CN104159412A - Reflow oven enabling boards to be transferred smoothly - Google Patents

Reflow oven enabling boards to be transferred smoothly Download PDF

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Publication number
CN104159412A
CN104159412A CN201410424539.XA CN201410424539A CN104159412A CN 104159412 A CN104159412 A CN 104159412A CN 201410424539 A CN201410424539 A CN 201410424539A CN 104159412 A CN104159412 A CN 104159412A
Authority
CN
China
Prior art keywords
guide pad
mentioned
reflow stove
smoothly
transmits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410424539.XA
Other languages
Chinese (zh)
Inventor
钱忠华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN YUANSONG ELECTRONIC SCIENCE AND TECHNOLOGY Co Ltd
Original Assignee
KUNSHAN YUANSONG ELECTRONIC SCIENCE AND TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUNSHAN YUANSONG ELECTRONIC SCIENCE AND TECHNOLOGY Co Ltd filed Critical KUNSHAN YUANSONG ELECTRONIC SCIENCE AND TECHNOLOGY Co Ltd
Priority to CN201410424539.XA priority Critical patent/CN104159412A/en
Publication of CN104159412A publication Critical patent/CN104159412A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a reflow oven enabling boards to be transferred smoothly. The reflow oven comprises an oven body, a transferring assembly and guide blocks, wherein the transferring assembly is used for transferring the boards, and the guide blocks are arranged at the inlet and the outlet of the oven body and used for limiting the transferring assembly. The gap between the transferring assembly and the reflow oven can be shortened, the boards are guided to be moved to the transferring assembly smoothly, the phenomenon of board clamping is avoided, and stable operation of the reflow oven is guaranteed.

Description

Board transmits reflow stove smoothly
Technical field
A kind of reflow stove, particularly a kind of board transmit reflow stove smoothly.
Background technology
In prior art there is larger gap in transmission assembly and reflow stove, and clamp has some setbacks the phenomenons such as board can occur in the transmitting procedure of transmission assembly, makes the reflow stove cannot stable operation, and prior art is unresolved this problem also.
Summary of the invention
For solving the deficiencies in the prior art, the object of the present invention is to provide a kind of gap that can dwindle between transmission assembly and reflow stove, guiding clamp is mobile smoothly avoids occurring the phenomenon of board on transmission assembly, guarantees the stable operation of reflow stove.
In order to realize above-mentioned target, the present invention adopts following technical scheme:
Board transmits reflow stove smoothly, comprising: body of heater, for transmitting the transfer assembly of board, is placed in the entrance of body of heater and the guide pad of exit spacing transfer assembly.
Aforesaid board transmits reflow stove smoothly, and transfer assembly composition has: be fixed on the driving member of body of heater, the transmission parts moving between driving member and guide pad.
Aforesaid board transmits reflow stove smoothly, and driving member is drive, and transmission parts is chain.
Aforesaid board transmits reflow stove smoothly, and guide pad composition has: guide pad body, be placed in the stopper slot on guide pad body, and drive and chain are connected in stopper slot.
Aforesaid board transmits reflow stove smoothly, is provided with transition wheel in guide pad.
Aforesaid board transmits reflow stove smoothly, and guide pad is Teflon guide pad.
Aforesaid board transmits reflow stove smoothly, and the gap between body of heater and transfer assembly is 1mm.
Usefulness of the present invention is: the invention provides a kind of gap that can dwindle between transmission assembly and reflow stove, guiding clamp is mobile smoothly avoids occurring the phenomenon of board on transmission assembly, guarantees the stable operation of reflow stove.
Brief description of the drawings
Fig. 1 is the front view of a kind of embodiment of the present invention;
The implication of Reference numeral in figure:
1 guide pad, 101 stopper slots, 102 transition wheels, 2 drives, 3 chains.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is done to concrete introduction.
Board transmits reflow stove smoothly, comprising: body of heater, for transmitting the transfer assembly of board, is placed in the entrance of body of heater and the guide pad 1 of exit spacing transfer assembly.
Transfer assembly composition has: be fixed on the driving member of body of heater, the transmission parts moving between driving member and guide pad 1.Preferred as one, driving member is drive 2, and transmission parts is chain 3.
Guide pad 1 composition has: guide pad 1 body, be placed in the stopper slot 101 on guide pad 1 body, and drive 2 and chain 3 are connected in stopper slot 101.In guide pad 1, be provided with transition wheel 102.The design of guide pad 1 makes to reduce the gap between body of heater and transfer assembly, make chain 3, guide pad 1, reflow stove play transition and guide effect at same straight line, reflow stove entrance conveyor chain 3 semicircular in shape shape transmission of the prior art, and the relative straight line excessive transmission of chain 3 of the present invention, thereby can be accurately, stable transfer.
Due to Teflon, to have hardness high, and resistant to elevated temperatures feature, so guide pad 1 is Teflon guide pad 1.
Gap between body of heater of the prior art and transfer assembly is 11mm; Through installing additional after guide pad 1, the gap between body of heater and transfer assembly is 1mm.
The invention provides a kind of gap that can dwindle between transmission assembly and reflow stove, guiding clamp is mobile smoothly avoids occurring the phenomenon of board on transmission assembly, guarantees the stable operation of reflow stove.
More than show and described general principle of the present invention, principal character and advantage.The technical staff of the industry should understand, and above-described embodiment does not limit the present invention in any form, and all employings are equal to replaces or technical scheme that the mode of equivalent transformation obtains, all drops in protection scope of the present invention.

