MY131417A - Solder reflow oven - Google Patents

Solder reflow oven

Info

Publication number
MY131417A
MY131417A MYPI20034504A MYPI20034504A MY131417A MY 131417 A MY131417 A MY 131417A MY PI20034504 A MYPI20034504 A MY PI20034504A MY PI20034504 A MYPI20034504 A MY PI20034504A MY 131417 A MY131417 A MY 131417A
Authority
MY
Malaysia
Prior art keywords
guide
rails
support
guide rail
fixed
Prior art date
Application number
MYPI20034504A
Other languages
English (en)
Inventor
Yatsuharu Yokota
Mitsuo Zen
Original Assignee
Senju Metal Industry Co
Yokota Technica Ltd Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co, Yokota Technica Ltd Company filed Critical Senju Metal Industry Co
Publication of MY131417A publication Critical patent/MY131417A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
MYPI20034504A 2002-11-25 2003-11-21 Solder reflow oven MY131417A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002340376 2002-11-25

Publications (1)

Publication Number Publication Date
MY131417A true MY131417A (en) 2007-08-30

Family

ID=34260204

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20034504A MY131417A (en) 2002-11-25 2003-11-21 Solder reflow oven

Country Status (4)

Country Link
KR (1) KR101020261B1 (ko)
CN (1) CN100407880C (ko)
MY (1) MY131417A (ko)
TW (1) TWI289033B (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7708183B2 (en) * 2008-03-28 2010-05-04 Illinois Tool Works Inc. Reflow solder oven with cooling diffuser
CN101637837B (zh) * 2008-08-01 2012-08-01 威海信诺威电子设备有限公司 热风回流焊接炉
JP5299409B2 (ja) * 2010-11-19 2013-09-25 千住金属工業株式会社 搬送装置
CN102476231B (zh) * 2010-11-26 2013-10-02 深圳市劲拓自动化设备股份有限公司 双导轨式回流焊机
CN102380680A (zh) * 2011-09-23 2012-03-21 皇甫国庆 具有节能及节氮气装置的各种在线式线路板焊炉
JP5459294B2 (ja) * 2011-11-15 2014-04-02 株式会社デンソー リフロー装置
US9781841B2 (en) 2015-03-27 2017-10-03 Det International Holding Limited Soldering apparatus with automatic aligning function
TWI579094B (zh) * 2015-03-27 2017-04-21 泰達國際控股有限公司 可自動對位之焊接設備
MY176685A (en) * 2015-05-25 2020-08-19 Senju Metal Industry Co Soldering apparatus and flux-applying device
KR101922902B1 (ko) * 2017-01-10 2018-11-29 주식회사 티에스엠 회로기판 처짐방지구조를 포함하는 리플로우 납땜장치
CN108672880A (zh) * 2018-08-31 2018-10-19 郑州云海信息技术有限公司 一种回流焊设备
CN116213871B (zh) * 2023-03-03 2023-08-25 北京铁科世纪科技有限公司 一种smt贴片的热风式回流焊装置及其方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0646614Y2 (ja) * 1989-05-22 1994-11-30 株式会社弘輝 リフロー炉における基板の反り補正装置
JP3349222B2 (ja) * 1993-10-06 2002-11-20 古河電気工業株式会社 リフロー炉
JPH0997976A (ja) * 1995-09-30 1997-04-08 Furukawa Electric Co Ltd:The リフロー炉
JPH09199848A (ja) * 1996-01-17 1997-07-31 Sony Corp 回路基板のそりの矯正方法および矯正装置
JPH09214127A (ja) * 1996-01-31 1997-08-15 Furukawa Electric Co Ltd:The リフロー炉
JPH1133653A (ja) 1997-07-22 1999-02-09 Amada Co Ltd ブラシテーブルを備えた板材加工装置の切離し製品排出装置
JP4229580B2 (ja) 2000-09-21 2009-02-25 有限会社ヨコタテクニカ リフロー半田付け装置
JP4559656B2 (ja) 2001-04-03 2010-10-13 株式会社タムラ製作所 搬送装置および加熱装置

Also Published As

Publication number Publication date
KR20040045379A (ko) 2004-06-01
KR101020261B1 (ko) 2011-03-07
CN100407880C (zh) 2008-07-30
TWI289033B (en) 2007-10-21
CN1516543A (zh) 2004-07-28
TW200420213A (en) 2004-10-01

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