JPS5588977A - Soldering device - Google Patents
Soldering deviceInfo
- Publication number
- JPS5588977A JPS5588977A JP16009078A JP16009078A JPS5588977A JP S5588977 A JPS5588977 A JP S5588977A JP 16009078 A JP16009078 A JP 16009078A JP 16009078 A JP16009078 A JP 16009078A JP S5588977 A JPS5588977 A JP S5588977A
- Authority
- JP
- Japan
- Prior art keywords
- motions
- vertical travel
- conveying
- printed substrate
- rails
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To shorten the conveying distance as far as possible, and perform soldering effectively, by transferring the substrate holder on guide rails, and operating the ascending and descending motions of the vertical travel lever and inclining and flat moving motions of the front and rear variable rails by following up mutually.
CONSTITUTION: A vertical travel level 11, and front variable rail 12 and rear variable rail 12' of which inner end part is fitted to this vertical travel lever 11 and outer end part is inclined upwards are disposed on the upper part on the both sides of a solder bath device 10. A conveying substrate holder 7 is transferred on a fixed guide rail 6, and descending and ascending motions of the vertical travel lever 11 and the inclining and flat moving motions of the variable rails 12, 12' are manipulated by following up mutually, so that the vertical motion of the holder 7 is superposed on the conveying speed of the printed substrate. Also, by using device 10 equiped with a dip overflow port bath 28 for forming a solder overflow surface corresponding to the conveying track of the printed substrate, soldering or printed substrate may be preformed effectively.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16009078A JPS5588977A (en) | 1978-12-27 | 1978-12-27 | Soldering device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16009078A JPS5588977A (en) | 1978-12-27 | 1978-12-27 | Soldering device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5588977A true JPS5588977A (en) | 1980-07-05 |
JPS5757879B2 JPS5757879B2 (en) | 1982-12-07 |
Family
ID=15707635
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16009078A Granted JPS5588977A (en) | 1978-12-27 | 1978-12-27 | Soldering device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5588977A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6197359U (en) * | 1984-11-30 | 1986-06-23 | ||
US4776508A (en) * | 1985-06-28 | 1988-10-11 | Unit Design Inc. | Electronic component lead tinning device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0284668U (en) * | 1988-12-20 | 1990-07-02 |
-
1978
- 1978-12-27 JP JP16009078A patent/JPS5588977A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6197359U (en) * | 1984-11-30 | 1986-06-23 | ||
JPH0315255Y2 (en) * | 1984-11-30 | 1991-04-03 | ||
US4776508A (en) * | 1985-06-28 | 1988-10-11 | Unit Design Inc. | Electronic component lead tinning device |
Also Published As
Publication number | Publication date |
---|---|
JPS5757879B2 (en) | 1982-12-07 |
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