JP2007313803A - Manufacturing method for multi-layer laminated plate - Google Patents
Manufacturing method for multi-layer laminated plate Download PDFInfo
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- JP2007313803A JP2007313803A JP2006147320A JP2006147320A JP2007313803A JP 2007313803 A JP2007313803 A JP 2007313803A JP 2006147320 A JP2006147320 A JP 2006147320A JP 2006147320 A JP2006147320 A JP 2006147320A JP 2007313803 A JP2007313803 A JP 2007313803A
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Abstract
Description
本発明は、加熱加圧積層成形による多層積層板の製造方法に関するものである。 The present invention relates to a method for producing a multilayer laminate by heat and pressure lamination.
プリント配線板の高密度実装の要請の高まりととに多層のプリント配線板への期待は大きい。多層のプリント配線板は、通常、内層回路を有する内層板の上下に絶縁板と外層回路を配設した構成を有しており、この構成に対応した多層積層板に外層回路と形成し、内層回路と外層回路とを導通させることにより製造されている。このため、多層の回路形成のための多層積層板は多層プリント配線板の性能を大きく左右することになる。 As the demand for high-density mounting of printed wiring boards increases, expectations for multilayer printed wiring boards are great. A multilayer printed wiring board usually has a configuration in which an insulating plate and an outer layer circuit are arranged above and below an inner layer plate having an inner layer circuit, and an outer layer circuit is formed on a multilayer laminated board corresponding to this configuration. It is manufactured by making a circuit and an outer layer circuit conductive. For this reason, the multilayer laminated board for multilayer circuit formation greatly affects the performance of the multilayer printed wiring board.
このような多層積層板については、従来より、内層板にプリプレグと金属箔または外層材を重ねた被圧積層体の複数組を各々金属プレートを介して載置し、上下より加圧して加熱することで積層成形されている。 With regard to such a multilayer laminated plate, conventionally, a plurality of sets of pressed laminates in which a prepreg and a metal foil or an outer layer material are stacked on an inner layer plate are placed via metal plates, and heated by pressing from above and below. That is why it is laminated.
ただ、この積層成形では、成形時の横方向のずれ(スリッピング)の発生が懸念されることから、従来では、このような成形ずれの発生を予防する措置として、たとえば図8の斜視、平面、そして側面図に示したような、その周囲に複数の舌足片11を有する上枠1を基板2上に載置した複数の被圧積層体3の載置品30上に被せて加熱加圧する方法や、あるいは図9に示したような、可動式の舌足片12を設けて高さ調整できるようにした改良型の上枠1を用いて加熱加圧する方法(たとえば特許文献1−3参照)が採用されてきている。 However, in this lamination molding, there is a concern about occurrence of lateral displacement (slipping) at the time of molding. Conventionally, as a measure for preventing such molding deviation, for example, a perspective view and a plane in FIG. Then, as shown in the side view, the upper frame 1 having a plurality of tongue-and-feet pieces 11 around the periphery is placed on the placement product 30 of the plurality of pressed laminates 3 placed on the substrate 2 and heated. 9 or a method of heating and pressurizing using the improved upper frame 1 provided with a movable tongue-and-foot piece 12 as shown in FIG. 9 so that the height can be adjusted (for example, Patent Documents 1-3) Have been adopted.
