MY128748A - Plastic packaging for a surface mounted integrated circuit - Google Patents
Plastic packaging for a surface mounted integrated circuitInfo
- Publication number
- MY128748A MY128748A MYPI96005285A MYPI9605285A MY128748A MY 128748 A MY128748 A MY 128748A MY PI96005285 A MYPI96005285 A MY PI96005285A MY PI9605285 A MYPI9605285 A MY PI9605285A MY 128748 A MY128748 A MY 128748A
- Authority
- MY
- Malaysia
- Prior art keywords
- integrated circuit
- openings
- major surface
- grid array
- plastic packaging
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US889995P | 1995-12-19 | 1995-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY128748A true MY128748A (en) | 2007-02-28 |
Family
ID=21734333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI96005285A MY128748A (en) | 1995-12-19 | 1996-12-16 | Plastic packaging for a surface mounted integrated circuit |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US5777382A (enExample) |
| EP (1) | EP0780896A3 (enExample) |
| JP (1) | JPH09191060A (enExample) |
| MY (1) | MY128748A (enExample) |
| SG (1) | SG52875A1 (enExample) |
| TW (1) | TW463276B (enExample) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5677566A (en) * | 1995-05-08 | 1997-10-14 | Micron Technology, Inc. | Semiconductor chip package |
| JP3793628B2 (ja) * | 1997-01-20 | 2006-07-05 | 沖電気工業株式会社 | 樹脂封止型半導体装置 |
| JPH10294418A (ja) * | 1997-04-21 | 1998-11-04 | Oki Electric Ind Co Ltd | 半導体装置 |
| JP3210881B2 (ja) * | 1997-06-05 | 2001-09-25 | ソニーケミカル株式会社 | Ｂｇａパッケージ基板 |
| US5929522A (en) * | 1998-04-17 | 1999-07-27 | Hestia Technologies, Inc. | Semiconductor non-laminate package and method |
| US6229200B1 (en) | 1998-06-10 | 2001-05-08 | Asat Limited | Saw-singulated leadless plastic chip carrier |
| US7226811B1 (en) | 1998-06-10 | 2007-06-05 | Asat Ltd. | Process for fabricating a leadless plastic chip carrier |
| US8330270B1 (en) | 1998-06-10 | 2012-12-11 | Utac Hong Kong Limited | Integrated circuit package having a plurality of spaced apart pad portions |
| US6933594B2 (en) * | 1998-06-10 | 2005-08-23 | Asat Ltd. | Leadless plastic chip carrier with etch back pad singulation |
| US7270867B1 (en) | 1998-06-10 | 2007-09-18 | Asat Ltd. | Leadless plastic chip carrier |
| US6989294B1 (en) | 1998-06-10 | 2006-01-24 | Asat, Ltd. | Leadless plastic chip carrier with etch back pad singulation |
| US7271032B1 (en) | 1998-06-10 | 2007-09-18 | Asat Ltd. | Leadless plastic chip carrier with etch back pad singulation |
| US6872661B1 (en) | 1998-06-10 | 2005-03-29 | Asat Ltd. | Leadless plastic chip carrier with etch back pad singulation and die attach pad array |
| US7247526B1 (en) | 1998-06-10 | 2007-07-24 | Asat Ltd. | Process for fabricating an integrated circuit package |
| US6635957B2 (en) * | 1998-06-10 | 2003-10-21 | Asat Ltd. | Leadless plastic chip carrier with etch back pad singulation and die attach pad array |
| KR20000028360A (ko) * | 1998-10-31 | 2000-05-25 | 김규현 | 반도체 장치 |
| KR100960739B1 (ko) * | 1999-02-26 | 2010-06-01 | 텍사스 인스트루먼츠 인코포레이티드 | 열적으로 향상된 반도체 볼 그리드 어레이 디바이스 및 그제조 방법 |
| US6052045A (en) * | 1999-03-12 | 2000-04-18 | Kearney-National, Inc. | Electromechanical switching device package with controlled impedance environment |
| US6916683B2 (en) * | 2000-05-11 | 2005-07-12 | Micron Technology, Inc. | Methods of fabricating a molded ball grid array |
| USRE38381E1 (en) | 2000-07-21 | 2004-01-13 | Kearney-National Inc. | Inverted board mounted electromechanical device |
| US6391687B1 (en) * | 2000-10-31 | 2002-05-21 | Fairchild Semiconductor Corporation | Column ball grid array package |
