AU4925893A - Fast-curing adhesive of adjustable viscosity - Google Patents

Fast-curing adhesive of adjustable viscosity

Info

Publication number
AU4925893A
AU4925893A AU49258/93A AU4925893A AU4925893A AU 4925893 A AU4925893 A AU 4925893A AU 49258/93 A AU49258/93 A AU 49258/93A AU 4925893 A AU4925893 A AU 4925893A AU 4925893 A AU4925893 A AU 4925893A
Authority
AU
Australia
Prior art keywords
fast
curing adhesive
adjustable viscosity
viscosity
adjustable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU49258/93A
Inventor
Michael B Grosse
My Nhu Nguyen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JOHNSON MATTHEY Inc
Original Assignee
JOHNSON MATTHEY Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JOHNSON MATTHEY Inc filed Critical JOHNSON MATTHEY Inc
Publication of AU4925893A publication Critical patent/AU4925893A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
    • C08G73/065—Preparatory processes
    • C08G73/0655—Preparatory processes from polycyanurates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
AU49258/93A 1992-09-16 1993-09-16 Fast-curing adhesive of adjustable viscosity Abandoned AU4925893A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US94552192A 1992-09-16 1992-09-16
US945521 1992-09-16
PCT/US1993/008757 WO1994006844A1 (en) 1992-09-16 1993-09-16 Fast-curing adhesive of adjustable viscosity

Publications (1)

Publication Number Publication Date
AU4925893A true AU4925893A (en) 1994-04-12

Family

ID=25483213

Family Applications (1)

Application Number Title Priority Date Filing Date
AU49258/93A Abandoned AU4925893A (en) 1992-09-16 1993-09-16 Fast-curing adhesive of adjustable viscosity

Country Status (2)

Country Link
AU (1) AU4925893A (en)
WO (1) WO1994006844A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5250600A (en) * 1992-05-28 1993-10-05 Johnson Matthey Inc. Low temperature flexible die attach adhesive and articles using same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4831086A (en) * 1987-10-05 1989-05-16 Allied-Signal Inc. Cyanato group containing phenolic resins, phenolic triazines derived therefrom
AU597435B2 (en) * 1986-11-24 1990-05-31 Ciba-Geigy Ag Low viscosity noncrystalline dicyanate esters and blends with prepolymers of dicyanate esters
US5155066A (en) * 1990-10-24 1992-10-13 Johnson Matthey Inc. Rapid-curing adhesive formulation for semiconductor devices
US5150195A (en) * 1990-10-24 1992-09-22 Johnson Matthey Inc. Rapid-curing adhesive formulation for semiconductor devices

Also Published As

Publication number Publication date
WO1994006844A1 (en) 1994-03-31

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