しかしながら、上記の図8のような舌足片11を有する上枠(タイプ1)並びに図9のような可動式の舌足片12に備えた上枠(タイプ2)のいずれにも表1に示したような一長一短があった。すなわちタイプ1の場合には、舌足片11が基板2から浮いた状態にあり、載置した複数の被圧積層体3を全体として固定しているわけではない。このため、被圧積層体3の構成によってはスリッピングが発生することになる。一方、改良型のタイプ2の場合には、可動式の舌足片12が基板2に接触した状態にあり、載置した複数の被圧積層体3を全体として固定しているのでスリッピング防止には大きな効果が得られる。だが、タイプ2の場合には、固定しているがために、成形時にかかる圧力による歪みが抜けきらず、各被圧積層体の寸法変化のバラツキや反りが発生しやすいという問題がある。 However, the upper frame (type 1) having the tongue-and-foot piece 11 as shown in FIG. 8 and the upper frame (type 2) provided in the movable tongue-and-foot piece 12 as shown in FIG. There were advantages and disadvantages as shown. That is, in the case of Type 1, the tongue-and-feet piece 11 is in a state of floating from the substrate 2, and the plurality of mounted laminates 3 to be pressed are not fixed as a whole. For this reason, depending on the configuration of the pressed laminate 3, slipping may occur. On the other hand, in the case of the improved type 2, the movable tongue-and-feet piece 12 is in contact with the substrate 2 and the plurality of mounted laminates 3 are fixed as a whole, thus preventing slipping. Has a great effect. However, since the type 2 is fixed, distortion due to pressure applied at the time of molding cannot be completely removed, and there is a problem that variation in dimensions and warpage of each pressed laminate are likely to occur.
これに対し、タイプ1の場合には逆に固定されていないことから応力が解放されて、寸法変化のバラツキや反りに関しては良好である。 On the other hand, in the case of Type 1, since it is not fixed on the contrary, the stress is released, and the variation in dimension and warpage are good.
また、タイプ2には、可動式舌足片を有する上枠を用いる点で、どうしてもコスト高になるという問題がある。 Further, Type 2 has a problem that the cost is inevitably increased in that an upper frame having a movable tongue-and-foot piece is used.
本発明は、上記のとおりの背景から従来の問題点を解消し、多層積層板の成形時の成形ずれ(スリッピング)性に優れ、しかも寸法変化のバラツキや反りの抑制効果も良好な多層積層板の改善された新しい製造方法を提供することを課題としている。 The present invention eliminates the conventional problems from the background as described above, is excellent in forming deviation (slipping) property at the time of forming a multilayer laminate, and also has a good effect of suppressing dimensional variation and warpage. It is an object of the present invention to provide a new method for manufacturing a board.
本発明の製造方法は以下のことを特徴としている。 The manufacturing method of the present invention is characterized by the following.
第1:内層板にプリプレグと金属箔または外層材を重ねた被圧積層体を加熱加圧積層成形して多層積層板を製造するに際し、複数組の被圧積層体を載置し、下側を枠にて囲み、上側からその周囲に複数の舌足片を有する上枠を被せて加熱加圧積層成形する。 First: When producing a multi-layer laminate by heating and press-molding a laminated laminate in which a prepreg and a metal foil or an outer layer material are laminated on an inner layer plate, a plurality of sets of laminated laminates are placed on the lower side. Is covered with a frame, and an upper frame having a plurality of tongues and legs is placed on the periphery from above, and heat-press lamination molding is performed.
第2:下側を囲む枠の内寸:bと上枠の舌足片間の外寸:aについて、b−aが4〜8mmの範囲内となるようにする。 Second: Inner dimension of the frame surrounding the lower side: Outer dimension between b and tongue and leg pieces of the upper frame: a, so that ba is in the range of 4 to 8 mm.
第3:下側を囲む枠に切り欠き溝を設け、上枠の舌足片には突起を設けて、成形時にはこの突起が前記の切り欠き溝に挿入させるようにする。 Third: A notch groove is provided on the frame surrounding the lower side, and a protrusion is provided on the tongue foot piece of the upper frame, and this protrusion is inserted into the notch groove during molding.
上記第1の発明によれば、従来の問題点を解消し、多層積層板の成形時の成形ずれ(スリッピング)の防止性に優れ、しかも寸法変化のバラツキや反りの抑制効果も良好な、多層積層板の製造が可能とされる。 According to the first aspect of the present invention, the conventional problems are solved, the prevention of molding deviation (slipping) at the time of molding the multilayer laminate sheet is excellent, and the dimensional variation and warpage suppression effect are also good. A multilayer laminate can be manufactured.
第2の寸法差(b−a)の特定による発明では、成形ずれを最小限に抑えることがより確実に可能とされる。 In the invention by specifying the second dimensional difference (b−a), it is possible to more surely suppress the molding deviation.