Claims (7)

1. board transmits reflow stove smoothly, it is characterized in that, comprising: body of heater, for transmitting the transfer assembly of board, is placed in the entrance of body of heater and the guide pad of exit spacing above-mentioned transfer assembly.
2. board according to claim 1 transmits reflow stove smoothly, it is characterized in that, above-mentioned transfer assembly composition has: be fixed on the driving member of above-mentioned body of heater, the transmission parts moving between above-mentioned driving member and guide pad.
3. board according to claim 2 transmits reflow stove smoothly, it is characterized in that, above-mentioned driving member is drive, and above-mentioned transmission parts is chain.
4. board according to claim 1 transmits reflow stove smoothly, it is characterized in that, above-mentioned guide pad composition has: guide pad body, be placed in the stopper slot on above-mentioned guide pad body, and above-mentioned drive and chain are connected in above-mentioned stopper slot.
5. board according to claim 1 transmits reflow stove smoothly, it is characterized in that, in above-mentioned guide pad, is provided with transition wheel.
6. board according to claim 1 transmits reflow stove smoothly, it is characterized in that, above-mentioned guide pad is Teflon guide pad.
7. board according to claim 1 transmits reflow stove smoothly, it is characterized in that, the gap between above-mentioned body of heater and transfer assembly is 1mm.
CN201410424539.XA 2014-08-27 2014-08-27 Reflow oven enabling boards to be transferred smoothly Pending CN104159412A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410424539.XA CN104159412A (en) 2014-08-27 2014-08-27 Reflow oven enabling boards to be transferred smoothly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410424539.XA CN104159412A (en) 2014-08-27 2014-08-27 Reflow oven enabling boards to be transferred smoothly

Publications (1)

Publication Number Publication Date
CN104159412A true CN104159412A (en) 2014-11-19

Family

ID=51884789

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410424539.XA Pending CN104159412A (en) 2014-08-27 2014-08-27 Reflow oven enabling boards to be transferred smoothly

Country Status (1)

Country Link
CN (1) CN104159412A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5922230A (en) * 1996-03-08 1999-07-13 Eightech Tectron Co., Ltd. Automatic reflow soldering apparatus
CN103394788A (en) * 2013-07-31 2013-11-20 昆山元崧电子科技有限公司 Reflow oven guiding device
CN204291626U (en) * 2014-08-27 2015-04-22 昆山元崧电子科技有限公司 Board transmits reflow oven smoothly

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5922230A (en) * 1996-03-08 1999-07-13 Eightech Tectron Co., Ltd. Automatic reflow soldering apparatus
CN103394788A (en) * 2013-07-31 2013-11-20 昆山元崧电子科技有限公司 Reflow oven guiding device
CN204291626U (en) * 2014-08-27 2015-04-22 昆山元崧电子科技有限公司 Board transmits reflow oven smoothly

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20141119

RJ01 Rejection of invention patent application after publication