| AU2003230602A1 (en) * | 2002-03-08 | 2003-09-22 | Kearney-National, Inc. | Surface mount molded relay package and method of manufacturing same |
| US7732914B1 (en) | 2002-09-03 | 2010-06-08 | Mclellan Neil | Cavity-type integrated circuit package |
| US7009286B1 (en) | 2004-01-15 | 2006-03-07 | Asat Ltd. | Thin leadless plastic chip carrier |
| US7411289B1 (en) | 2004-06-14 | 2008-08-12 | Asat Ltd. | Integrated circuit package with partially exposed contact pads and process for fabricating the same |
| US7091581B1 (en) | 2004-06-14 | 2006-08-15 | Asat Limited | Integrated circuit package and process for fabricating the same |
| US7595225B1 (en) | 2004-10-05 | 2009-09-29 | Chun Ho Fan | Leadless plastic chip carrier with contact standoff |
| US7358119B2 (en) * | 2005-01-12 | 2008-04-15 | Asat Ltd. | Thin array plastic package without die attach pad and process for fabricating the same |
| US7348663B1 (en) | 2005-07-15 | 2008-03-25 | Asat Ltd. | Integrated circuit package and method for fabricating same |
| US7410830B1 (en) | 2005-09-26 | 2008-08-12 | Asat Ltd | Leadless plastic chip carrier and method of fabricating same |
| US7256481B2 (en) * | 2005-11-30 | 2007-08-14 | Texas Instruments Incorporated | Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61174752A (ja) * | 1985-01-30 | 1986-08-06 | Seiko Epson Corp | 半導体装置 |
| JPS6332955A (ja) * | 1986-07-25 | 1988-02-12 | Nec Corp | 半導体集積回路装置 |
| US5200362A (en) * | 1989-09-06 | 1993-04-06 | Motorola, Inc. | Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film |
| US5293072A (en) * | 1990-06-25 | 1994-03-08 | Fujitsu Limited | Semiconductor device having spherical terminals attached to the lead frame embedded within the package body |
| JPH0462865A (ja) * | 1990-06-25 | 1992-02-27 | Fujitsu Ltd | 半導体装置及びその製造方法 |
| KR940002444B1 (ko) * | 1990-11-13 | 1994-03-24 | 금성일렉트론 주식회사 | 반도체 소자의 패키지 어셈블리 방법 |
| US5157480A (en) * | 1991-02-06 | 1992-10-20 | Motorola, Inc. | Semiconductor device having dual electrical contact sites |
| JPH0563109A (ja) * | 1991-08-29 | 1993-03-12 | New Japan Radio Co Ltd | モールド型ｉｃパツケージ |
| JPH05144995A (ja) * | 1991-11-18 | 1993-06-11 | Matsushita Electric Works Ltd | 半導体パツケージ |
| JPH06268101A (ja) * | 1993-03-17 | 1994-09-22 | Hitachi Ltd | 半導体装置及びその製造方法、電子装置、リ−ドフレ−ム並びに実装基板 |
| DE69527473T2 (de) * | 1994-05-09 | 2003-03-20 | Nec Corp., Tokio/Tokyo | Halbleiteranordnung bestehend aus einem Halbleiterchip, der mittels Kontakthöckern auf der Leiterplatte verbunden ist und Montageverfahren |
| TW359880B (en) * | 1995-08-30 | 1999-06-01 | Samsung Electronics Co Ltd | Method of manufacturing semiconductor chip package |
| US5736432A (en) * | 1996-09-20 | 1998-04-07 | National Semiconductor Corporation | Lead frame with lead finger locking feature and method for making same |
-
1996
- 1996-12-16 MY MYPI96005285A patent/MY128748A/en unknown
- 1996-12-18 EP EP96309224A patent/EP0780896A3/en not_active Withdrawn
- 1996-12-19 US US08/769,917 patent/US5777382A/en not_active Expired - Lifetime
- 1996-12-19 JP JP8339174A patent/JPH09191060A/ja active Pending
- 1996-12-19 SG SG1996011856A patent/SG52875A1/en unknown
-
1997
- 1997-02-19 TW TW086101926A patent/TW463276B/zh not_active IP Right Cessation
- 1997-08-26 US US08/918,404 patent/US5976914A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| SG52875A1 (en) | 1998-09-28 |
| EP0780896A3 (en) | 1999-04-14 |
| JPH09191060A (ja) | 1997-07-22 |
| TW463276B (en) | 2001-11-11 |
| EP0780896A2 (en) | 1997-06-25 |
| US5976914A (en) | 1999-11-02 |
| US5777382A (en) | 1998-07-07 |
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