MXPA02000948A - Termistor y metodo de fabricacion. - Google Patents

Termistor y metodo de fabricacion.

Info

Publication number
MXPA02000948A
MXPA02000948A MXPA02000948A MXPA02000948A MXPA02000948A MX PA02000948 A MXPA02000948 A MX PA02000948A MX PA02000948 A MXPA02000948 A MX PA02000948A MX PA02000948 A MXPA02000948 A MX PA02000948A MX PA02000948 A MXPA02000948 A MX PA02000948A
Authority
MX
Mexico
Prior art keywords
thermistor
layer
manufacture
metal layer
optionally
Prior art date
Application number
MXPA02000948A
Other languages
English (en)
Inventor
Lavenuta Gregg
Original Assignee
Cornerstone Sensors Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cornerstone Sensors Inc filed Critical Cornerstone Sensors Inc
Publication of MXPA02000948A publication Critical patent/MXPA02000948A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L67/00—Network arrangements or protocols for supporting network services or applications
    • H04L67/01—Protocols
    • H04L67/02—Protocols based on web technology, e.g. hypertext transfer protocol [HTTP]
    • H04L67/025—Protocols based on web technology, e.g. hypertext transfer protocol [HTTP] for remote control or remote monitoring of applications
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • G01K7/226—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor using microstructures, e.g. silicon spreading resistance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1413—Terminals or electrodes formed on resistive elements having negative temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/288—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thin film techniques
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L67/00—Network arrangements or protocols for supporting network services or applications
    • H04L67/01—Protocols
    • H04L67/02—Protocols based on web technology, e.g. hypertext transfer protocol [HTTP]
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
    • H04L9/40—Network security protocols
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L69/00—Network arrangements, protocols or services independent of the application payload and not provided for in the other groups of this subclass
    • H04L69/30—Definitions, standards or architectural aspects of layered protocol stacks
    • H04L69/32—Architecture of open systems interconnection [OSI] 7-layer type protocol stacks, e.g. the interfaces between the data link level and the physical level
    • H04L69/322—Intralayer communication protocols among peer entities or protocol data unit [PDU] definitions
    • H04L69/329—Intralayer communication protocols among peer entities or protocol data unit [PDU] definitions in the application layer [OSI layer 7]
MXPA02000948A 2001-01-26 2002-12-11 Termistor y metodo de fabricacion. MXPA02000948A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/770,566 US6498561B2 (en) 2001-01-26 2001-01-26 Thermistor and method of manufacture

Publications (1)

Publication Number Publication Date
MXPA02000948A true MXPA02000948A (es) 2003-08-20

Family

ID=25088994

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA02000948A MXPA02000948A (es) 2001-01-26 2002-12-11 Termistor y metodo de fabricacion.

Country Status (13)

Country Link
US (3) US6498561B2 (es)
EP (1) EP1227308B1 (es)
JP (1) JP4033331B2 (es)
KR (1) KR100854413B1 (es)
CN (1) CN1265399C (es)
AT (1) ATE323278T1 (es)
AU (1) AU776754B2 (es)
DE (1) DE60210522T2 (es)
HK (1) HK1048885B (es)
MX (1) MXPA02000948A (es)
MY (1) MY127800A (es)
SG (1) SG106655A1 (es)
TW (1) TW535172B (es)

