MY108012A - Method of producing copper-clad laminated board - Google Patents

Method of producing copper-clad laminated board

Info

Publication number
MY108012A
MY108012A MYPI92000776A MYPI19920776A MY108012A MY 108012 A MY108012 A MY 108012A MY PI92000776 A MYPI92000776 A MY PI92000776A MY PI19920776 A MYPI19920776 A MY PI19920776A MY 108012 A MY108012 A MY 108012A
Authority
MY
Malaysia
Prior art keywords
laminated board
clad laminated
copper
polyamide
holding
Prior art date
Application number
MYPI92000776A
Other languages
English (en)
Inventor
Katoh Kimikazu
Azuma Keiji
Oguro Ryoichi
Original Assignee
Sumitomo Bakelite Co
Circuit Foil Japan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co, Circuit Foil Japan filed Critical Sumitomo Bakelite Co
Publication of MY108012A publication Critical patent/MY108012A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)
MYPI92000776A 1991-05-13 1992-05-06 Method of producing copper-clad laminated board MY108012A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3201525A JP3029487B2 (ja) 1991-05-13 1991-05-13 銅張積層板の製造方法

Publications (1)

Publication Number Publication Date
MY108012A true MY108012A (en) 1996-07-30

Family

ID=16442492

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI92000776A MY108012A (en) 1991-05-13 1992-05-06 Method of producing copper-clad laminated board

Country Status (7)

Country Link
US (1) US5286330A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0514074B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP3029487B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR0172456B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE69208515T2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
MY (1) MY108012A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TW243583B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0599779A1 (de) * 1992-10-29 1994-06-01 OCG Microelectronic Materials AG Hochauflösender negativ arbeitender Photoresist mit grossem Prozessspielraum
TW389780B (en) * 1995-09-13 2000-05-11 Hitachi Chemical Co Ltd Prepreg for printed circuit board
ID19337A (id) * 1996-12-26 1998-07-02 Ajinomoto Kk Film perekat antar-pelapis untuk papan pembuat kabel cetakan berlapis-banyak dan papan kabel cetakan berlapis-banyak memakai film ini
US6229096B1 (en) * 1997-10-07 2001-05-08 Mitsubishi Gas Chemical Company, Inc. Nonwoven reinforcement for printed wiring base board and process for producing the same
DE19859613C2 (de) * 1998-12-23 2001-09-06 Buerkle Gmbh Robert Presspaketaufbau und Verfahren zu dessen Herstellung
US6168634B1 (en) 1999-03-25 2001-01-02 Geoffrey W. Schmitz Hydraulically energized magnetorheological replicant muscle tissue and a system and a method for using and controlling same
KR100319834B1 (ko) * 1999-08-24 2002-01-10 고연종 복합보드 및 그 제조방법
US6584820B1 (en) 1999-09-23 2003-07-01 Polyclad Laminates, Inc. Surface enhanced metal press plates for use in manufacture of laminates and multilayer materials and method of making same
JP4025177B2 (ja) 2001-11-26 2007-12-19 三井金属鉱業株式会社 絶縁層付銅箔の製造方法
WO2004092271A1 (ja) 2003-04-18 2004-10-28 Asahi Kasei Chemicals Corporation プリント基板製造用離型フィルム
JP4606423B2 (ja) 2005-01-07 2011-01-05 旭化成ケミカルズ株式会社 ハードディスクドライブ内部部品
KR100839760B1 (ko) * 2006-02-06 2008-06-19 주식회사 엘지화학 칩 온 필름용 동장 적층판
WO2008105480A1 (ja) * 2007-03-01 2008-09-04 Ajinomoto Co., Inc. 金属膜転写用フィルム、金属膜の転写方法及び回路基板の製造方法
KR101949812B1 (ko) * 2017-08-11 2019-02-20 주식회사 비앤엠 펀칭공법을 이용한 제련용 냉각편 제조장치
KR102171513B1 (ko) * 2019-01-16 2020-10-30 주식회사 비앤엠 이중열 펀칭공법을 이용한 제련용 직사각형 냉각편 제조장치
JP7031955B2 (ja) * 2019-09-10 2022-03-08 Ｆｉｃｔ株式会社 回路基板の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3677876A (en) * 1970-02-18 1972-07-18 Formica Corp Decorative laminate surfaced with a transparent film of polyvinyl fluoride which film is temporarily covered with a transparent film of nylon
JPS5434142B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-09-29 1979-10-25
CA1230526A (en) * 1983-12-09 1987-12-22 Martin J. Wilheim Mold release sheet and method of manufacture
EP0235582A3 (en) * 1986-02-27 1989-03-29 Hewlett-Packard Company Bonded press pad
JPS62214939A (ja) * 1986-03-15 1987-09-21 Matsushita Electric Works Ltd 積層板の製法
JPS62274795A (ja) * 1986-05-23 1987-11-28 新神戸電機株式会社 多層回路板の製造法
JPH0821765B2 (ja) * 1986-11-13 1996-03-04 ジヨンストン，ジエイムズ・エイ 印刷回路板を製造する方法および装置
GB8725746D0 (en) * 1987-11-03 1987-12-09 Du Pont Canada Release sheet for printed circuit board
US4861648A (en) * 1988-03-14 1989-08-29 Gila River Products, Inc. Materials for laminating flexible printed circuits

