MXPA02006173A - PATILLAS TERMINALES CON PESTAnA PARA CONVERTIDORES CC/CC. - Google Patents

PATILLAS TERMINALES CON PESTAnA PARA CONVERTIDORES CC/CC.

Info

Publication number
MXPA02006173A
MXPA02006173A MXPA02006173A MXPA02006173A MXPA02006173A MX PA02006173 A MXPA02006173 A MX PA02006173A MX PA02006173 A MXPA02006173 A MX PA02006173A MX PA02006173 A MXPA02006173 A MX PA02006173A MX PA02006173 A MXPA02006173 A MX PA02006173A
Authority
MX
Mexico
Prior art keywords
terminal pins
dcdc converters
flanged terminal
flanged
dcdc
Prior art date
Application number
MXPA02006173A
Other languages
English (en)
Inventor
Lennart Pitzele
Original Assignee
Synqor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Synqor Inc filed Critical Synqor Inc
Publication of MXPA02006173A publication Critical patent/MXPA02006173A/es

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1417Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142Spacers not being card guides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/042Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/1075Shape details
    • H05K2201/1081Special cross-section of a lead; Different cross-sections of different leads; Matching cross-section, e.g. matched to a land
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/1075Shape details
    • H05K2201/10871Leads having an integral insert stop
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0502Patterning and lithography
    • H05K2203/0545Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308Adaptations of leads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3485Applying solder paste, slurry or powder
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49165Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Dc-Dc Converters (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Rectifiers (AREA)
MXPA02006173A 1999-12-20 2000-12-19 PATILLAS TERMINALES CON PESTAnA PARA CONVERTIDORES CC/CC. MXPA02006173A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17288299P 1999-12-20 1999-12-20
PCT/US2000/034577 WO2001047328A1 (en) 1999-12-20 2000-12-19 Flanged terminal pins for dc/dc converters

Publications (1)

Publication Number Publication Date
MXPA02006173A true MXPA02006173A (es) 2003-09-25

Family

ID=22629591

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA02006173A MXPA02006173A (es) 1999-12-20 2000-12-19 PATILLAS TERMINALES CON PESTAnA PARA CONVERTIDORES CC/CC.

Country Status (8)

Country Link
US (1) US6545890B2 (es)
EP (1) EP1243166A1 (es)
JP (1) JP2003518759A (es)
CN (1) CN1425269A (es)
AU (1) AU2441901A (es)
CA (1) CA2395651A1 (es)
MX (1) MXPA02006173A (es)
WO (1) WO2001047328A1 (es)

