JPH10150264A - Transfer device of reflow soldering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a plate-like work to be held rightly when it is transferred from the transfer device of a preceding process to the transfer device of a reflow soldering device in a following process. SOLUTION: A transfer device has such a machines that a printed wiring board 1 is placed putting its side edges 1a on the pins 16 of two parallel chain conveyers 15 and introduced into an oven, wherein guide plates 17 which control the printed board 1 placed on the pins 16 in mounting position ion the widthwise direction of the board 1 whose width is presented by W3 are provided, furthermore inlet guides 31 arranged apart from each other by a length W2 are provided by the side of the peripheral parts 17b of the guide plates 17 at the loading inlet 19 of the chain conveyers 19, wherein W2 is smaller than a mounting position control width W1 specified by the guide surfaces 17a of the guide plates 17.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer apparatus in a reflow soldering apparatus for transferring both ends of a plate-like work on pins of a two-row chain conveyor and transferring the work inside a furnace.

[0002]

2. Description of the Related Art When a plate-like workpiece is processed by a plurality of apparatuses to perform a desired processing, it is necessary to transfer the apparatus from an apparatus in a previous process to an apparatus in a subsequent process. In this case, as a plate-like work, for example, electronic components are mounted on a printed wiring board coated with cream solder by a mounting device in a previous process, and then the printed wiring board is soldered by a reflow soldering device in a subsequent process.

FIG. 3 is a view showing a conventional transfer apparatus used in a reflow soldering apparatus. FIG. 3 (a) is a side sectional view of the reflow soldering apparatus, and FIG. 3 (b) is FIG.
It is sectional drawing by the II line of (a).

That is, a furnace body 12 provided with a heating device 13
A reflow soldering apparatus 11 is provided in which a printed wiring board 1 is mounted and circulated, and the printed wiring board 1 is mounted on the transported apparatus 14 and then transported in the direction of arrow A to perform reflow soldering.

In the case of a reflow soldering apparatus 11 as shown in FIG. 3, it is necessary to carry the printed wiring board 1 with the surface thereof open, so that the transporting apparatus 14 for carrying the printed wiring board 1 is a parallel 2 A chain conveyor 15 is used, and both ends 1a of the printed wiring board 1 are placed on the pins 16 and transported.

The pin 1 of the chain conveyor 15
6 is a guide plate 1 that regulates and stabilizes the placement position of the placed printed wiring board 1, that is, the position in the lateral direction (the width direction of the printed wiring board 1) as viewed from the side of the entrance 19.
7 is provided. 18 is the chain conveyor 1
Reference numeral 5 denotes a sprocket, reference numeral 20 denotes a carry-out port, reference numeral 21 denotes a conveyor frame forming the transfer device 14, and reference numeral 22 denotes a chain guide of a chain conveyor 15 formed on the conveyor frame 21.

[0007]

However, when the printed wiring board 1 is transferred from the transfer device of the preceding process to the transfer device 14 of the reflow soldering device 11 of the post-process, the transfer device of the reflow soldering device 11 is used. The guide plate 17 of the chain conveyor 15 included in the printer 14 may lift the side end 1a of the printed wiring board 1 and may be conveyed in a state shown by a broken line in FIG. 3B. In some cases, the printed wiring board 1 may fall off from the transfer device 14 in some cases.

[0008] Dropping of the printed wiring board 1 in the furnace body 12 of the reflow soldering apparatus 11 is an item that must be avoided since the printed wiring board 1 is overheated and cannot be used. . If the printed wiring board 1 is not transported in a correct posture, heating at an appropriate temperature will not be performed, and the soldering quality will be significantly reduced.

It is an object of the present invention to ensure that when a plate-shaped work is transferred from a transfer device in a previous process to a transfer device of a reflow soldering device in a post-process, the plate-shaped work is correctly held and transferred. Accordingly, it is an object of the present invention to realize a safe and highly reliable transporting device so that stable and high-quality reflow soldering can be performed.

[0010]

A restriction width smaller than the width regulated by the guide plate is provided at a carry-in portion of a parallel two-row chain conveyor having a guide plate on a pin for placing and holding a plate-like work. Is provided on the outer peripheral side along the traveling path of the guide plate.

Accordingly, the plate-like work carried into the transfer device is guided by the entrance guide, placed on the pins of the chain conveyor, and is not scraped up on the guide plate of the chain conveyor.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention can be implemented in the following modes.

In other words, the present invention relates to a transfer device in a reflow soldering device for placing a side end of a plate-like work on pins of two parallel chain conveyors circulating and transporting the work inside a furnace. A guide plate that regulates a placement position in the width direction of the plate-shaped work placed on the pin; and a loading position regulation width narrower than the guide plate at the entrance of the chain conveyor. An inlet guide is provided along the traveling path of the guide plate on the outer peripheral side thereof.

