MY113832A - Anisotropic, electrically conductive adhesive film - Google Patents

Anisotropic, electrically conductive adhesive film

Info

Publication number
MY113832A
MY113832A MYPI94003372A MYPI19943372A MY113832A MY 113832 A MY113832 A MY 113832A MY PI94003372 A MYPI94003372 A MY PI94003372A MY PI19943372 A MYPI19943372 A MY PI19943372A MY 113832 A MY113832 A MY 113832A
Authority
MY
Malaysia
Prior art keywords
electrically conductive
anisotropic
adhesive film
conductive adhesive
insulating adhesive
Prior art date
Application number
MYPI94003372A
Other languages
English (en)
Inventor
Hiroaki Yamaguchi
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of MY113832A publication Critical patent/MY113832A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Die Bonding (AREA)
MYPI94003372A 1993-12-16 1994-12-16 Anisotropic, electrically conductive adhesive film MY113832A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31639093A JP3408301B2 (ja) 1993-12-16 1993-12-16 異方性導電膜

Publications (1)

Publication Number Publication Date
MY113832A true MY113832A (en) 2002-06-29

Family

ID=18076551

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI94003372A MY113832A (en) 1993-12-16 1994-12-16 Anisotropic, electrically conductive adhesive film

Country Status (8)

Country Link
EP (1) EP0734576B1 (https=)
JP (1) JP3408301B2 (https=)
KR (1) KR100359175B1 (https=)
CN (1) CN1137324A (https=)
DE (1) DE69427037T2 (https=)
MY (1) MY113832A (https=)
TW (1) TW250592B (https=)
WO (1) WO1995016998A1 (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1098905C (zh) * 1995-04-24 2003-01-15 美国3M公司 用于聚烯烃表面的压敏粘合剂
CA2254883A1 (en) * 1996-05-16 1997-11-20 Christopher A. Haak Adhesive compositions and methods of use
JP5378261B2 (ja) * 1997-02-14 2013-12-25 日立化成株式会社 回路部材接続用接着剤
US7967943B2 (en) 1997-03-31 2011-06-28 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
AU6520798A (en) 1997-03-31 1998-10-22 Hitachi Chemical Company, Ltd. Circuit connecting material, and structure and method of connecting circuit terminal
JP3226889B2 (ja) * 1998-05-06 2001-11-05 シンワ プロダクト カンパニー・リミテッド 導電性粘着テープ
US6294270B1 (en) * 1998-12-23 2001-09-25 3M Innovative Properties Company Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
KR100575467B1 (ko) * 1999-12-30 2006-05-03 삼성토탈 주식회사 자기점착이 가능한 보호필름용 수지 조성물
KR100398315B1 (ko) * 2001-02-12 2003-09-19 한국과학기술원 고주파 패키지용 플립 칩 접속을 위한 전도성 접착제의 제조방법
US7033668B2 (en) 2001-08-23 2006-04-25 Tesa Ag Electrically conductive, preferably unbacked adhesive tape with permanent full-area pressure sensitive adhesion, composed of a film of a pressure sensitive adhesive which is preferably coated onto an antiadhesive medium and has an alkaline surface
TW200538522A (en) * 2004-02-16 2005-12-01 Hitachi Chemical Co Ltd Adhesive composition, film-formed adhesive and circuit-joining material by using the same, and joining structure of circuit member and method for producing the same
DE602004014257D1 (de) * 2004-06-02 2008-07-17 Sony Ericsson Mobile Comm Ab Transparente leitende Antenne für ein tragbares Kommunikationsgerät
KR100622598B1 (ko) * 2004-12-08 2006-09-19 엘에스전선 주식회사 피티씨 특성을 갖는 이방 도전성 접착제
WO2007006633A1 (en) * 2005-07-08 2007-01-18 Cypak Ab Use of heat-activated adhesive for manufacture and a device so manufactured
CN102010679B (zh) 2007-01-10 2013-05-08 日立化成株式会社 电路部件连接用粘接剂及使用该粘接剂的半导体装置
EP2211354B1 (en) * 2007-10-22 2020-12-16 Nippon Chemical Industrial Co., Ltd. Coated conductive powder and conductive adhesive using the same
TWI389999B (zh) * 2007-12-18 2013-03-21 Cheil Ind Inc 黏著性組成物及使用該黏著性組成物的各向異性導電膜
JP2010010142A (ja) * 2009-10-07 2010-01-14 Hitachi Chem Co Ltd 熱硬化性回路接続部材及びそれを用いた電極の接続構造、電極の接続方法
TWI540590B (zh) * 2011-05-31 2016-07-01 住友電木股份有限公司 半導體裝置
US9111847B2 (en) * 2012-06-15 2015-08-18 Infineon Technologies Ag Method for manufacturing a chip package, a method for manufacturing a wafer level package, a chip package and a wafer level package
CN112946797B (zh) * 2021-02-19 2023-10-31 晋江联兴反光材料有限公司 一种复合金属层的反光膜及其制备方法
KR20230155440A (ko) * 2021-03-09 2023-11-10 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 진보된 접합제

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608377A (ja) * 1983-06-28 1985-01-17 Matsushita Electric Ind Co Ltd 異方導電性接着剤
JPS60133079A (ja) * 1983-12-21 1985-07-16 Seikosha Co Ltd 異方導電性接着剤
JPS619472A (ja) * 1984-06-22 1986-01-17 Seikosha Co Ltd 異方導電性接着剤

Also Published As

Publication number Publication date
CN1137324A (zh) 1996-12-04
EP0734576A1 (en) 1996-10-02
KR100359175B1 (ko) 2003-01-15
KR960706680A (ko) 1996-12-09
TW250592B (https=) 1995-07-01
JPH07211145A (ja) 1995-08-11
DE69427037D1 (de) 2001-05-10
JP3408301B2 (ja) 2003-05-19
DE69427037T2 (de) 2001-11-15
EP0734576B1 (en) 2001-04-04
WO1995016998A1 (en) 1995-06-22

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