JPS5472283A - Production of laminate - Google Patents

Production of laminate

Info

Publication number
JPS5472283A
JPS5472283A JP14014377A JP14014377A JPS5472283A JP S5472283 A JPS5472283 A JP S5472283A JP 14014377 A JP14014377 A JP 14014377A JP 14014377 A JP14014377 A JP 14014377A JP S5472283 A JPS5472283 A JP S5472283A
Authority
JP
Japan
Prior art keywords
materials
hot
parts
slip
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14014377A
Other languages
Japanese (ja)
Other versions
JPS6154580B2 (en
Inventor
Yoshihiro Takahashi
Tatsuji Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP14014377A priority Critical patent/JPS5472283A/en
Publication of JPS5472283A publication Critical patent/JPS5472283A/en
Publication of JPS6154580B2 publication Critical patent/JPS6154580B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:To obtain a laminate without slip of constituent materials, by hot-pressing the materials placed on top of each other, using press parts for slip prevention at the sides. CONSTITUTION:The metal plates 7 having press parts 8 for slip prevention are provided at the sides of constituent materials e.g. the cushion paper 2, flat panel 3, copper foil 4, prepreg 5, copper foil 4, flat panel 3, and cushion paper 2 placed on top of each other, and the materials are hot-pressed. The height of the parts 8 is smaller than the distance between the hot plates during the hot-pressing. The difference in dimension between the materials and parts 8 is preferably 10 mm or less from the viewpoint of the easy insertion of the materials and the slip tolerance.
JP14014377A 1977-11-22 1977-11-22 Production of laminate Granted JPS5472283A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14014377A JPS5472283A (en) 1977-11-22 1977-11-22 Production of laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14014377A JPS5472283A (en) 1977-11-22 1977-11-22 Production of laminate

Publications (2)

Publication Number Publication Date
JPS5472283A true JPS5472283A (en) 1979-06-09
JPS6154580B2 JPS6154580B2 (en) 1986-11-22

Family

ID=15261862

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14014377A Granted JPS5472283A (en) 1977-11-22 1977-11-22 Production of laminate

Country Status (1)

Country Link
JP (1) JPS5472283A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007090945A (en) * 2005-09-27 2007-04-12 Toyota Motor Corp Cooling system structure for power control unit
JP2007313803A (en) * 2006-05-26 2007-12-06 Matsushita Electric Works Ltd Manufacturing method for multi-layer laminated plate
JP2008282857A (en) * 2007-05-08 2008-11-20 Denso Corp Apparatus and method for manufacturing multilayer board
CN102248747A (en) * 2011-05-27 2011-11-23 开平太平洋绝缘材料有限公司 Frame shape positioning device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007090945A (en) * 2005-09-27 2007-04-12 Toyota Motor Corp Cooling system structure for power control unit
JP2007313803A (en) * 2006-05-26 2007-12-06 Matsushita Electric Works Ltd Manufacturing method for multi-layer laminated plate
JP2008282857A (en) * 2007-05-08 2008-11-20 Denso Corp Apparatus and method for manufacturing multilayer board
CN102248747A (en) * 2011-05-27 2011-11-23 开平太平洋绝缘材料有限公司 Frame shape positioning device

Also Published As

Publication number Publication date
JPS6154580B2 (en) 1986-11-22

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