MXPA02006173A - PATILLAS TERMINALES CON PESTAnA PARA CONVERTIDORES CC/CC. - Google Patents
PATILLAS TERMINALES CON PESTAnA PARA CONVERTIDORES CC/CC.Info
- Publication number
- MXPA02006173A MXPA02006173A MXPA02006173A MXPA02006173A MXPA02006173A MX PA02006173 A MXPA02006173 A MX PA02006173A MX PA02006173 A MXPA02006173 A MX PA02006173A MX PA02006173 A MXPA02006173 A MX PA02006173A MX PA02006173 A MXPA02006173 A MX PA02006173A
- Authority
- MX
- Mexico
- Prior art keywords
- terminal pins
- dcdc converters
- flanged terminal
- flanged
- dcdc
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
- H05K7/142—Spacers not being card guides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/1081—Special cross-section of a lead; Different cross-sections of different leads; Matching cross-section, e.g. matched to a land
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10871—Leads having an integral insert stop
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Dc-Dc Converters (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Combinations Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Rectifiers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17288299P | 1999-12-20 | 1999-12-20 | |
PCT/US2000/034577 WO2001047328A1 (en) | 1999-12-20 | 2000-12-19 | Flanged terminal pins for dc/dc converters |
Publications (1)
Publication Number | Publication Date |
---|---|
MXPA02006173A true MXPA02006173A (es) | 2003-09-25 |
Family
ID=22629591
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MXPA02006173A MXPA02006173A (es) | 1999-12-20 | 2000-12-19 | PATILLAS TERMINALES CON PESTAnA PARA CONVERTIDORES CC/CC. |
Country Status (8)
Country | Link |
---|---|
US (1) | US6545890B2 (es) |
EP (1) | EP1243166A1 (es) |
JP (1) | JP2003518759A (es) |
CN (1) | CN1425269A (es) |
AU (1) | AU2441901A (es) |
CA (1) | CA2395651A1 (es) |
MX (1) | MXPA02006173A (es) |
WO (1) | WO2001047328A1 (es) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW406454B (en) | 1996-10-10 | 2000-09-21 | Berg Tech Inc | High density connector and method of manufacture |
US6933449B2 (en) * | 2002-07-10 | 2005-08-23 | Intel Corporation | Selective area solder placement |
US6791845B2 (en) * | 2002-09-26 | 2004-09-14 | Fci Americas Technology, Inc. | Surface mounted electrical components |
US7025604B2 (en) * | 2003-03-31 | 2006-04-11 | Astec International Limited | High current output pin |
FR2854761A1 (fr) * | 2003-05-05 | 2004-11-12 | Sagem | Procede de fixation de cosses de connexion sur un circuit imprime |
US20050286273A1 (en) * | 2004-06-25 | 2005-12-29 | Andrew Ferencz | Self-drive for synchronous rectifiers |
US7462783B2 (en) * | 2004-08-02 | 2008-12-09 | Texas Instruments Incorporated | Semiconductor package having a grid array of pin-attached balls |
JP2007116013A (ja) | 2005-10-24 | 2007-05-10 | Renesas Technology Corp | 半導体装置及びそれを用いた電源装置 |
US8164406B2 (en) * | 2006-05-26 | 2012-04-24 | Delta Electronics, Inc. | Transformer |
JP4995527B2 (ja) * | 2006-09-28 | 2012-08-08 | 日本電波工業株式会社 | 表面実装用の圧電発振器 |
JP2009164173A (ja) * | 2007-12-28 | 2009-07-23 | Fujitsu Ltd | 基板ユニットおよびその製造方法 |
TWM359132U (en) * | 2009-02-12 | 2009-06-11 | nai-qian Zhang | Sound socket connector with built-in sound-effect processing function |
JP2010198427A (ja) * | 2009-02-26 | 2010-09-09 | Panasonic Corp | 回路基板モジュール及びこれを備えた電子機器 |
CN102214863A (zh) * | 2010-04-07 | 2011-10-12 | 鸿富锦精密工业(深圳)有限公司 | 电路板组合及其板间连接架 |