また、第3の発明では、成形ずれの防止はより効果的となり、より安価な治具としての枠や上枠の手段が提供可能とされる。 Further, in the third invention, prevention of molding deviation is more effective, and it is possible to provide a frame or upper frame means as a cheaper jig.
本発明は上記のとおりの特徴をもつものであるが、以下にその実施の形態について説明する。 The present invention has the features as described above, and an embodiment thereof will be described below.
添付図面の図1は本発明の方法が対象とする被圧積層体3の載置状態を例示した概要断面図であって、本発明においては、たとえばこの図1に例示したように、内層板31にプリプレグ32と金属箔33、または外層材を重ねた被圧積層体3の複数組を基板2上に、金属プレート4を介して、また上下のクッション材5をもって載置し、その上下方向への加圧と加熱による樹脂強化で積層体化成形し、所要の積層板を製造している。 FIG. 1 of the accompanying drawings is a schematic cross-sectional view illustrating the mounting state of a pressure-bonded laminate 3 targeted by the method of the present invention. In the present invention, for example, as illustrated in FIG. A plurality of sets of pressed laminates 3 in which a prepreg 32 and a metal foil 33 or an outer layer material are stacked on 31 are placed on the substrate 2 via the metal plate 4 and with the upper and lower cushion members 5, and the vertical direction thereof. The required laminates are manufactured by forming into a laminate by resin reinforcement by pressurization and heating.
この製造に際し、上記第1の発明の一実施形態を示した概要側面図である。図2のように、被圧積層体3の載置品30の下側を枠6に囲み、上側から、その周囲に複数の舌足片71を有する上枠7を被せて加熱加圧成形する。こうすることで、成形でのずれ(スリッピング)を抑え、反りの抑制、寸法安定性に優れた積層体製品を実現することができる。舌足片71は、従来の前記タイプ2のような可動式とする必要がなく、治具としてのコストも安価なものとなる。 It is the outline side view showing one embodiment of the above-mentioned 1st invention in the case of this manufacture. As shown in FIG. 2, the lower side of the mounted product 30 of the pressure-sensitive laminate 3 is surrounded by the frame 6, and the upper frame 7 having a plurality of tongue-and-foot pieces 71 around the upper side is covered from the upper side and heat-press molding is performed. . By doing so, it is possible to realize a laminate product that suppresses the deviation (slipping) in molding, suppresses warpage, and is excellent in dimensional stability. The tongue leg piece 71 does not need to be movable like the conventional type 2, and the cost as a jig is low.
図3は、第2の発明の一実施形態を例示した概要図である。成形ずれを最小限とするために、載置品30の下側を囲む枠6の内寸:bと、上枠7の対向する舌足片71間の外寸:aについて、その寸法差b−aを4〜8mmの範囲内となるようにする。 FIG. 3 is a schematic view illustrating an embodiment of the second invention. In order to minimize the molding deviation, the inner dimension: b of the frame 6 that surrounds the lower side of the placed article 30 and the outer dimension: a between the opposing tongue and foot pieces 71 of the upper frame 7, the dimension difference b -A is set within a range of 4 to 8 mm.
図4は、上記第3の発明の一実施形態を例示した概要側面図と平面図である。ここでは載置品30の下側を図式枠6に切り欠き溝61を設けておき、成形時には、この切り欠き61内に、上枠7の舌足片71にその外方に向って設けた突起72がぴったりと挿入されるようにしている。 FIG. 4 is a schematic side view and a plan view illustrating one embodiment of the third invention. Here, a cutout groove 61 is provided in the schematic frame 6 on the lower side of the placed product 30, and at the time of molding, the cutout 61 is provided in the tongue foot piece 71 of the upper frame 7 facing outward. The protrusion 72 is inserted exactly.
このことによって、成形ずれの発生により効果的に抑制されることになる。 This effectively suppresses the occurrence of molding deviation.
