JPS55103275A - Soldering device - Google Patents

Abstract

PURPOSE: To make the receiving and delivering of the materials to be soldered smooth by providing a moving detention bar which is protruded between a pair of vertically moving conveying path bodies to an endless turning mechanism.

CONSTITUTION: A substrate being the material to be soldered is held by a carrier and is conveyed by a conveyor 16, so that flux is coated on the soldering surface of its bottom side and is heated. Further it is inserted to the guide rollers of the vertically moving conveying path bodies 2 on both sides from the transfer conveyor 16 and further its trailing end is pushed by the detension bar 47 of an endless turning mechanism 24, thus it moves along with the detention bar 47 and is sent to a forward transfer conveyor 17. At this time, the substrate is lowered and tilted to be contacted to the soldering surface, thence it is put horizontal and its entire bottom side surface is dipped. Thence, it ascends and tilts to be detached from the molten solder surface. Along with the vertical movement of the substrate in this way, the detention bar 47 also follows up and vertically moves similarly by the stationary cam 51 of inverted tropezoidal shape. Hence, the engagement of the detention bar 47 with the carrier for the substrate being the material to be soldered will not come off.

COPYRIGHT: (C)1980,JPO&Japio