CN101653848A - Circuit board introducing device of solder-reflow furnace - Google Patents
Circuit board introducing device of solder-reflow furnace Download PDFInfo
- Publication number
- CN101653848A CN101653848A CN200910115690A CN200910115690A CN101653848A CN 101653848 A CN101653848 A CN 101653848A CN 200910115690 A CN200910115690 A CN 200910115690A CN 200910115690 A CN200910115690 A CN 200910115690A CN 101653848 A CN101653848 A CN 101653848A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- reflow soldering
- block
- introducing device
- guide pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a circuit board introducing device of a solder-reflow furnace comprising a fixed guide rail (2) fixed to a furnace body brackets (1) at two ends. A conveying chain (3) is arranged in an extending section at the inner side of the fixed guide rail (2). The circuit board introducing device of the solder-reflow furnace is characterized in that an introducing block (4) is arranged at the front end of the conveying chain (3) at the entry of the solder-reflow furnace and provided with a horizontal guide block (41) approaching the upper end of the conveying chain (3). The device is applied to the front end of the conveying chain of the solder-reflow furnace, greatly improves the conveying stability of printed circuit boards and reduces the phenomena of dropping, clamping and climbing of the circuit boards.
Description
Technical field
The invention belongs to the circuit board transfer designs technical field of reflow soldering, be specifically related to a kind of circuit board introducing device that prevents to climb the reflow soldering of plate and board falling.
Background technology
The solder technology that surface mounting technology was widely adopted in recent years is not difficult to find the electronic product that uses surface mounting technology in daily life.As the mobile phone of frequent use, notebook computer, calculator, beepers etc. all can not leave surface mounting technology.Surface mounting technology has the advantage that traditional plug-in mounting technology can not be compared: microminiaturization: traditional punch block, its volume can't dwindle again.And the surface mount assembly, its volume and punch block have relatively dwindled manyfold greatly, make electronic product, more are tending towards microminiaturized.On a large scale, high integrated electronics: currently used extensive, high integrated IC, the pin position that it is external, hundreds of easily.As adopt the punch block mode to make, and not only increase its volume, also be difficult to be installed in printed circuit board (PCB).Automation: the surface mounting technology assembly, its shape is nothing more than square.This kind shape helps automated production.Because of automated production equipment, be easier to this kind assembly be mentioned and put.As for putting this kind assembly on printed circuit board (PCB), more easier than punch block.
Surface installation technique (SMT) can be divided into two types of Reflow Soldering and wave-solderings according to welding manner.General surface mount elements all adopts Reflow Soldering to mount.At first, utilize printing machine to scrape solder(ing) paste at the pad on the printed circuit board (PCB); Then, with chip mounter surface mount elements is pressed on the corresponding welding position of printed circuit board (PCB) and fit with solder(ing) paste; At last, the printed circuit board (PCB) that posts element being sent into reflow soldering welds.Reflow soldering adopts the internal-circulation type heating system of a plurality of temperature provinces, because solder(ing) paste adopts multiple alloy material to constitute, different temperatures and time can cause the different variations of tin cream state.Solder(ing) paste is fused into liquid state in the high-temperature region, and surface mount elements is easy and solder(ing) paste is combined; After entering the cooling zone, solder(ing) paste is frozen into solid-state, and the pin and the printed circuit board (PCB) of surface mount elements is integrally welded firmly.For satisfying the requirement of leadless process, guarantee high-quality welding quality, reflow soldering also adopts nitrogen as the protection raw material.
The transmission system of reflow soldering comprises fixed guide and is arranged on the fixed guide inboard carries out the carrier chain that circuit board is carried.Chain runs through each temperature province of reflow soldering, and the heating of printed circuit board (PCB), welding, the whole process of cooling all are to carry out on chain.Yet, find in the prior art, when circuit board is led carrier chain by the reflow soldering inlet, be easy to generate situations such as climbing plate, board falling.Study climbing situations such as plate, board falling in the prior art, collateral security guide rail depth of parallelism equal angles is set about, though reduced the generation of situations such as board falling, clamp to a certain extent, the situation of climbing plate, board falling when circuit board enters does not still have much improvement.The present invention comes therefrom.
Summary of the invention
The object of the invention is to provide a kind of circuit board introducing device of reflow soldering, has solved in the prior art to be easy to generate circuit board when the reflow soldering circuit board is carried and imported and to climb problems such as plate, board falling and clamp.
