MX382575B - Composición de resina de poliamida, método de fabricación y producto moldeado. - Google Patents
Composición de resina de poliamida, método de fabricación y producto moldeado.Info
- Publication number
- MX382575B MX382575B MX2016004751A MX2016004751A MX382575B MX 382575 B MX382575 B MX 382575B MX 2016004751 A MX2016004751 A MX 2016004751A MX 2016004751 A MX2016004751 A MX 2016004751A MX 382575 B MX382575 B MX 382575B
- Authority
- MX
- Mexico
- Prior art keywords
- polyamide resin
- compound
- specific amount
- resin composition
- group
- Prior art date
Links
- 229920006122 polyamide resin Polymers 0.000 title abstract 6
- 239000011342 resin composition Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 150000001875 compounds Chemical class 0.000 abstract 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 3
- 125000003277 amino group Chemical group 0.000 abstract 2
- 150000007824 aliphatic compounds Chemical class 0.000 abstract 1
- VPKDCDLSJZCGKE-UHFFFAOYSA-N carbodiimide group Chemical group N=C=N VPKDCDLSJZCGKE-UHFFFAOYSA-N 0.000 abstract 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract 1
- 239000007859 condensation product Substances 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 125000000524 functional group Chemical group 0.000 abstract 1
- 238000001746 injection moulding Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/48—Polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/005—Processes for mixing polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
- C08J3/09—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
- C08J3/11—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids from solid polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
- C08J2377/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
- C08J2377/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2463/02—Polyglycidyl ethers of bis-phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2463/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
- C08K5/053—Polyhydroxylic alcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Polyamides (AREA)
- Epoxy Resins (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Se proporciona una composición de resina de poliamida que tiene una excelente resistencia al envejecimiento por calor, aspecto de superficie, estabilidad de retención, exactitud dimensional, resistencias químicas y similares. Se proporciona (I) una composición de resina de poliamida que incluye una cantidad específica de un compuesto y/o su condensado que incluye un grupo hidroxilo y un grupo epoxi o un grupo carbodiimida y tiene una estructura específica. También se proporciona (II) una composición de resina de poliamida que incluye cantidades especificadas de un compuesto alifático que tiene tres o más grupos amino o tres o más grupos hidroxilo por molécula y un compuesto que tiene más de un grupo funcional por molécula que es reactivo con el grupo amino o el grupo hidroxilo, en donde en caso de que una mancuerna ASTM No. 1 de 3.2 mm de espesor producida por moldeo por inyección de la composición de resina de poliamida se procese en la atmósfera de tratamiento térmico a 130°C durante 100 horas, una velocidad de aumento de la concentración de un grupo carboxilo en la composición de resina de poliamida a partir de una superficie del producto moldeado a una profundidad de 0.2 mm después del tratamiento térmico es menor que 70%.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013217175 | 2013-10-18 | ||
