MX9203831A - Soluciones viscosas para galvanoplastia sin electricidad. - Google Patents

Soluciones viscosas para galvanoplastia sin electricidad.

Info

Publication number
MX9203831A
MX9203831A MX9203831A MX9203831A MX9203831A MX 9203831 A MX9203831 A MX 9203831A MX 9203831 A MX9203831 A MX 9203831A MX 9203831 A MX9203831 A MX 9203831A MX 9203831 A MX9203831 A MX 9203831A
Authority
MX
Mexico
Prior art keywords
galvanoplasty
electricity
viscose solutions
viscose
solutions
Prior art date
Application number
MX9203831A
Other languages
English (en)
Inventor
Albert Wayne Morgan
Douglas Hydeyo Teramura
George Douglas Vaughn
Original Assignee
Monsanto Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Monsanto Co filed Critical Monsanto Co
Publication of MX9203831A publication Critical patent/MX9203831A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
MX9203831A 1991-07-01 1992-06-30 Soluciones viscosas para galvanoplastia sin electricidad. MX9203831A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/724,093 US5158604A (en) 1991-07-01 1991-07-01 Viscous electroless plating solutions

Publications (1)

Publication Number Publication Date
MX9203831A true MX9203831A (es) 1993-02-01

Family

ID=24908970

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9203831A MX9203831A (es) 1991-07-01 1992-06-30 Soluciones viscosas para galvanoplastia sin electricidad.

Country Status (4)

Country Link
US (1) US5158604A (es)
AU (1) AU2248192A (es)
MX (1) MX9203831A (es)
WO (1) WO1993001330A1 (es)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0539580A (ja) * 1991-08-02 1993-02-19 Okuno Seiyaku Kogyo Kk 無電解パラジウムめつき液
US5268024A (en) * 1992-07-31 1993-12-07 Rockwell International Corporation Formation of inorganic conductive coatings on substrates
FR2709769B1 (fr) * 1993-09-10 1995-12-01 Astreintes Routieres Hivernale Procédé et produit pour éliminer la glace ou la neige d'une surface de circulation.
US6042889A (en) * 1994-02-28 2000-03-28 International Business Machines Corporation Method for electrolessly depositing a metal onto a substrate using mediator ions
US6194032B1 (en) * 1997-10-03 2001-02-27 Massachusetts Institute Of Technology Selective substrate metallization
US5976614A (en) * 1998-10-13 1999-11-02 Midwest Research Institute Preparation of cuxinygazsen precursor films and powders by electroless deposition
US6291025B1 (en) * 1999-06-04 2001-09-18 Argonide Corporation Electroless coatings formed from organic liquids
US20020068127A1 (en) * 2000-12-04 2002-06-06 Francis Durso Process for selectively plating areas of a substrate
TW522062B (en) * 2001-02-15 2003-03-01 Mitsui Mining & Smelting Co Aqueous nickel slurry, method for preparing the same and conductive paste
US6382807B1 (en) * 2001-07-02 2002-05-07 Lucent Technologies Inc. Mirror and a method of making the same
US6867983B2 (en) * 2002-08-07 2005-03-15 Avery Dennison Corporation Radio frequency identification device and method
US7930815B2 (en) * 2003-04-11 2011-04-26 Avery Dennison Corporation Conductive pattern and method of making
US20040200061A1 (en) * 2003-04-11 2004-10-14 Coleman James P. Conductive pattern and method of making
FI20030816A (fi) * 2003-05-30 2004-12-01 Metso Corp Menetelmä metallijohtimien valmistamiseksi substraatille
CL2014003397A1 (es) * 2014-12-12 2015-08-07 Leyton Nelson Roberto Osses Composición química libre de cianuros para recubrir de manera in situ superficies metálicas; y metodo para recubrir de manera in situ superficies metalicas de manera autocatalitica.
CN110743552B (zh) * 2019-11-07 2022-06-07 西安石油大学 一种粘土负载零价金属稠油水热裂解催化剂及其制备方法
CN114517314A (zh) * 2020-11-20 2022-05-20 嘉兴阿特斯技术研究院有限公司 一种丝网印刷用电镀浆料及其制备方法和应用
CN113956527A (zh) * 2021-12-07 2022-01-21 深圳大学 一种表面金属化的液晶聚合物及其制备方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3329512A (en) * 1966-04-04 1967-07-04 Shipley Co Chemical deposition of copper and solutions therefor
US3617320A (en) * 1968-08-06 1971-11-02 Hooker Chemical Corp Metallizing substrates
DE2425196A1 (de) * 1974-05-24 1975-12-11 Hoechst Ag Verfahren zur herstellung elektrisch leitender vliese
JPS5627594B2 (es) * 1975-03-14 1981-06-25
US4273804A (en) * 1975-10-23 1981-06-16 Nathan Feldstein Process using activated electroless plating catalysts
US4048354A (en) * 1975-10-23 1977-09-13 Nathan Feldstein Method of preparation and use of novel electroless plating catalysts
DE2635457C2 (de) * 1976-08-04 1985-06-05 Schering AG, 1000 Berlin und 4709 Bergkamen Katalytischer Lack und seine Verwendung zur Herstellung von gedruckten Schaltungen
US4224178A (en) * 1978-07-24 1980-09-23 Nathan Feldstein Method for reducing the crystallinity of a stabilized colloidal composition
US4220678A (en) * 1978-08-17 1980-09-02 Nathan Feldstein Dispersions for activating non-conductors for electroless plating
US4265943A (en) * 1978-11-27 1981-05-05 Macdermid Incorporated Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions
DE2910460A1 (de) * 1979-03-16 1980-09-25 Bayer Ag Verfahren zum partiellen metallisieren von textilen gebilden
US4425378A (en) * 1981-07-06 1984-01-10 Sprague Electric Company Electroless nickel plating activator composition a method for using and a ceramic capacitor made therewith
US4548644A (en) * 1982-09-28 1985-10-22 Hitachi Chemical Company, Ltd. Electroless copper deposition solution
JPS60195077A (ja) * 1984-03-16 1985-10-03 奥野製薬工業株式会社 セラミツクスの無電解めつき用触媒組成物
US4581256A (en) * 1984-11-19 1986-04-08 Chemline Industries Electroless plating composition and method of use
US4999054A (en) * 1986-12-19 1991-03-12 Lamerie, N.V. Gold plating solutions, creams and baths
GB8822641D0 (en) * 1988-09-27 1988-11-02 Int Paint Plc Improvements related to coatings
JPH02170982A (ja) * 1988-12-23 1990-07-02 Kawasaki Steel Corp 簡易表面処理用電解質ペースト

Also Published As

Publication number Publication date
AU2248192A (en) 1993-02-11
WO1993001330A1 (en) 1993-01-21
US5158604A (en) 1992-10-27

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