US9119327B2 (en) | 2010-10-26 | 2015-08-25 | Tdk-Lambda Corporation | Thermal management system and method |
US9520772B2 (en) | 2010-11-09 | 2016-12-13 | Tdk-Lambda Corporation | Multi-level voltage regulator system |
US8934267B2 (en) | 2010-11-09 | 2015-01-13 | Tdk-Lambda Corporation | Loosely regulated feedback control for high efficiency isolated DC-DC converters |
WO2012115556A1 (en) * | 2011-02-25 | 2012-08-30 | Telefonaktiebolaget L M Ericsson (Publ) | A method for mounting connection pins in a component carrier, a die tool for mounting connection pins, a component carrier forming a module for an electronic assembly, and such an assembly |
US9093775B2 (en) | 2011-02-25 | 2015-07-28 | Telefonaktiebolaget L M Ericsson (Publ) | Connection pin for mounting in a component carrier, a method for producing an electronic assembly comprising a motherboard with stackable modules comprising a component carrier, and such an electronic assembly |
US9363916B2 (en) | 2011-02-25 | 2016-06-07 | Telefonaktiebolaget Lm Ericsson (Publ) | Connection pin and a method for mounting a connection pin in a component carrier for an electronic assembly, and such a component carrier comprising connection pins |
JP5893868B2 (ja) * | 2011-08-12 | 2016-03-23 | シャープ株式会社 | 発光装置 |
US9153886B2 (en) * | 2012-10-26 | 2015-10-06 | Continental Automotive Systems, Inc. | Pin header assembly and method of forming the same |
JP2014102884A (ja) * | 2012-11-16 | 2014-06-05 | Nec Network Products Ltd | 電子部品およびこれの取り付け構造 |
CN104812156A (zh) * | 2014-01-23 | 2015-07-29 | 台达电子企业管理(上海)有限公司 | 插销以及印刷电路板 |
JP2015185774A (ja) * | 2014-03-25 | 2015-10-22 | テンパール工業株式会社 | リードピン |
DE102014109220A1 (de) * | 2014-07-01 | 2016-01-07 | Endress + Hauser Gmbh + Co. Kg | Leiterplattenverbindungselement |
US10331161B2 (en) | 2014-12-24 | 2019-06-25 | Fujitsu Limited | Power supply board |
CN106298713A (zh) * | 2015-06-09 | 2017-01-04 | 台达电子工业股份有限公司 | 一种垂直连接的功率模块及其堆叠连接的引脚 |
CN105261571B (zh) * | 2015-09-21 | 2018-04-20 | 北京新雷能科技股份有限公司 | 一种混合集成电路管壳针与基板连接装置及其制作方法 |
US10617007B2 (en) * | 2016-03-17 | 2020-04-07 | Telefonaktiebolaget Lm Ericsson (Publ) | Printed circuit board, a terminal and a method of assembling a printed circuit board module |
US10098267B1 (en) | 2017-06-06 | 2018-10-09 | Robert Bosch Llc | Housing for a camera and method of manufacture |
US10959343B2 (en) * | 2017-08-25 | 2021-03-23 | Hewlett Packard Enterprise Development Lp | Integrated stand-offs for printed circuit boards |
CN107994341B (zh) * | 2017-11-08 | 2021-08-13 | 湖北三江航天险峰电子信息有限公司 | 一种天线馈电结构 |
CN107889376A (zh) * | 2017-12-19 | 2018-04-06 | 成都芯通软件有限公司 | 一种hfc机械衰减插片焊接结构及焊接基座 |
CN109996387A (zh) * | 2017-12-29 | 2019-07-09 | 杭州嘉楠耘智信息科技有限公司 | 电路板上器件的双面固定结构与方法 |
CN110072335B (zh) * | 2019-05-30 | 2021-03-02 | 环维电子(上海)有限公司 | 一种印刷电路板、电子设备以及制造方法 |
KR20200142961A (ko) * | 2019-06-14 | 2020-12-23 | 현대자동차주식회사 | 저소음 릴레이 |
EP3968466A1 (en) * | 2020-09-14 | 2022-03-16 | IXYS Semiconductor GmbH | Electrical contact for semiconductor package |
US10950988B1 (en) | 2020-09-23 | 2021-03-16 | Lat Enterprises, Inc. | DC-DC conversion system |
JP7476980B2 (ja) | 2020-11-16 | 2024-05-01 | 株式会社村田製作所 | 回路モジュール及び大型回路システム |
BE1031418B1 (de) * | 2023-03-10 | 2024-10-08 | Thyssenkrupp Presta Ag | Power Pack für ein elektromechanisches Lenksystem eines Kraftfahrzeuges |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4046957A (en) | 1975-07-24 | 1977-09-06 | Taylor Industries, Inc. | Pin structure for modular wiring duct and wire holder system |