In order to solve these problems of the prior art, technical scheme provided by the invention is:
A kind of circuit board introducing device of reflow soldering, described reflow soldering comprises the fixed guide that is fixed on the furnace body support of two ends, described fixed guide is provided with carrier chain in the inboard extension, the carrier chain front end that it is characterized in that described reflow soldering inlet is provided with the importing block, and described importing block has the guide pad near carrier chain upper end level.
The present invention also provides a kind of circuit board introducing device of preferred reflow soldering, and the guide pad lower surface of described importing block is a cambered surface, and described cambered surface cooperates with the carrier chain upper surface of reflow soldering inlet.
Preferably, described importing block radially is fixed on the furnace body support, and described importing block rear end is provided with the extension, and described extension cooperates spacing carrier chain to import with fixed guide, guarantees that carrier chain steadily imports burner hearth, prevents to climb the generation of plate phenomenon.
Preferably, the guide pad of the described importing block outside is a limited block, and described limited block upper surface is higher than guide pad upper surface level.
Preferably, described importing block is radially fixing by bolt and furnace body support.
Preferably, the lower surface of described limited block is a cambered surface, and the upper end that described carrier chain is had strong market potential cooperates slip with the lower surface of limited block and guide pad.
Preferably, the sprocket of described carrier chain external toothing power set transmission.
Preferably, described guide pad comprises the horizontal segment that the spigot surface that is tilted to and spigot surface rear end are provided with; Described spigot surface upper surface is to have the upwards inclined-plane of slight inclination.
Preferably, the entering plate bore of described guide pad spigot surface successively decreases, and the entering plate bore of described horizontal segment is certain, and the entering plate bore of spigot surface is greater than the entering plate bore of horizontal segment.
The importing block that adopts among the present invention is the aluminium block of special shape, utilizes accurately processing to guarantee that the aluminium block spacing on two fixed guides is certain, make that circuit board can be suitable between two aluminium blocks; The limited block lengthening that imports baffle plate can effectively prevent to climb the generation of plate phenomenon.Utilize this importing block to import the circuit board stable performance, installing/dismounting is convenient rapidly.
The entering plate bore that imports block in the technical solution of the present invention is the guide pad upper surface spacing that is fixed on the importing block on the fixed guide, this spacing is that spigot surface is diminishing in the optimal technical scheme, and horizontal segment is a stable homogeneous, thereby has guaranteed the importing position of circuit board.The present invention preferably imports the upper end level of the upper end level of block guide pad a little less than carrier chain, when circuit board enters carrier chain by the horizontal segment of guide pad, transmits more stable.
Than solution of the prior art, advantage of the present invention is:
1. by carrier chain front end the importing block is set in the technical solution of the present invention, leads into printed circuit board (PCB), reduce board falling, the clamp of printed circuit board (PCB) or climb the plate phenomenon producing by the guide pad that imports block at reflow soldering body of heater inlet.The preferred guide pad that imports block comprises the horizontal segment that has acclivitous spigot surface and have the horizontal upper end face, when the circuit board of not welding enters reflow soldering, printed circuit board (PCB) helps circuit board and enters burner hearth smoothly by the gradient of the spigot surface of guide pad.Reduce the board falling that enters before the carrier chain stroke like this, climbed plate and clamp situation.
2. import block in the preferred technical solution of the present invention and adopt the lightweight aluminium block, the guide pad arranged outside limited block of described importing block, because guide pad upper surface level is lower than the limited block level, when printed circuit board (PCB) enters reflow soldering, limited block limits moving radially of printed circuit board (PCB), thereby guarantee that printed circuit board (PCB) enters the rational position of carrier chain, reduce the possibility of circuit board board falling, clamp.In addition, with the entering plate bore that the spigot surface of guide pad is designed to successively decrease, horizontal segment is designed to unified entering plate bore, because the spigot surface entering plate bore of guide pad is greater than the entering plate bore of horizontal segment, make things convenient for circuit board to enter into horizontal segment, and can carry out displacement adjustment radially through spigot surface.
