11 | Solder ball loading mechanism |
Country Status (4)
Country | Link |
---|---|
MY (1) | MY133099A (en) |
SG (1) | SG66361A1 (en) |
TW (1) | TW405194B (en) |
WO (1) | WO1998047330A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6641030B1 (en) * | 1997-02-06 | 2003-11-04 | Speedline Technologies, Inc. | Method and apparatus for placing solder balls on a substrate |
US6769596B1 (en) * | 2002-11-15 | 2004-08-03 | Qlogic Corporation | Method and system for reworking ball grid arrays |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5431332A (en) * | 1994-02-07 | 1995-07-11 | Motorola, Inc. | Method and apparatus for solder sphere placement using an air knife |
US5540377A (en) * | 1994-07-15 | 1996-07-30 | Ito; Carl T. | Solder ball placement machine |
US5551216A (en) * | 1994-09-14 | 1996-09-03 | Vanguard Automation, Inc. | Method and apparatus for filling a ball grid array |
US5620129A (en) * | 1995-02-17 | 1997-04-15 | Rogren; Philip E. | Device and method for forming and attaching an array of conductive balls |
-
1997
- 1997-04-11 SG SG1997001173A patent/SG66361A1/en unknown
-
1998
- 1998-04-02 TW TW087104988A patent/TW405194B/en not_active IP Right Cessation
- 1998-04-09 WO PCT/SG1998/000025 patent/WO1998047330A1/en active Application Filing
- 1998-06-04 MY MYPI98002503A patent/MY133099A/en unknown
Also Published As
Publication number | Publication date |
---|---|
MY133099A (en) | 2007-10-31 |
WO1998047330A1 (en) | 1998-10-22 |
TW405194B (en) | 2000-09-11 |
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