MX9303106A - Metodo para la fabricacion de un material flexible que contiene ester de cianato y formulacion adhesiva flexible que comprende el producto de reaccion de tal metodo. - Google Patents

Metodo para la fabricacion de un material flexible que contiene ester de cianato y formulacion adhesiva flexible que comprende el producto de reaccion de tal metodo.

Info

Publication number
MX9303106A
MX9303106A MX9303106A MX9303106A MX9303106A MX 9303106 A MX9303106 A MX 9303106A MX 9303106 A MX9303106 A MX 9303106A MX 9303106 A MX9303106 A MX 9303106A MX 9303106 A MX9303106 A MX 9303106A
Authority
MX
Mexico
Prior art keywords
flexible
manufacture
adhesive formulation
reaction product
material containing
Prior art date
Application number
MX9303106A
Other languages
English (en)
Inventor
My Nhu Nguyen
Yuan Yung Chien
Original Assignee
Johnson Matthey Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Matthey Inc filed Critical Johnson Matthey Inc
Publication of MX9303106A publication Critical patent/MX9303106A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C261/00—Derivatives of cyanic acid
    • C07C261/02—Cyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0016—Plasticisers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2224/838—Bonding techniques
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

La presente invención describe una formulación adhesiva flexible, para unir un dispositivo semiconductor a un substrato flexible y a una tarjeta flexible que contiene un dispositivo semiconductor que se puede procesar en una computadora.
MX9303106A 1992-05-28 1993-05-26 Metodo para la fabricacion de un material flexible que contiene ester de cianato y formulacion adhesiva flexible que comprende el producto de reaccion de tal metodo. MX9303106A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/890,618 US5250600A (en) 1992-05-28 1992-05-28 Low temperature flexible die attach adhesive and articles using same

Publications (1)

Publication Number Publication Date
MX9303106A true MX9303106A (es) 1994-06-30

Family

ID=25396903

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9303106A MX9303106A (es) 1992-05-28 1993-05-26 Metodo para la fabricacion de un material flexible que contiene ester de cianato y formulacion adhesiva flexible que comprende el producto de reaccion de tal metodo.

Country Status (4)

Country Link
US (4) US5250600A (es)
AU (1) AU4388493A (es)
MX (1) MX9303106A (es)
WO (1) WO1993024564A1 (es)

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US5648320A (en) * 1985-05-31 1997-07-15 Jacobs; Richard L. Method of manufacturing ceramic superconductor circuit board
US5371178A (en) * 1990-10-24 1994-12-06 Johnson Matthey Inc. Rapidly curing adhesive and method
US5250600A (en) * 1992-05-28 1993-10-05 Johnson Matthey Inc. Low temperature flexible die attach adhesive and articles using same
US5386000A (en) * 1990-10-24 1995-01-31 Johnson Matthey Inc. Low temperature flexible die attach adhesive and articles using same
US5524422A (en) * 1992-02-28 1996-06-11 Johnson Matthey Inc. Materials with low moisture outgassing properties and method of reducing moisture content of hermetic packages containing semiconductor devices
US5504374A (en) * 1994-02-14 1996-04-02 Lsi Logic Corporation Microcircuit package assembly utilizing large size die and low temperature curing organic die attach material
US5536855A (en) * 1994-03-04 1996-07-16 National Starch And Chemical Investment Holding Corporation Process for preparing glycidyl esters for use in electronics adhesives
US5480842A (en) * 1994-04-11 1996-01-02 At&T Corp. Method for fabricating thin, strong, and flexible die for smart cards
US5708129A (en) * 1995-04-28 1998-01-13 Johnson Matthey, Inc. Die attach adhesive with reduced resin bleed
US5817207A (en) 1995-10-17 1998-10-06 Leighton; Keith R. Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
US5719437A (en) * 1996-04-19 1998-02-17 Lucent Technologies Inc. Smart cards having thin die
US5783621A (en) * 1996-06-10 1998-07-21 Johnson Matthey, Inc. Method of decreasing bleed fom organic-based formulations and anti-bleed compositions
US5786988A (en) * 1996-07-02 1998-07-28 Sandisk Corporation Integrated circuit chips made bendable by forming indentations in their back surfaces flexible packages thereof and methods of manufacture
US5744533A (en) * 1997-06-04 1998-04-28 Johnson Matthey, Inc. Adhesive composition for bonding a semiconductor device
JP3936840B2 (ja) * 1997-12-22 2007-06-27 株式会社日立製作所 半導体装置およびその製造方法
JPH11224884A (ja) * 1998-02-05 1999-08-17 Lintec Corp 電気回路の封止構造体およびその製造方法
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US5250600A (en) 1993-10-05
AU4388493A (en) 1993-12-30
US5489637A (en) 1996-02-06
US5399907A (en) 1995-03-21
WO1993024564A1 (en) 1993-12-09

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