もちろん、以上のとおりの本発明の製造方法においては、対象とする被圧積層板3の構成やその平面の大きさ、厚み、これらの載置品30の高さや大きさ、加熱加圧の条件等を考慮して、下側の枠6や上側の上枠7、舌足片71、突起72等の素材、大きさ、厚みの寸法等を適宜としてよく、金属等により構成してよい。また、舌足片71や突起72、そして下側の枠6の切り欠き溝61の配置位置や寸法も同様である。成形ずれの抑制、反り、寸法変更化のバラツキの抑制にとって適切となるようにする。 Of course, in the manufacturing method of the present invention as described above, the configuration of the target pressure-bonded laminated plate 3, the size and thickness of the plane, the height and size of these mounted items 30, and the conditions of heating and pressing In consideration of the above, materials such as the lower frame 6, the upper frame 7, the tongue and foot piece 71, the protrusion 72, and the like may be appropriately determined, and may be made of metal or the like. The arrangement positions and dimensions of the tongue leg piece 71, the protrusion 72, and the cutout groove 61 of the lower frame 6 are also the same. Appropriate for suppression of molding deviation, warpage, and variation in dimensional change.
そこで以下に実施例を示し、さらに詳しく説明する。もちろん以下の例によって説明が限定されることはない。 Therefore, an example will be shown below and will be described in more detail. Of course, the description is not limited by the following examples.
図1の被圧積層体の構成に対応し、サイズが510×510mmであって、内層材(松下電工製R−1766、0.9t)、その上下各々の2枚のプリプレグ(松下電工製R−1661、0.15:樹脂量48%)、上下最外層としての銅箔(18μm)を対象として積層成形した。 Corresponding to the structure of the pressed laminate of FIG. 1, the size is 510 × 510 mm, the inner layer material (R-1766, manufactured by Matsushita Electric Works, 0.9t), and two prepregs (R −1661, 0.15: Resin amount 48%), and copper foil (18 μm) as upper and lower outermost layers was laminated and formed.
製造条件としては、上記の被圧積層体12枚(段)を、図1のように金属(SUS)プレート、そしてクッション材とともに載置し、次の成形条件で加熱加圧した。
(温度条件)
製品昇温度 2.0℃/分にて160℃まで加熱160以上にて60分保持。
(圧力条件)
5kg/cm2にて10分加圧後10分で40kg/cm2まで昇圧40kg/cm2にて加熱終了まで加圧。
As manufacturing conditions, the above-mentioned 12 laminated bodies (stages) were placed together with a metal (SUS) plate and a cushion material as shown in FIG. 1 and heated and pressurized under the following molding conditions.
(Temperature conditions)
Heating up to 160 ° C at a product rising temperature of 2.0 ° C / min. Hold for 60 minutes at 160 or more.
(Pressure condition)
Pressure until the completion of the heating by the booster 40 kg / cm 2 at 5 kg / cm 2 at 10 minutes after pressing 10 minutes 40 kg / cm 2.
その際に、図2および図3に示した形態のように上下枠を使用し、寸法差b−aを2mm(実施例1)、10mm(実施例2)、8mm(実施例3)とした場合、図4のように上下枠で切り欠き溝61と突起72を有するものを使用し、寸法差b−aを8mmとした場合、さらには従来の前記タイプ1(図8:比較例1)、タイプ2(図9:比較例2)のものを用いた場合の各々について、成形ずれ、寸法バラツキ、反りの発生の度合を評価した。 At that time, the upper and lower frames were used as in the forms shown in FIGS. 2 and 3, and the dimensional difference ba was set to 2 mm (Example 1), 10 mm (Example 2), and 8 mm (Example 3). In this case, as shown in FIG. 4, when the upper and lower frames having notches 61 and protrusions 72 are used and the dimensional difference ba is 8 mm, the conventional type 1 (FIG. 8: Comparative Example 1) is used. The degree of occurrence of molding deviation, dimensional variation, and warpage was evaluated for each of the types 2 (FIG. 9: Comparative Example 2).
なお、上記の上下枠等については、素材が鉄であって、上枠天板厚み3mm、舌足片は、1辺に2個配置し、サイズは、高さ35mm、幅20mm、厚み1.5mmとし、下枠の厚み3mm、高さ45mm、そして舌足片への突起については径5mm、長さ7mmの円柱状とした。 For the upper and lower frames, etc., the material is iron, the top frame top plate is 3 mm thick, the tongue pieces are arranged in two on one side, the size is 35 mm high, 20 mm wide, and thickness 1. The thickness of the lower frame was 3 mm, the height was 45 mm, and the protrusions on the tongue and foot pieces were cylindrical with a diameter of 5 mm and a length of 7 mm.