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US20110188166A1 (en) * 2008-07-10 2011-08-04 Hiroyuki Koyama PTC Device and Electrical Apparatus Containing the Same
JP5832007B2 (ja) * 2009-12-25 2015-12-16 三菱マテリアル株式会社 赤外線センサ及びその製造方法
JP5381942B2 (ja) * 2010-09-17 2014-01-08 オムロンヘルスケア株式会社 電子体温計およびその製造方法
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KR101646711B1 (ko) * 2014-04-25 2016-08-09 (주) 래트론 온도 센서 소자 및 그 제조 방법
DE102014110553A1 (de) * 2014-07-25 2016-01-28 Epcos Ag Sensorelement, Sensoranordnung und Verfahren zur Herstellung eines Sensorelements
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CN104299738B (zh) * 2014-09-18 2017-10-10 兴勤（常州）电子有限公司 一种电极电子组件及其制备方法
US11213423B2 (en) * 2015-03-31 2022-01-04 Zoll Circulation, Inc. Proximal mounting of temperature sensor in intravascular temperature management catheter
TWI555038B (zh) * 2015-06-09 2016-10-21 A negative temperature coefficient thermistor manufacturing method using a thick film material having a low resistivity and a high resistance temperature coefficient
CN105006317A (zh) * 2015-08-03 2015-10-28 成都顺康电子有限责任公司 一种玻璃封装ptc热敏电阻及其制作方法
DE102016101249A1 (de) * 2015-11-02 2017-05-04 Epcos Ag Sensorelement und Verfahren zur Herstellung eines Sensorelements
CN109791838B (zh) * 2016-10-07 2022-07-19 世美特株式会社 焊接用电子零件、安装基板及温度传感器
CN108281431B (zh) * 2018-01-04 2021-01-05 Tcl华星光电技术有限公司 一种用于薄膜晶体管阵列基板的湿制程的方法
US11525739B2 (en) * 2018-05-08 2022-12-13 Texas Instruments Incorporated Thermistor die-based thermal probe
JP2020087950A (ja) * 2018-11-14 2020-06-04 株式会社Flosfia サーミスタ膜、サーミスタ膜を有するサーミスタ素子およびその製造方法
JP2020087948A (ja) * 2018-11-14 2020-06-04 株式会社Flosfia サーミスタ膜、サーミスタ膜を有するサーミスタ素子およびその製造方法
JP2020087949A (ja) * 2018-11-14 2020-06-04 株式会社Flosfia サーミスタ膜、サーミスタ膜を有するサーミスタ素子およびその製造方法
JP2020087951A (ja) * 2018-11-14 2020-06-04 株式会社Flosfia 積層構造体、積層構造体を有するサーミスタ素子およびその製造方法
JP2020087947A (ja) * 2018-11-14 2020-06-04 株式会社Flosfia サーミスタ薄膜、サーミスタ薄膜を有するサーミスタ素子およびその製造方法
EP3994710A1 (de) * 2019-07-05 2022-05-11 TDK Electronics AG Ntc-dünnschichtthermistor und verfahren zur herstellung eines ntc-dünnschichtthermistors
KR20210012559A (ko) 2019-07-25 2021-02-03 삼성에스디아이 주식회사 배터리 팩
KR20210012554A (ko) 2019-07-25 2021-02-03 삼성에스디아이 주식회사 배터리 팩
KR102222116B1 (ko) 2019-07-25 2021-03-03 삼성에스디아이 주식회사 배터리 팩
CN111029065A (zh) * 2019-12-31 2020-04-17 广东爱晟电子科技有限公司 一种高精度高可靠Ir-Cu-Au复合电极热敏芯片
DE102021118566A1 (de) 2021-07-19 2023-01-19 Tdk Electronics Ag Verfahren zur Herstellung von NTC-Senoren

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Also Published As

Publication number Publication date
DE60210522T2 (de) 2006-12-07
SG106655A1 (en) 2004-10-29
US6498561B2 (en) 2002-12-24
EP1227308B1 (en) 2006-04-12
AU1353902A (en) 2002-08-01
JP2002305102A (ja) 2002-10-18
DE60210522D1 (de) 2006-05-24
MY127800A (en) 2006-12-29
CN1367497A (zh) 2002-09-04
EP1227308A1 (en) 2002-07-31
US6660554B2 (en) 2003-12-09
TW535172B (en) 2003-06-01
US20020101327A1 (en) 2002-08-01
JP4033331B2 (ja) 2008-01-16
US20020101326A1 (en) 2002-08-01
US8373535B2 (en) 2013-02-12
HK1048885A1 (en) 2003-04-17
KR100854413B1 (ko) 2008-08-26
HK1048885B (zh) 2006-10-20
ATE323278T1 (de) 2006-04-15
CN1265399C (zh) 2006-07-19
US20030128098A1 (en) 2003-07-10
KR20020063121A (ko) 2002-08-01
AU776754B2 (en) 2004-09-23

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