TW331536B - The circular-type auto-soldering apparatus - Google Patents

The circular-type auto-soldering apparatus

Info

Publication number
TW331536B
TW331536B TW086103755A TW86103755A TW331536B TW 331536 B TW331536 B TW 331536B TW 086103755 A TW086103755 A TW 086103755A TW 86103755 A TW86103755 A TW 86103755A TW 331536 B TW331536 B TW 331536B
Authority
TW
Taiwan
Prior art keywords
carrier
component
slanted
circular
apparatus body
Prior art date
Application number
TW086103755A
Other languages
Chinese (zh)
Inventor
Hachiji Yokota
Original Assignee
Aideck Technic Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aideck Technic Kk filed Critical Aideck Technic Kk
Application granted granted Critical
Publication of TW331536B publication Critical patent/TW331536B/en

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

A circular-type auto-soldering apparatus, it includes: Transfer mechanism for transferring PCB for mounting electronic devices. As the mechanism transfers PCB, simultaneously, the circular-type soldering apparatus will solder electronic devices on the board inside the heating chamber at high temperature environment. Its features are: Two endless moving components are installed in vertical status at transverse direction. Carriers are arranged between moving components, and use the two side of a moving component to turn around. A pair of guiding rails which move the carriers horizontally. The moving components are installed into slanted-shaped at one end of apparatus body that is the position of to-be-soldered substrate carried on carrier, and at the other end of apparatus body that is the position of unloading the board from carrier. The carrier is installed by keeping a certain interval, and is composed by rolling component rolled on guiding rail at two sides of carrier nearing to move component. The guiding rail is installed along moving component, and at one & the other end of apparatus body, to keep interval D from slanted moving component to arrange it into slanted for supporting carrier in horizontal status.
TW086103755A 1997-01-20 1997-03-25 The circular-type auto-soldering apparatus TW331536B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2104297A JPH10209631A (en) 1997-01-20 1997-01-20 Automatic reflow soldering apparatus

Publications (1)

Publication Number Publication Date
TW331536B true TW331536B (en) 1998-05-11

Family

ID=12043893

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086103755A TW331536B (en) 1997-01-20 1997-03-25 The circular-type auto-soldering apparatus

Country Status (2)

Country Link
JP (1) JPH10209631A (en)
TW (1) TW331536B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100387312B1 (en) * 2001-04-19 2003-06-18 미래산업 주식회사 Print Circuit Board Transferring Apparatus of Reflow System
EP2800462B1 (en) * 2011-12-26 2017-08-16 Yokota Technica Limited Company Heat processing device
CN104889665B (en) * 2015-07-09 2016-05-18 天津七一二通信广播有限公司 A kind of rotatable frock and using method for multiple printed board clamping
KR101698677B1 (en) * 2015-07-27 2017-01-23 주식회사 포스코 Lap joint welding apparatus

Also Published As

Publication number Publication date
JPH10209631A (en) 1998-08-07

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