TW331536B - The circular-type auto-soldering apparatus - Google Patents
The circular-type auto-soldering apparatusInfo
- Publication number
- TW331536B TW331536B TW086103755A TW86103755A TW331536B TW 331536 B TW331536 B TW 331536B TW 086103755 A TW086103755 A TW 086103755A TW 86103755 A TW86103755 A TW 86103755A TW 331536 B TW331536 B TW 331536B
- Authority
- TW
- Taiwan
- Prior art keywords
- carrier
- component
- slanted
- circular
- apparatus body
- Prior art date
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Abstract
A circular-type auto-soldering apparatus, it includes: Transfer mechanism for transferring PCB for mounting electronic devices. As the mechanism transfers PCB, simultaneously, the circular-type soldering apparatus will solder electronic devices on the board inside the heating chamber at high temperature environment. Its features are: Two endless moving components are installed in vertical status at transverse direction. Carriers are arranged between moving components, and use the two side of a moving component to turn around. A pair of guiding rails which move the carriers horizontally. The moving components are installed into slanted-shaped at one end of apparatus body that is the position of to-be-soldered substrate carried on carrier, and at the other end of apparatus body that is the position of unloading the board from carrier. The carrier is installed by keeping a certain interval, and is composed by rolling component rolled on guiding rail at two sides of carrier nearing to move component. The guiding rail is installed along moving component, and at one & the other end of apparatus body, to keep interval D from slanted moving component to arrange it into slanted for supporting carrier in horizontal status.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2104297A JPH10209631A (en) | 1997-01-20 | 1997-01-20 | Automatic reflow soldering apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
TW331536B true TW331536B (en) | 1998-05-11 |
Family
ID=12043893
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086103755A TW331536B (en) | 1997-01-20 | 1997-03-25 | The circular-type auto-soldering apparatus |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH10209631A (en) |
TW (1) | TW331536B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100387312B1 (en) * | 2001-04-19 | 2003-06-18 | 미래산업 주식회사 | Print Circuit Board Transferring Apparatus of Reflow System |
EP2800462B1 (en) * | 2011-12-26 | 2017-08-16 | Yokota Technica Limited Company | Heat processing device |
CN104889665B (en) * | 2015-07-09 | 2016-05-18 | 天津七一二通信广播有限公司 | A kind of rotatable frock and using method for multiple printed board clamping |
KR101698677B1 (en) * | 2015-07-27 | 2017-01-23 | 주식회사 포스코 | Lap joint welding apparatus |
-
1997
- 1997-01-20 JP JP2104297A patent/JPH10209631A/en active Pending
- 1997-03-25 TW TW086103755A patent/TW331536B/en active
Also Published As
Publication number | Publication date |
---|---|
JPH10209631A (en) | 1998-08-07 |
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