| PCT/JP2014/004433 WO2015056393A1 (ja) | 2013-10-18 | 2014-08-28 | ポリアミド樹脂組成物、製造方法、成形品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| MX2016004751A MX2016004751A (es) | 2016-07-26 |
| MX382575B true MX382575B (es) | 2025-03-13 |
Family
ID=52827856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2016004751A MX382575B (es) | 2013-10-18 | 2014-08-28 | Composición de resina de poliamida, método de fabricación y producto moldeado. |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9873793B2 (es) |
| EP (1) | EP3059283B1 (es) |
| JP (1) | JP5817939B2 (es) |
| KR (1) | KR101677884B1 (es) |
| CN (1) | CN105637034B (es) |
| BR (1) | BR112016007111A2 (es) |
| MX (1) | MX382575B (es) |
| TW (1) | TWI575023B (es) |
| WO (1) | WO2015056393A1 (es) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2530789A (en) * | 2014-10-02 | 2016-04-06 | Mahle Engine Systems Uk Ltd | Bearing material |
| JP6657821B2 (ja) * | 2014-12-04 | 2020-03-04 | 東レ株式会社 | ポリアミド樹脂組成物およびその製造方法 |
| JP6634834B2 (ja) * | 2015-01-20 | 2020-01-22 | 東レ株式会社 | ポリアミド樹脂組成物およびその成形品 |
| JP6822766B2 (ja) * | 2015-01-22 | 2021-01-27 | 旭化成株式会社 | ポリアミド樹脂組成物を含む成形体 |
| US9896637B2 (en) * | 2015-04-08 | 2018-02-20 | Jtekt Corporation | Sliding member, method of manufacturing sliding member, and gear |
| US10526485B2 (en) * | 2015-07-29 | 2020-01-07 | Toyobo Co., Ltd. | Polyamide resin composition having thermal aging resistance and method for enhancing thermal aging resistance of polyamide resin |
| KR20180078242A (ko) * | 2015-10-30 | 2018-07-09 | 도레이 카부시키가이샤 | 폴리아미드 수지를 포함하는 수지 조성물로 이루어지는 성형품 |
| US10919271B2 (en) * | 2015-12-25 | 2021-02-16 | Toray Industries, Inc. | Composite molded article and method of manufacturing same |
| JP7114621B2 (ja) | 2017-03-15 | 2022-08-08 | サムソナイト アイピー ホールディングス エス.エー.アール.エル. | カバン物品のための二軸配向熱可塑性ポリマーラミネートフィルム、及びその作製方法 |
| US11492484B2 (en) | 2017-07-20 | 2022-11-08 | Eastman Chemical Company | Polymer compositions having improved properties of thermal stability, color, and/or flow |
| US11629224B2 (en) | 2017-07-20 | 2023-04-18 | Eastman Chemical Company | Polymer compositions comprising crystalline polymers and a stabilizer composition |
| JP7361479B2 (ja) * | 2018-03-28 | 2023-10-16 | 住友化学株式会社 | 透明ポリイミド系高分子を含む光学フィルム |
| US10746225B2 (en) * | 2018-03-30 | 2020-08-18 | Minebea Mitsumi Inc. | Photocurable resin composition and sliding member |
| KR102193141B1 (ko) * | 2018-05-16 | 2020-12-18 | 주식회사 엘지화학 | 폴리아미드 수지의 제조방법 |
| DE112019000117B4 (de) * | 2018-06-19 | 2021-01-28 | Bando Chemical Industries, Ltd. | Zahnriemenscheibe |
| CN110903642B (zh) * | 2018-09-18 | 2022-03-18 | 上海凯赛生物技术股份有限公司 | 一种无卤阻燃树脂及其制备方法 |
| CN119978734A (zh) | 2019-01-18 | 2025-05-13 | 伊士曼化工公司 | 具有改进的耐候性的聚合物组合物 |
| EP3848410A1 (de) | 2020-01-09 | 2021-07-14 | L. Brüggemann GmbH & Co. KG | Polyamid-werkstoffe mit verbesserten langzeitgebrauchseigenschaften |
