MY119066A - Copper-clad paper-based laminate and process for producing the same - Google Patents

Copper-clad paper-based laminate and process for producing the same

Info

Publication number
MY119066A
MY119066A MYPI9401755A MY119066A MY 119066 A MY119066 A MY 119066A MY PI9401755 A MYPI9401755 A MY PI9401755A MY 119066 A MY119066 A MY 119066A
Authority
MY
Malaysia
Prior art keywords
copper
based laminate
producing
same
clad paper
Prior art date
Application number
Inventor
Yoshinori Kanao
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of MY119066A publication Critical patent/MY119066A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/185—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles using adhesives
    • B29C2043/188—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles using adhesives thermosetting adhesives, e.g. polyurethane adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Abstract

THE PRESENT INVENTION PROVIDES A COPPER-CLAD PAPER-BASED LAMINATE COMPRISING A THERMOSETTING RESIN-IMPREGNATED PAPER SUBSTRATE HAVING LAMINATED ON ONE OR BOTH SIDES THEREOF AN ELECTROLYTIC COPPER FOIL VIA AN ADHESIVE LAYER, WHEREIN SAID ELECTROLYTIC COPPER FOIL HAS AN ELONGATION OF NOT LESS THAN 8.5AT 180°C AND HAS UNDERGONE GIANT CRYSTAL GROWTH, AND A PROCESS FOR PRODUCING THE ABOVE-MENTIONED COPPER-CLAD PAPER-BASED LAMINATE.
MYPI9401755 1993-07-22 1994-07-06 Copper-clad paper-based laminate and process for producing the same MY119066A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5201272A JPH0732544A (en) 1993-07-22 1993-07-22 Coppered laminate with paper base and its manufacture

Publications (1)

Publication Number Publication Date
MY119066A true MY119066A (en) 2005-03-31

Family

ID=16438212

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI9401755 MY119066A (en) 1993-07-22 1994-07-06 Copper-clad paper-based laminate and process for producing the same

Country Status (2)

Country Link
JP (1) JPH0732544A (en)
MY (1) MY119066A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5829669A (en) 1997-02-06 1998-11-03 Sonoco Products Company Tubular container and methods and apparatus for manufacturing same
US5846619A (en) 1997-02-06 1998-12-08 Sonoco Products Company Polymeric liner ply for tubular containers and methods and apparatus for manufacturing same
JP3396465B2 (en) 2000-08-25 2003-04-14 三井金属鉱業株式会社 Copper clad laminate
JP4298597B2 (en) 2004-07-01 2009-07-22 日東電工株式会社 Wiring circuit board and method for manufacturing wiring circuit board
TW200847867A (en) * 2007-04-26 2008-12-01 Mitsui Mining & Smelting Co Printed wire board and manufacturing method thereof, and electrolytic copper foil for copper-clad lamination board used for manufacturing the same

Also Published As

Publication number Publication date
JPH0732544A (en) 1995-02-03

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