3. the rear end that imports block described in the preferred technical solution of the present invention is provided with the extension, spacing by extension and fixed guide, and the limit transport chain is radially mobile, makes the burner hearth that enters that circuit board can horizontal stable, effectively prevents to climb the plate situation.The lower surface of described importing block is a cambered surface, and described cambered surface can cooperate slip with the carrier chain upper surface of having strong market potential.Owing to import block for radially being fixed on the furnace body support, by fixedly connected modes such as bolt or screws, the importing block does not produce mobile when moving in system, need not when circuit board enters body of heater to adjust importing block.Unload and get final product when importing the securing member that only needs to be fixed on when block damages on the furnace body support.
In sum, the circuit board introducing device of reflow soldering of the present invention is to be arranged on the preceding importing block that is used with carrier chain of carrier chain, by importing the radially guide effect of limit circuit plate and guide pad of block limited block, significantly reduced the board falling that produces when printed circuit board (PCB) enters body of heater, climbing phenomenon such as plate; Be spigot surface and horizontal segment by the shaping-orientation piece in addition, and the two limited block spacings that import blocks are dwindled the stability when improving circuit board and entering gradually with inclined-plane.
Description of drawings
Below in conjunction with drawings and Examples the present invention is further described:
Fig. 1 is the circuit board introducing device structural representation of embodiment of the invention reflow soldering;
Fig. 2 imports the stereogram of block for the embodiment of the invention;
Fig. 3 is the vertical view of Fig. 2;
Fig. 4 is the front view of Fig. 2;
Fig. 5 is the right view of Fig. 2.
Wherein: 1 is furnace body support, and 2 is fixed guide, and 3 is carrier chain, and 4 for importing block; 41 is guide pad; 42 is the extension, and 43 is limited block; 411 is the guide pad spigot surface, and 412 is the guide pad horizontal segment.
The specific embodiment
Below in conjunction with specific embodiment such scheme is described further.Should be understood that these embodiment are used to the present invention is described and are not limited to limit the scope of the invention.The implementation condition that adopts among the embodiment can be done further adjustment according to the condition of concrete producer, and not marked implementation condition is generally the condition in the normal experiment.
Embodiment such as Fig. 1～5, the circuit board introducing device of this reflow soldering, described reflow soldering comprises the fixed guide 2 that is fixed on the two ends furnace body support 1, described fixed guide is provided with carrier chain 3 in the 2 inboard extensions, the sprocket of described carrier chain external toothing power set transmission, carrier chain 3 front ends of described reflow soldering inlet are provided with and import block 4, and described importing block has the guide pad 41 near carrier chain upper end level.
This importing block comprises guide pad 41 and is in the limited block 43 in the guide pad outside that described limited block rear end is provided with extension 43; Guide pad 41 lower surfaces of described importing block are cambered surface, and described cambered surface cooperates with the carrier chain upper surface of reflow soldering inlet.Described importing block radially is fixed on the furnace body support 1, and described importing block rear end is provided with extension 42, and described extension cooperates limit guide rail to move axially with fixed guide 2.
Circuit board during body of heater, owing to designed the importing block, imports circuit board by the guide pad that imports block in input, and the position by the effective correcting circuit plate of limited block, has prevented that effectively circuit board from climbing plate, clamp and board falling phenomenon.
Above-mentioned example only is explanation technical conceive of the present invention and characteristics, and its purpose is to allow the people who is familiar with this technology can understand content of the present invention and enforcement according to this, can not limit protection scope of the present invention with this.All spirit essence is done according to the present invention equivalent transformation or modification all should be encompassed within protection scope of the present invention.
Claims (9)
1. the circuit board introducing device of a reflow soldering, described reflow soldering comprises the fixed guide (2) that is fixed on the two ends furnace body support (1), described fixed guide (2) is provided with carrier chain (3) in the inboard extension, carrier chain (3) front end that it is characterized in that described reflow soldering inlet is provided with importing block (4), and described importing block has the guide pad (41) near carrier chain upper end level.
2, the circuit board introducing device of reflow soldering according to claim 1 is characterized in that guide pad (41) lower surface of described importing block is a cambered surface, and described cambered surface cooperates with the carrier chain upper surface of reflow soldering inlet.
3, the circuit board introducing device of reflow soldering according to claim 1, it is characterized in that described importing block radially is fixed on the furnace body support (1), described importing block rear end is provided with extension (42), and described extension cooperates spacing carrier chain to import with fixed guide (2).