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US6933449B2 (en) * 2002-07-10 2005-08-23 Intel Corporation Selective area solder placement
US6791845B2 (en) * 2002-09-26 2004-09-14 Fci Americas Technology, Inc. Surface mounted electrical components
US7025604B2 (en) * 2003-03-31 2006-04-11 Astec International Limited High current output pin
FR2854761A1 (fr) * 2003-05-05 2004-11-12 Sagem Procede de fixation de cosses de connexion sur un circuit imprime
US20050286273A1 (en) * 2004-06-25 2005-12-29 Andrew Ferencz Self-drive for synchronous rectifiers
US7462783B2 (en) * 2004-08-02 2008-12-09 Texas Instruments Incorporated Semiconductor package having a grid array of pin-attached balls
JP2007116013A (ja) 2005-10-24 2007-05-10 Renesas Technology Corp 半導体装置及びそれを用いた電源装置
US8164406B2 (en) * 2006-05-26 2012-04-24 Delta Electronics, Inc. Transformer
JP4995527B2 (ja) * 2006-09-28 2012-08-08 日本電波工業株式会社 表面実装用の圧電発振器
JP2009164173A (ja) * 2007-12-28 2009-07-23 Fujitsu Ltd 基板ユニットおよびその製造方法
TWM359132U (en) * 2009-02-12 2009-06-11 nai-qian Zhang Sound socket connector with built-in sound-effect processing function
JP2010198427A (ja) * 2009-02-26 2010-09-09 Panasonic Corp 回路基板モジュール及びこれを備えた電子機器
CN102214863A (zh) * 2010-04-07 2011-10-12 鸿富锦精密工业(深圳)有限公司 电路板组合及其板间连接架
US9119327B2 (en) 2010-10-26 2015-08-25 Tdk-Lambda Corporation Thermal management system and method
US9520772B2 (en) 2010-11-09 2016-12-13 Tdk-Lambda Corporation Multi-level voltage regulator system
US8934267B2 (en) 2010-11-09 2015-01-13 Tdk-Lambda Corporation Loosely regulated feedback control for high efficiency isolated DC-DC converters
WO2012115556A1 (en) * 2011-02-25 2012-08-30 Telefonaktiebolaget L M Ericsson (Publ) A method for mounting connection pins in a component carrier, a die tool for mounting connection pins, a component carrier forming a module for an electronic assembly, and such an assembly
US9093775B2 (en) 2011-02-25 2015-07-28 Telefonaktiebolaget L M Ericsson (Publ) Connection pin for mounting in a component carrier, a method for producing an electronic assembly comprising a motherboard with stackable modules comprising a component carrier, and such an electronic assembly
US9363916B2 (en) 2011-02-25 2016-06-07 Telefonaktiebolaget Lm Ericsson (Publ) Connection pin and a method for mounting a connection pin in a component carrier for an electronic assembly, and such a component carrier comprising connection pins
JP5893868B2 (ja) * 2011-08-12 2016-03-23 シャープ株式会社 発光装置
US9153886B2 (en) * 2012-10-26 2015-10-06 Continental Automotive Systems, Inc. Pin header assembly and method of forming the same
JP2014102884A (ja) * 2012-11-16 2014-06-05 Nec Network Products Ltd 電子部品およびこれの取り付け構造
CN104812156A (zh) * 2014-01-23 2015-07-29 台达电子企业管理(上海)有限公司 插销以及印刷电路板
JP2015185774A (ja) * 2014-03-25 2015-10-22 テンパール工業株式会社 リードピン
DE102014109220A1 (de) * 2014-07-01 2016-01-07 Endress + Hauser Gmbh + Co. Kg Leiterplattenverbindungselement
US10331161B2 (en) 2014-12-24 2019-06-25 Fujitsu Limited Power supply board
CN106298713A (zh) * 2015-06-09 2017-01-04 台达电子工业股份有限公司 一种垂直连接的功率模块及其堆叠连接的引脚
CN105261571B (zh) * 2015-09-21 2018-04-20 北京新雷能科技股份有限公司 一种混合集成电路管壳针与基板连接装置及其制作方法
US10617007B2 (en) * 2016-03-17 2020-04-07 Telefonaktiebolaget Lm Ericsson (Publ) Printed circuit board, a terminal and a method of assembling a printed circuit board module
US10098267B1 (en) 2017-06-06 2018-10-09 Robert Bosch Llc Housing for a camera and method of manufacture
US10959343B2 (en) * 2017-08-25 2021-03-23 Hewlett Packard Enterprise Development Lp Integrated stand-offs for printed circuit boards
CN107994341B (zh) * 2017-11-08 2021-08-13 湖北三江航天险峰电子信息有限公司 一种天线馈电结构
CN107889376A (zh) * 2017-12-19 2018-04-06 成都芯通软件有限公司 一种hfc机械衰减插片焊接结构及焊接基座
CN109996387A (zh) * 2017-12-29 2019-07-09 杭州嘉楠耘智信息科技有限公司 电路板上器件的双面固定结构与方法
CN110072335B (zh) * 2019-05-30 2021-03-02 环维电子(上海)有限公司 一种印刷电路板、电子设备以及制造方法
KR20200142961A (ko) * 2019-06-14 2020-12-23 현대자동차주식회사 저소음 릴레이
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Also Published As

Publication number Publication date
US20010030882A1 (en) 2001-10-18
US6545890B2 (en) 2003-04-08
EP1243166A1 (en) 2002-09-25
JP2003518759A (ja) 2003-06-10
WO2001047328A1 (en) 2001-06-28
CA2395651A1 (en) 2001-06-28
CN1425269A (zh) 2003-06-18
AU2441901A (en) 2001-07-03

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