成形ずれについては、図5に示したように、SUSプレートと積層体端面の最大ずれ値(mm)を各々の積層板毎に測定した。 As for the molding deviation, as shown in FIG. 5, the maximum deviation value (mm) between the SUS plate and the end face of the laminated body was measured for each laminated board.
寸法バラツキについては、図6のように、内層パターンの基準マーク間寸法を測定し、バラツキを算出した。 Regarding the dimensional variation, as shown in FIG. 6, the dimension between the reference marks of the inner layer pattern was measured, and the variation was calculated.
反りについては、図7のように、成形後の積層板を定盤上に静置し、コーナー部の反り量を反りゲージにて測定した。 As for the warpage, as shown in FIG. 7, the molded laminated plate was allowed to stand on a surface plate, and the warpage amount of the corner portion was measured with a warpage gauge.
これらの結果を表2に示した。 These results are shown in Table 2.
なお、タイプ1の場合の枠治具のコストに比較すると、タイプ2の場合は約2倍であったが、実施例1〜3では1.1倍、実施例4でも約1.3倍にすぎず、低コストであった。 In addition, compared with the cost of the frame jig in the case of Type 1, it was about twice in the case of Type 2, but 1.1 times in Examples 1 to 3 and about 1.3 times in Example 4. However, it was low cost.
1 上枠
11 舌足片
12 可動式舌足片
2 基板
3 被圧積層板
30 載置品
31 内層材
22 プリプレグ
23 金属箔
4 金属プレート
5 クッション材
6 枠
61 切り欠き溝
7 上枠
71 舌足片
72 突起
DESCRIPTION OF SYMBOLS 1 Upper frame 11 Tongue foot piece 12 Movable tongue foot piece 2 Board | substrate 3 Pressurized laminated board 30 Mounted goods 31 Inner layer material 22 Prepreg 23 Metal foil 4 Metal plate 5 Cushion material 6 Frame 61 Notch groove 7 Upper frame 71 Tongue foot 72 protrusions
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JP2006147320A JP4835265B2 (en) | 2006-05-26 | 2006-05-26 | Multilayer laminate manufacturing method |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI399282B (en) * | 2010-07-14 | 2013-06-21 | Advanced Int Multitech Co Ltd | A method of making a polygonal continuous side frame with a prepreg |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS50133458A (en) * | 1974-04-15 | 1975-10-22 | ||
JPS5472283A (en) * | 1977-11-22 | 1979-06-09 | Hitachi Chem Co Ltd | Production of laminate |
JPS58148969A (en) * | 1982-03-02 | 1983-09-05 | Toshiba Corp | Measuring device of alternating-current signal level |
JP2000043009A (en) * | 1998-07-29 | 2000-02-15 | Kisen Kk | Compression mold for wood |
JP2005014384A (en) * | 2003-06-25 | 2005-01-20 | Matsushita Electric Works Ltd | Plate for press-forming |
-
2006
- 2006-05-26 JP JP2006147320A patent/JP4835265B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS50133458A (en) * | 1974-04-15 | 1975-10-22 | ||
JPS5472283A (en) * | 1977-11-22 | 1979-06-09 | Hitachi Chem Co Ltd | Production of laminate |
JPS58148969A (en) * | 1982-03-02 | 1983-09-05 | Toshiba Corp | Measuring device of alternating-current signal level |
JP2000043009A (en) * | 1998-07-29 | 2000-02-15 | Kisen Kk | Compression mold for wood |
JP2005014384A (en) * | 2003-06-25 | 2005-01-20 | Matsushita Electric Works Ltd | Plate for press-forming |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI399282B (en) * | 2010-07-14 | 2013-06-21 | Advanced Int Multitech Co Ltd | A method of making a polygonal continuous side frame with a prepreg |
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