4, the circuit board introducing device of reflow soldering according to claim 1 is characterized in that guide pad (41) outside of described importing block is limited block (43), and described limited block upper surface is higher than guide pad (41) upper surface level.
5, the circuit board introducing device of reflow soldering according to claim 1 is characterized in that described importing block is radially fixing by bolt and furnace body support (1).
6, the circuit board introducing device of reflow soldering according to claim 1, the lower surface that it is characterized in that described limited block is a cambered surface, the upper end that described carrier chain is had strong market potential cooperates slip with the lower surface of limited block and guide pad.
7, the circuit board introducing device of reflow soldering according to claim 1 is characterized in that the sprocket of described carrier chain external toothing power set transmission.
8, the circuit board introducing device of reflow soldering according to claim 1 is characterized in that described guide pad (41) comprises the horizontal segment (412) that the spigot surface (411) that is tilted to and spigot surface rear end are provided with; Described spigot surface upper surface is to have the upwards inclined-plane of slight inclination.
9, the circuit board introducing device of reflow soldering according to claim 1, the entering plate bore that it is characterized in that described guide pad (41) spigot surface (411) successively decreases, the entering plate bore of described horizontal segment (412) is certain, and the entering plate bore of spigot surface is greater than the entering plate bore of horizontal segment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910115690A CN101653848A (en) | 2009-07-09 | 2009-07-09 | Circuit board introducing device of solder-reflow furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910115690A CN101653848A (en) | 2009-07-09 | 2009-07-09 | Circuit board introducing device of solder-reflow furnace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101653848A true CN101653848A (en) | 2010-02-24 |
Family
ID=41708415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910115690A Pending CN101653848A (en) | 2009-07-09 | 2009-07-09 | Circuit board introducing device of solder-reflow furnace |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101653848A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103394788A (en) * | 2013-07-31 | 2013-11-20 | 昆山元崧电子科技有限公司 | Reflow oven guiding device |
| CN105346922A (en) * | 2015-11-27 | 2016-02-24 | 苏州康贝尔电子设备有限公司 | Single-track conveyor |
-
2009
- 2009-07-09 CN CN200910115690A patent/CN101653848A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103394788A (en) * | 2013-07-31 | 2013-11-20 | 昆山元崧电子科技有限公司 | Reflow oven guiding device |
| CN105346922A (en) * | 2015-11-27 | 2016-02-24 | 苏州康贝尔电子设备有限公司 | Single-track conveyor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102689071B (en) | Reflow soldering equipment | |
| WO2004047225A3 (en) | Compact fluid cooled power converter supporting multiple circuit boards | |
| CN201509363U (en) | Metal base plate assembled with a printed circuit board | |
| CN101653848A (en) | Circuit board introducing device of solder-reflow furnace | |
| CN104202916B (en) | Conveying mechanism of chip mounting machine | |
| CN201509373U (en) | Reflux brazier circuit board guiding device | |
| CN101648304A (en) | Return air device for reflow soldering | |
| WO2007023030A3 (en) | Method for soldering smd components, printed circuit board and reflow soldering furnace therefor | |
| CN110677988A (en) | Prevent circuit board in pad stifled hole | |
| CN109588038A (en) | The attaching method of circuit board | |
| CN210080900U (en) | Tin stove tool is crossed to printed wiring board | |
| CN210725493U (en) | Prevent circuit board in pad stifled hole | |
| CN203801158U (en) | Pcb carrier | |
| CN202652730U (en) | Carrier for mounting and reflow of chip surface | |
| CN201471032U (en) | Conveying guide rail of reflow oven | |
| CN204069508U (en) | A kind of PCB pallet | |
| CN201913346U (en) | Welding fixture of USB connector | |
| CN203734931U (en) | Tool specially used for SMT | |
| CN208480080U (en) | Pcb board production line | |
| CN201201087Y (en) | Infrared ray heat energy compensating mechanism of reflow machine | |
| CN101612686B (en) | Hidden central support system of reflow oven | |
| CN112788863A (en) | Double-side welding device and process for simultaneously welding Chip elements on two sides of PCB | |
| CN102137549B (en) | Electronic component layout method of circuit board with adhesive surfaces on both sides | |
| CN102223768B (en) | Multiple-photoelectric thin board spliced yin and yang jig | |
| CN109195356A (en) | A kind of Through-hole reflow used for printed circuit board connects technique |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100224 |