US4767343A (en) | 1986-08-11 | 1988-08-30 | Siemens Aktiengesellschaft | Electrical connection pin for surface-mountable electrical coils |
US4767344A (en) | 1986-08-22 | 1988-08-30 | Burndy Corporation | Solder mounting of electrical contacts |
US4990720A (en) | 1988-04-12 | 1991-02-05 | Kaufman Lance R | Circuit assembly and method with direct bonded terminal pin |
US4872846A (en) | 1988-07-21 | 1989-10-10 | Clark Thomas C | Solder containing electrical connector and method for making same |
JP3026830B2 (ja) * | 1990-09-28 | 2000-03-27 | イビデン株式会社 | プリント基板におけるスタンドオフピン |
US5055055A (en) | 1990-10-12 | 1991-10-08 | Elcon Products International Company | Circuit board connector system |
US5075821A (en) | 1990-11-05 | 1991-12-24 | Ro Associates | DC to DC converter apparatus |
US5167513A (en) | 1991-08-14 | 1992-12-01 | International Business Machines Corp. | Load limited pin for an electrical connector |
JPH05218613A (ja) * | 1992-01-31 | 1993-08-27 | Fujitsu Ltd | 回路モジュールの実装構造 |
US5257165A (en) | 1992-02-13 | 1993-10-26 | Jaton Technology Co., Ltd. | Pin grid array adaptor mounting hardware |
US5182536A (en) | 1992-07-01 | 1993-01-26 | At&T Bell Laboratories | Surface mount current transformer structure |
JPH0660923A (ja) * | 1992-08-07 | 1994-03-04 | Fujitsu Ltd | 金属ベースプリント板のリード端子実装構造 |
US5456608A (en) | 1993-08-25 | 1995-10-10 | Conx Corporation | Cross-connect system |
US5673479A (en) | 1993-12-20 | 1997-10-07 | Lsi Logic Corporation | Method for mounting a microelectronic circuit peripherally-leaded package including integral support member with spacer |
US5410452A (en) * | 1994-02-18 | 1995-04-25 | Aries Electronics, Inc. | Printed circuit board electrical adaptor pin |
US5621636A (en) | 1994-02-22 | 1997-04-15 | Nippon Steel Corporation | Thin DC-DC converter arrangement |
CN1037134C (zh) * | 1994-07-04 | 1998-01-21 | 松下电器产业株式会社 | 集成电路装置 |
US5743009A (en) | 1995-04-07 | 1998-04-28 | Hitachi, Ltd. | Method of making multi-pin connector |
JP2987101B2 (ja) | 1996-04-15 | 1999-12-06 | 株式会社ニッシン | 半導体装置の接続方法並びに半導体装置の接続器 |
US5952716A (en) | 1997-04-16 | 1999-09-14 | International Business Machines Corporation | Pin attach structure for an electronic package |
US6230403B1 (en) * | 1997-11-06 | 2001-05-15 | Vlt Corporation | Interconnection system |
-
2000
- 2000-12-19 CA CA002395651A patent/CA2395651A1/en not_active Abandoned
- 2000-12-19 JP JP2001547929A patent/JP2003518759A/ja active Pending
- 2000-12-19 EP EP00988186A patent/EP1243166A1/en not_active Withdrawn
- 2000-12-19 CN CN00818553A patent/CN1425269A/zh active Pending
- 2000-12-19 AU AU24419/01A patent/AU2441901A/en not_active Abandoned
- 2000-12-19 US US09/740,707 patent/US6545890B2/en not_active Expired - Lifetime
- 2000-12-19 WO PCT/US2000/034577 patent/WO2001047328A1/en not_active Application Discontinuation
- 2000-12-19 MX MXPA02006173A patent/MXPA02006173A/es unknown
Also Published As
Publication number | Publication date |
---|---|
US20010030882A1 (en) | 2001-10-18 |
US6545890B2 (en) | 2003-04-08 |
EP1243166A1 (en) | 2002-09-25 |
JP2003518759A (ja) | 2003-06-10 |
WO2001047328A1 (en) | 2001-06-28 |
CA2395651A1 (en) | 2001-06-28 |
CN1425269A (zh) | 2003-06-18 |
AU2441901A (en) | 2001-07-03 |
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