Also Published As

Publication number Publication date
TW243583B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1995-03-21
EP0514074B1 (en) 1996-02-28
EP0514074A3 (en) 1993-05-19
DE69208515T2 (de) 1996-09-26
EP0514074A2 (en) 1992-11-19
JP3029487B2 (ja) 2000-04-04
KR920021308A (ko) 1992-12-18
JPH06316032A (ja) 1994-11-15
DE69208515D1 (de) 1996-04-04
US5286330A (en) 1994-02-15
KR0172456B1 (ko) 1999-03-20

Similar Documents

Publication Publication Date Title
MY108012A (en) Method of producing copper-clad laminated board
GB1222776A (en) Method and apparatus for producing a multi-layer printed circuit plate assembly
EP0261246A4 (en) METHOD AND DEVICE FOR BINDING LAMINATES BY THERMAL COMPACTION.
MY115624A (en) Composite foil of aluminum and copper
EP0122619A3 (en) Composite product having patterned metal layer and process
GB2158367B (en) Process for producing polyimide/metallic foil composite film
GB1458260A (en) Composite foil
MY136428A (en) Resin/copper/metal laminate and method of producing same
EP0404177A3 (en) Transfer sheet for making printed-wiring board by injection molding and method for producing same
ITMI930223A0 (it) Procedimento per la produzione di laminati plastici con lamine metalliche in specie circuiti stampati con riscaldamento endotermico
ZA888265B (en) Apparatus for the pressing of laminated glass/plastic composites
EP0208177A3 (en) Ultrathin copper foil and process for producing such foil
ITMI912248A1 (it) Procedimento e pressa a piastre monopiano con dispositivo di scarico per la fabbricazione simultanea di due lastre di laminato decorativo
MX9606676A (es) Material estructural laminado y metodo para producirlo.
JPS5292288A (en) Manufacture of copper-clad laminate of unsaturated polyester resin
MY119066A (en) Copper-clad paper-based laminate and process for producing the same
EP0267610A3 (en) Process for producing electroconductive sheet
GB2294661A (en) Method of laminate manufacture
JPS546073A (en) Manufacture of metallic decorative laminate
JPS5472283A (en) Production of laminate
US3565723A (en) Process for making a metal clad plastic laminate in which a metal shim is used to improve the bonding of the metal foil to the plastic layer
Suzuki et al. A Laminated Printed Circuit Board and Process for Its Manufacture
JPS5757652A (en) Device for continuously manufacturing one surface metallic foil lined laminated plate
JPS6427910A (en) Production of laminated plate
Suzuki et al. Manufacturing a Laminating Printed Circuit Board