CN103394788A - Reflow oven guiding device - Google Patents
Reflow oven guiding device Download PDFInfo
- Publication number
- CN103394788A CN103394788A CN2013103277948A CN201310327794A CN103394788A CN 103394788 A CN103394788 A CN 103394788A CN 2013103277948 A CN2013103277948 A CN 2013103277948A CN 201310327794 A CN201310327794 A CN 201310327794A CN 103394788 A CN103394788 A CN 103394788A
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- CN
- China
- Prior art keywords
- guide rail
- guide
- guide pad
- reflow stove
- guide block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses a reflow oven guiding device which comprises a first guide rail, a second guide rail and a guide block, wherein the guide block is arranged between the first guide rail and the second guide rail, and the first guide rail, the second guide rail and the guide block are in the same straight line. The guide block is composed of a guide portion and a fixed portion, wherein the guide portion and the fixed portion are once formed, the guide portion is in a rectangular shape and is kept horizontal with the first guide rail and the second guide rail, and the fixed portion is perpendicular to the guide portion. Positioning holes are formed in the fixed portion, a positioning shaft penetrates through the positioning holes to enable the guide block to be fixed, and a groove is formed in one side of the guide block in the horizontal direction. Due to the fact that the guide block is additionally arranged, a board card is made to be smoothly transmitted into a reflow oven on the rails, and a board card inside the oven is made to be smoothly and stably transmitted to the rails.
Description
Technical field
The present invention relates to the electronic devices and components processing technique field, relate in particular to a kind of reflow stove guider.
Background technology
The reflow stove is a kind of equipment commonly used in the process of electronics integrated circuit board processing, integrated circuit board after integrated circuit board to be processed and processing often need to carry out transmission back by track, yet because present track smoothness in the process of transmission is inadequate, the phenomenon of clamp appears in the process of transmission easily.
Summary of the invention
The invention provides a kind of reflow stove guider, by install guide pad additional between transporting rail, make and transmit steady and smooth more, greatly reduced clamp on-the-spot.
Technical problem to be solved by this invention is achieved through the following technical solutions:
Comprise the first guide rail, the second guide rail, guide pad, described guide pad is arranged between the first guide rail and the second guide rail, and the three is on same straight line.
Preferably, described guide pad is comprised of integrated targeting part and standing part, and targeting part is cuboid, with the first guide rail and the second guide rail, keeps level, and standing part is vertical with targeting part.
Preferably, described standing part is provided with locating hole, has locating shaft to pass in locating hole guide pad is fixed.
Preferably, described guide pad has groove on the horizontal direction of a side.
Preferably, described recess width is 6mm, groove depth 2.5mm.
Preferably, described guide pad adopts aluminum alloy material.
The beneficial effect that the present invention reaches is: by installing guide pad additional, make integrated circuit board from be transferred to smoothly in the reflow stove on track and in stove integrated circuit board be transferred on track stably smoothly.
Description of drawings
Fig. 1 is a kind of reflow stove of the present invention guider structural representation perspective view.
The specific embodiment
, in order to further describe technical characterstic of the present invention and effect, below in conjunction with the drawings and specific embodiments, the present invention is described further.
With reference to Fig. 1, a kind of reflow stove guider, comprise the first guide rail 1, the second guide rail 2, guide pad 3, and described guide pad 3 is arranged between the first guide rail 1 and the second guide rail 2, and the three is on same straight line.in order to make Stability Analysis of Structures, guide pad 3 is comprised of with standing part 32 integrated targeting part 31, in order to make the integrated circuit board transmission in orbit that will process more steady, can be excessive stably between the first guide rail 1 and the second guide rail 2, targeting part 31 is designed to rectangle, must remain on a horizontal plane with the first guide rail and the second guide rail, standing part 32 is perpendicular with targeting part, have locating hole on standing part 32, pass wherein that whole guide pad 3 is fixing by locating shaft 33, also have groove 34 on a side horizontal direction of guide pad 3, recess width is 6mm, groove depth is 2.5mm.
Above-described embodiment does not limit the present invention in any form, all take to be equal to replace or technical scheme that the form of equivalent transformation obtains, within all dropping on protection scope of the present invention.
Claims (6)
1. reflow stove guider, it is characterized in that: comprise the first guide rail, the second guide rail, guide pad, described guide pad is arranged between the first guide rail and the second guide rail, and the three is on same straight line.
2. a kind of reflow stove guider according to claim 1, it is characterized in that: described guide pad is comprised of integrated targeting part and standing part, targeting part is cuboid, with the first guide rail and the second guide rail, keeps level, and standing part is vertical with targeting part.
