MX9305988A - Tecnica de exploracion simetrica para ablacion por laser. - Google Patents

Tecnica de exploracion simetrica para ablacion por laser.

Info

Publication number
MX9305988A
MX9305988A MX9305988A MX9305988A MX9305988A MX 9305988 A MX9305988 A MX 9305988A MX 9305988 A MX9305988 A MX 9305988A MX 9305988 A MX9305988 A MX 9305988A MX 9305988 A MX9305988 A MX 9305988A
Authority
MX
Mexico
Prior art keywords
symmetrical
laser ablation
exploration technique
ablation
exploration
Prior art date
Application number
MX9305988A
Other languages
English (en)
Inventor
Eric Chan
Original Assignee
Bausch & Lomb
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bausch & Lomb filed Critical Bausch & Lomb
Publication of MX9305988A publication Critical patent/MX9305988A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0734—Shaping the laser spot into an annular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • B29L2011/0016—Lenses
    • B29L2011/0041—Contact lenses
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146—Laser beam

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Eyeglasses (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

Se describen métodos mejorados para modificar superficies blanco medianteablación que dan lugar a la reducción de la redeposición del residuo deablación en la superficie blanco.
MX9305988A 1992-09-29 1993-09-28 Tecnica de exploracion simetrica para ablacion por laser. MX9305988A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US95485892A 1992-09-29 1992-09-29

Publications (1)

Publication Number Publication Date
MX9305988A true MX9305988A (es) 1995-01-31

Family

ID=25496026

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9305988A MX9305988A (es) 1992-09-29 1993-09-28 Tecnica de exploracion simetrica para ablacion por laser.

Country Status (5)

Country Link
US (1) US5498508A (es)
CN (1) CN1091080A (es)
AU (1) AU4660193A (es)
MX (1) MX9305988A (es)
WO (1) WO1994007639A1 (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1128591A (ja) * 1997-07-07 1999-02-02 Hitachi Electron Eng Co Ltd テクスチャ加工装置
DE19902909C2 (de) * 1999-01-26 2001-03-15 Fraunhofer Ges Forschung Vorrichtung und Verfahren zum Bearbeiten von Werkstücken mit Laserstrahlung
ATE346323T1 (de) 2000-05-25 2006-12-15 Novartis Pharma Gmbh Kontaktlinse mit gespritzter inversionsmarkierung
DE10032082A1 (de) * 2000-07-01 2002-01-10 Volkswagen Ag Vorrichtung und Verfahren zum Bearbeiten einer Innenfläche einer zylinderförmigen Bohrung
DE10218141A1 (de) * 2002-04-29 2003-11-13 Stiefelmayer Gmbh & Co Kg C Verfahren zur Laser-Wärmebehandlung von Werkstücken
WO2005122694A2 (en) 2004-06-21 2005-12-29 Alex Rapoport Thermal energy applicator
JP5902400B2 (ja) 2011-04-26 2016-04-13 トヨタ自動車株式会社 レーザ溶接装置、レーザ溶接方法、鋼板積層体の製造方法及び積層体のレーザ溶接による溶接構造
CN110614766A (zh) * 2019-09-23 2019-12-27 华中科技大学 一种多光束增材制造设备及方法
DE102021200021A1 (de) * 2021-01-05 2022-07-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Anordnung zur Ausrichtung, Rotation und/oder Formung eines Laserstrahls

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4417948A (en) * 1982-07-09 1983-11-29 International Business Machines Corporation Self developing, photoetching of polyesters by far UV radiation
JPS5913589A (ja) * 1982-07-16 1984-01-24 Toshiba Corp レ−ザ加工装置
US4568632A (en) * 1982-10-07 1986-02-04 International Business Machines Corporation Patterning of polyimide films with far ultraviolet light
US4414059A (en) * 1982-12-09 1983-11-08 International Business Machines Corporation Far UV patterning of resist materials
US4563565A (en) * 1983-03-02 1986-01-07 Minnesota Mining And Manufacturing Company Method for forming a peripheral edge on contact lenses
US4665913A (en) * 1983-11-17 1987-05-19 Lri L.P. Method for ophthalmological surgery
US4623776A (en) * 1985-01-03 1986-11-18 Dow Corning Corporation Ring of light laser optics system
US5061840A (en) * 1986-10-14 1991-10-29 Allergan, Inc. Manufacture of ophthalmic lenses by excimer laser
JPS63192582A (ja) * 1987-02-04 1988-08-09 Washino Kikai Kk レ−ザ加工機
EP0291459B1 (de) * 1987-05-15 1992-07-29 Ciba-Geigy Ag Verfahren zur abtragenden Bearbeitung von optischen Körpern aus vernetzten Polymeren
US4887592A (en) * 1987-06-02 1989-12-19 Hanspeter Loertscher Cornea laser-cutting apparatus
GB8802689D0 (en) * 1988-02-05 1988-03-02 Atomic Energy Authority Uk Laser scanning system
US5102409A (en) * 1988-04-22 1992-04-07 Balgorod Barry M Method and apparatus for modification of corneal refractive properties
US4909818A (en) * 1988-11-16 1990-03-20 Jones William F System and process for making diffractive contact
JP2520953B2 (ja) * 1989-02-13 1996-07-31 松下電器産業株式会社 レ―ザ―加工装置
EP0398082A1 (de) * 1989-05-19 1990-11-22 Siemens Aktiengesellschaft Verfahren zur Herstellung einer optischen Linse
US5170191A (en) * 1990-05-18 1992-12-08 Bausch & Lomb Incorporated Target domain profiling of target optical surfaces using excimer laser photoablation
US5061342A (en) * 1990-05-18 1991-10-29 Bausch & Lomb Incorporated Target domain profiling of target optical surfaces using excimer laser photoablation
JPH04182087A (ja) * 1990-11-17 1992-06-29 Kobe Steel Ltd レーザ加工用集光装置
JPH04182088A (ja) * 1990-11-17 1992-06-29 Kobe Steel Ltd レーザ加工用集光装置
IE912667A1 (en) * 1991-07-29 1993-02-10 Trinity College Dublin Laser Profiling of Lens Edge
US5256853A (en) * 1991-07-31 1993-10-26 Bausch & Lomb Incorporated Method for shaping contact lens surfaces
US5378582A (en) * 1992-09-29 1995-01-03 Bausch & Lomb Incorporated Symmetric sweep scanning technique for laser ablation
US5331131A (en) * 1992-09-29 1994-07-19 Bausch & Lomb Incorporated Scanning technique for laser ablation
US5359173A (en) * 1992-09-29 1994-10-25 Bausch & Lomb Incorporated Scanning technique for laser ablation
US5257706A (en) * 1992-09-29 1993-11-02 Bausch & Lomb Incorporated Method of cleaning laser ablation debris

Also Published As

Publication number Publication date
US5498508A (en) 1996-03-12
AU4660193A (en) 1994-04-26
WO1994007639A1 (en) 1994-04-14
CN1091080A (zh) 1994-08-24

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