MX9305369A - Tecnica de exploracion para ablacion por laser. - Google Patents

Tecnica de exploracion para ablacion por laser.

Info

Publication number
MX9305369A
MX9305369A MX9305369A MX9305369A MX9305369A MX 9305369 A MX9305369 A MX 9305369A MX 9305369 A MX9305369 A MX 9305369A MX 9305369 A MX9305369 A MX 9305369A MX 9305369 A MX9305369 A MX 9305369A
Authority
MX
Mexico
Prior art keywords
laser ablation
exploration technique
ablation
exploration
technique
Prior art date
Application number
MX9305369A
Other languages
English (en)
Inventor
Kenneth L Opdyke
Original Assignee
Bausch & Lomb
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bausch & Lomb filed Critical Bausch & Lomb
Publication of MX9305369A publication Critical patent/MX9305369A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • B29L2011/0016—Lenses
    • B29L2011/0041—Contact lenses

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

Se describen métodos mejorados para modificar superficies blanco mediante ablación que dan lugar a la reducción de la redeposición del residuo de ablación en la superficie blanco.
MX9305369A 1992-09-29 1993-09-02 Tecnica de exploracion para ablacion por laser. MX9305369A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/953,399 US5331131A (en) 1992-09-29 1992-09-29 Scanning technique for laser ablation

Publications (1)

Publication Number Publication Date
MX9305369A true MX9305369A (es) 1994-05-31

Family

ID=25493938

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9305369A MX9305369A (es) 1992-09-29 1993-09-02 Tecnica de exploracion para ablacion por laser.

Country Status (5)

Country Link
US (1) US5331131A (es)
CN (1) CN1085144A (es)
AU (1) AU4660393A (es)
MX (1) MX9305369A (es)
WO (1) WO1994007640A1 (es)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU4660193A (en) * 1992-09-29 1994-04-26 Bausch & Lomb Incorporated Symmetric scanning technique for laser ablation
US5359173A (en) * 1992-09-29 1994-10-25 Bausch & Lomb Incorporated Scanning technique for laser ablation
US5632742A (en) 1994-04-25 1997-05-27 Autonomous Technologies Corp. Eye movement sensing method and system
US5980513A (en) 1994-04-25 1999-11-09 Autonomous Technologies Corp. Laser beam delivery and eye tracking system
US5780805A (en) * 1995-05-03 1998-07-14 Gerber Garment Technology, Inc. Pattern shifting laser cutter
US5920560A (en) * 1995-08-23 1999-07-06 Fujitsu Limited Multi-connection management method and apparatus for switch system
US20010041884A1 (en) * 1996-11-25 2001-11-15 Frey Rudolph W. Method for determining and correcting vision
IL121890A (en) * 1997-10-06 2000-11-21 Dov Zahavi Laser assisted polishing
EP1158339B1 (en) 2000-05-25 2006-11-22 Novartis AG Contact lens with moulded inversion mark
US20020110766A1 (en) * 2001-02-09 2002-08-15 Industrial Technology Research Institute Process method of using excimer laser for forming micro spherical and non-spherical polymeric structure array
DE10317579B4 (de) * 2003-04-16 2016-04-14 Lasertec Gmbh Verfahren und Vorrichtung zur Herstellung eines Gesenks in einem Werkstück
US7361171B2 (en) 2003-05-20 2008-04-22 Raydiance, Inc. Man-portable optical ablation system
DE10324439B4 (de) * 2003-05-28 2008-01-31 Lasertec Gmbh Verfahren und Vorrichtung zur Herstellung eines Gesenks
US8173929B1 (en) 2003-08-11 2012-05-08 Raydiance, Inc. Methods and systems for trimming circuits
US9022037B2 (en) 2003-08-11 2015-05-05 Raydiance, Inc. Laser ablation method and apparatus having a feedback loop and control unit
US8921733B2 (en) 2003-08-11 2014-12-30 Raydiance, Inc. Methods and systems for trimming circuits
TWI380868B (zh) * 2005-02-02 2013-01-01 Mitsuboshi Diamond Ind Co Ltdl Fine processing method of sintered diamond using laser, cutter wheel for brittle material substrate, and method of manufacturing the same
US8135050B1 (en) 2005-07-19 2012-03-13 Raydiance, Inc. Automated polarization correction
US7444049B1 (en) 2006-01-23 2008-10-28 Raydiance, Inc. Pulse stretcher and compressor including a multi-pass Bragg grating
US8232687B2 (en) 2006-04-26 2012-07-31 Raydiance, Inc. Intelligent laser interlock system
US8189971B1 (en) 2006-01-23 2012-05-29 Raydiance, Inc. Dispersion compensation in a chirped pulse amplification system
US7822347B1 (en) 2006-03-28 2010-10-26 Raydiance, Inc. Active tuning of temporal dispersion in an ultrashort pulse laser system
US8125704B2 (en) 2008-08-18 2012-02-28 Raydiance, Inc. Systems and methods for controlling a pulsed laser by combining laser signals
WO2012021748A1 (en) 2010-08-12 2012-02-16 Raydiance, Inc. Polymer tubing laser micromachining
WO2012037468A1 (en) 2010-09-16 2012-03-22 Raydiance, Inc. Singulation of layered materials using selectively variable laser output
EP2684636B1 (en) * 2011-03-08 2017-12-13 Kawasaki Jukogyo Kabushiki Kaisha Laser machining device with an optical scanning device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4417948A (en) * 1982-07-09 1983-11-29 International Business Machines Corporation Self developing, photoetching of polyesters by far UV radiation
US4568632A (en) * 1982-10-07 1986-02-04 International Business Machines Corporation Patterning of polyimide films with far ultraviolet light
US4563565A (en) * 1983-03-02 1986-01-07 Minnesota Mining And Manufacturing Company Method for forming a peripheral edge on contact lenses
CA1284823C (en) * 1985-10-22 1991-06-11 Kenneth K. York Systems and methods for creating rounded work surfaces by photoablation
US4785161A (en) * 1986-07-21 1988-11-15 Control Data Corporation Laser machining for producing very small parts
US5053171A (en) * 1986-10-14 1991-10-01 Allergan, Inc. Manufacture of ophthalmic lenses by excimer laser
DE3731398A1 (de) * 1987-09-18 1989-04-06 Zeiss Carl Fa Verfahren zum erzeugen einer kennzeichnung und/oder markierung auf einer brillenlinse
DE3809211A1 (de) * 1988-03-18 1989-10-05 Max Planck Gesellschaft Verfahren zur ablation von polymeren kunststoffen mittels ultrakurzer laserstrahlungsimpulse
EP0398082A1 (de) * 1989-05-19 1990-11-22 Siemens Aktiengesellschaft Verfahren zur Herstellung einer optischen Linse
JPH03161182A (ja) * 1989-11-15 1991-07-11 Toshiba Corp レーザマーキング方法
US5130512A (en) * 1989-12-21 1992-07-14 Coyle Jr Richard J Fabrication of optical components utilizing a laser
US5091626A (en) * 1990-02-02 1992-02-25 Hadassah Medical Organization Method for the ablative reshaping of material surfaces
US5061342A (en) * 1990-05-18 1991-10-29 Bausch & Lomb Incorporated Target domain profiling of target optical surfaces using excimer laser photoablation

Also Published As

Publication number Publication date
WO1994007640A1 (en) 1994-04-14
AU4660393A (en) 1994-04-26
CN1085144A (zh) 1994-04-13
US5331131A (en) 1994-07-19

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