As a result, when viewed from the entrance side, the entrance guide guides so as to cover the guide plate of the chain conveyor. It is placed and transported.

[0015]

Next, specific examples of the soldering apparatus according to the present invention will be described with reference to examples.

FIG. 1 shows an embodiment of the present invention.
FIG. 1A is a diagram showing a transfer device used in a reflow soldering apparatus, and FIG. 1A is a side view of a carry-in portion of the transfer device;
FIG. 2B is a sectional view taken along line II-II in FIG. FIG. 1A is an enlarged view of only a portion corresponding to the carry-in port 19 in FIG. FIG. 2 is a perspective view showing the shapes of the chain conveyor 15 and the entrance guide 31 on the right side of the carry-in entrance 19 in FIG.

That is, the entrance guide 31 is provided at the portion of the carry-in entrance 19 where the chain conveyor 15 travels while being turned back by the sprocket 18.
The one guide surface 31a is configured to be located inside the guide surface 17a of the guide plate 17 provided on the chain conveyor 15. That, W is the inlet guide width W ₂ by the guide width W ₁ and the inlet guide 31 between the guide surface 17a by the guide plate 17 of the chain conveyor 15
It is set to _1> W ₂ of the relationship.

The lower inner peripheral surface 3 of the entrance guide 31
1b is provided along an outer peripheral portion of the chain conveyor 15 where the chain conveyor 15 is turned around by the sprocket 18 at the carry-in entrance 19, that is, along an outer peripheral portion 17b of a road on which the guide plate 17 runs. Therefore, when viewed from the entrance 19 side, FIG.
As shown by the two-dot chain line in (b), the guide plate 17 of the chain conveyor 15 is covered by the entrance guide 31.

As a result, the plate-like work carried in from the carry-in entrance 19, for example, the printed wiring board 1, has its side end 1a.
While being guided by the entrance guide 31
And is conveyed as it is. That is, when being carried in from the carry-in entrance 19, the entrance guide 3
1. The position in the width direction is regulated by 1 and placed on the pins 16 of the chain conveyor 15. Thereafter, the position in the width direction is regulated by the guide plate 17 of the chain conveyor 15 and placed on the pins 16 and conveyed. You. Therefore, the printed wiring board 1 is transferred to the transfer device 14 of the reflow soldering device 11.
Guide plate 1 of the chain conveyor 15
7 and do not fall off after being scraped.

Here, assuming that the width of the printed wiring board 1 is W ₃ , the guide width W ₁ is usually set to a value of about W ₁ = W ₃ +1 mm in consideration of thermal expansion due to heating of the printed wiring board 1. Therefore, the width W ₂ of the entrance guide 31 is W ₂ = W ₃ +
It may be set to a value of about 0.4 to 0.5 mm.

The receiving portion 32 provided on the entrance guide 31
Is a portion for receiving when the front end of the printed wiring board 1 is lowered by its own weight, though slightly.

[0022]

As described above, according to the present invention, when a plate-shaped work is transferred from a transfer device in a previous process to a transfer device of a reflow soldering device in a post-process, the plate-shaped work can be safely placed. It can be placed and held in a correct posture and transported, and dropping from the transport device can be eliminated. Therefore, stable high-quality reflow soldering can be performed by realizing highly reliable transport.

[Brief description of the drawings]

FIGS. 1A and 1B show an embodiment of the present invention, wherein FIG. 1A is a side view of a carry-in portion of a transfer device, and FIG.
It is sectional drawing by the II-II line of (a).

FIG. 2 is a perspective view showing the shapes of a chain conveyor and an entrance guide on the right side of a carry-in entrance shown in FIG. 1;

3A and 3B are views showing a conventional transfer device used in the reflow soldering apparatus, wherein FIG. 3A is a side sectional view of the reflow soldering apparatus, and FIG. It is sectional drawing by the I line.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 printed wiring board 1a side end 11 reflow soldering device 14 transfer device 15 chain conveyor 16 pin 17 guide plate 17a guide surface 17b outer peripheral portion 19 carry-in entrance 31 entrance guide 31a guide surface 31b lower inner peripheral surface 32 receiving portion

Claims (1)

[Claims] 1. A transfer device in a reflow soldering device for mounting a side end of a plate-shaped work on pins of a parallel two-chain chain conveyor that circulates and transports the work inside a furnace. A guide plate that regulates a placement position in a width direction of the plate-like work placed on the pin; and a loading position regulation width narrower than the guide plate in the carry-in portion of the chain conveyor. A conveying device in a reflow soldering apparatus, wherein an entrance guide is provided along the traveling path of the guide plate on an outer peripheral side thereof.