3. a kind of reflow stove guider according to claim 2, it is characterized in that: described standing part is provided with locating hole, has locating shaft to pass in locating hole guide pad is fixed.
4. a kind of reflow stove guider according to claim 1, it is characterized in that: described guide pad has groove on the horizontal direction of a side.
5. a kind of reflow stove guider according to claim 1, it is characterized in that: described recess width is 6mm, groove depth 2.5mm.
6. a kind of reflow stove guider according to claim 1, is characterized in that: described guide pad employing aluminum alloy material material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013103277948A CN103394788A (en) | 2013-07-31 | 2013-07-31 | Reflow oven guiding device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013103277948A CN103394788A (en) | 2013-07-31 | 2013-07-31 | Reflow oven guiding device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103394788A true CN103394788A (en) | 2013-11-20 |
Family
ID=49558612
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2013103277948A Pending CN103394788A (en) | 2013-07-31 | 2013-07-31 | Reflow oven guiding device |
Country Status (1)
Country | Link |
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CN (1) | CN103394788A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104159412A (en) * | 2014-08-27 | 2014-11-19 | 昆山元崧电子科技有限公司 | Reflow oven enabling boards to be transferred smoothly |
CN105357945A (en) * | 2015-11-30 | 2016-02-24 | 苏州康贝尔电子设备有限公司 | Guide block of board conveying machine |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10150264A (en) * | 1996-11-19 | 1998-06-02 | Nihon Dennetsu Keiki Co Ltd | Transfer device of reflow soldering device |
JPH1140941A (en) * | 1997-07-15 | 1999-02-12 | Matsushita Electric Ind Co Ltd | Method and apparatus for transferring reflow board |
US5922230A (en) * | 1996-03-08 | 1999-07-13 | Eightech Tectron Co., Ltd. | Automatic reflow soldering apparatus |
CN201201096Y (en) * | 2008-04-25 | 2009-03-04 | 东莞市健时自动化设备有限公司 | Plate importing apparatus of reflow machine |
CN101637837A (en) * | 2008-08-01 | 2010-02-03 | 威海信诺威电子设备有限公司 | Hot air reflow soldering furnace |
CN101653848A (en) * | 2009-07-09 | 2010-02-24 | 维多利绍德机械科技(苏州)有限公司 | Circuit board introducing device of solder-reflow furnace |
CN201455488U (en) * | 2009-05-14 | 2010-05-12 | 深圳市东野自动化设备有限公司 | Reflow-soldering telescopic guide rail structure |
CN203578977U (en) * | 2013-07-31 | 2014-05-07 | 昆山元崧电子科技有限公司 | Guide device of reflow oven |
-
2013
- 2013-07-31 CN CN2013103277948A patent/CN103394788A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5922230A (en) * | 1996-03-08 | 1999-07-13 | Eightech Tectron Co., Ltd. | Automatic reflow soldering apparatus |
JPH10150264A (en) * | 1996-11-19 | 1998-06-02 | Nihon Dennetsu Keiki Co Ltd | Transfer device of reflow soldering device |
JPH1140941A (en) * | 1997-07-15 | 1999-02-12 | Matsushita Electric Ind Co Ltd | Method and apparatus for transferring reflow board |
CN201201096Y (en) * | 2008-04-25 | 2009-03-04 | 东莞市健时自动化设备有限公司 | Plate importing apparatus of reflow machine |
CN101637837A (en) * | 2008-08-01 | 2010-02-03 | 威海信诺威电子设备有限公司 | Hot air reflow soldering furnace |
CN201455488U (en) * | 2009-05-14 | 2010-05-12 | 深圳市东野自动化设备有限公司 | Reflow-soldering telescopic guide rail structure |
CN101653848A (en) * | 2009-07-09 | 2010-02-24 | 维多利绍德机械科技(苏州)有限公司 | Circuit board introducing device of solder-reflow furnace |
CN203578977U (en) * | 2013-07-31 | 2014-05-07 | 昆山元崧电子科技有限公司 | Guide device of reflow oven |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104159412A (en) * | 2014-08-27 | 2014-11-19 | 昆山元崧电子科技有限公司 | Reflow oven enabling boards to be transferred smoothly |
CN105357945A (en) * | 2015-11-30 | 2016-02-24 | 苏州康贝尔电子设备有限公司 | Guide block of board conveying machine |
CN105357945B (en) * | 2015-11-30 | 2018-03-27 | 苏州康贝尔电子设备有限公司 | One kind send trigger guide pad |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20160914 |
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C20 | Patent right or utility model deemed to be abandoned or is abandoned |