| BR112022016870A2 (pt) | 2020-02-26 | 2022-10-25 | Basf Se | Composição de moldagem termoplástica, processo para preparar a composição de moldagem termoplástica, uso da composição de moldagem termoplástica, fibra, folha ou moldagem, mistura e uso da mistura |
| CN121779914A (zh) | 2024-09-29 | 2026-04-03 | 泰连解决方案有限责任公司 | 含有聚烯烃脱模添加剂的聚酰胺56组合物 |
| CN121758971A (zh) | 2024-09-29 | 2026-03-31 | 泰连解决方案有限责任公司 | 含有有机硅脱模添加剂的聚酰胺56组合物 |
| CN121736486A (zh) * | 2026-02-26 | 2026-03-27 | 湖北金德包装有限公司 | 一种水汽透过率低的食品包装材料及其制备方法、应用 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07138473A (ja) * | 1993-11-19 | 1995-05-30 | Mitsubishi Chem Corp | ポリアミド樹脂組成物 |
| JP3442502B2 (ja) * | 1994-09-26 | 2003-09-02 | 三菱エンジニアリングプラスチックス株式会社 | 耐候性ポリアミド樹脂組成物 |
| JP4320854B2 (ja) | 1999-07-30 | 2009-08-26 | 日油株式会社 | ポリアミド系樹脂組成物及びその架橋物 |
| JP3990596B2 (ja) | 2002-05-13 | 2007-10-17 | 住友電工ファインポリマー株式会社 | 架橋ポリアミド樹脂成形品とその製造方法 |
| JP4466877B2 (ja) * | 2004-09-03 | 2010-05-26 | 日産化学工業株式会社 | ポリアミド酸を含む下層反射防止膜形成組成物 |
| JP4854977B2 (ja) | 2005-03-28 | 2012-01-18 | 旭化成ケミカルズ株式会社 | ポリアミド樹脂組成物の製造方法 |
| US9480154B2 (en) * | 2005-07-21 | 2016-10-25 | Nippon Kayaku Kabushiki Kaisha | Polyamide resin, epoxy resin compositions, and cured articles thereof |
| JP2009155412A (ja) * | 2007-12-26 | 2009-07-16 | Toray Ind Inc | 樹脂組成物およびそれからなる成形品 |
| CN102112545A (zh) | 2008-07-30 | 2011-06-29 | 纳幕尔杜邦公司 | 共聚醚酯组合物和由其制成的制品 |
| US20110290209A1 (en) | 2008-11-11 | 2011-12-01 | Basf Se | Stabilized polyamides |
| WO2010110077A1 (ja) | 2009-03-25 | 2010-09-30 | 横浜ゴム株式会社 | 熱可塑性樹脂組成物 |
| US8232337B2 (en) | 2010-01-29 | 2012-07-31 | E I Du Pont De Nemours And Company | Polyamide compositions with improved salt resistance and heat stability |
| JP2013518174A (ja) * | 2010-01-29 | 2013-05-20 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 改善された耐塩性および熱安定性のポリアミド組成物 |
| JP2015519463A (ja) * | 2012-06-13 | 2015-07-09 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company | ポリエーテルオール熱安定剤を含む熱可塑性溶融混合組成物 |
| CN104619776B (zh) | 2012-09-14 | 2017-05-17 | 东丽株式会社 | 聚酰胺树脂组合物、成型品 |
-
2014
- 2014-08-28 MX MX2016004751A patent/MX382575B/es unknown
- 2014-08-28 EP EP14853654.3A patent/EP3059283B1/en active Active
- 2014-08-28 JP JP2014544843A patent/JP5817939B2/ja active Active
- 2014-08-28 CN CN201480056436.0A patent/CN105637034B/zh active Active
- 2014-08-28 WO PCT/JP2014/004433 patent/WO2015056393A1/ja not_active Ceased
- 2014-08-28 US US15/029,366 patent/US9873793B2/en active Active
- 2014-08-28 KR KR1020167009494A patent/KR101677884B1/ko not_active Expired - Fee Related
- 2014-08-28 BR BR112016007111A patent/BR112016007111A2/pt not_active Application Discontinuation
- 2014-08-29 TW TW103129780A patent/TWI575023B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP3059283A1 (en) | 2016-08-24 |
| WO2015056393A1 (ja) | 2015-04-23 |
| CN105637034A (zh) | 2016-06-01 |
| US20160264778A1 (en) | 2016-09-15 |
| EP3059283A4 (en) | 2017-02-15 |
| TW201522506A (zh) | 2015-06-16 |
| JP5817939B2 (ja) | 2015-11-18 |
| KR101677884B1 (ko) | 2016-11-18 |
| BR112016007111A2 (pt) | 2017-08-01 |
| TWI575023B (zh) | 2017-03-21 |
| EP3059283B1 (en) | 2018-10-10 |
| MX2016004751A (es) | 2016-07-26 |
| KR20160073965A (ko) | 2016-06-27 |
| JPWO2015056393A1 (ja) | 2017-03-09 |
| US9873793B2 (en) | 2018-01-23 |
| CN105637034B (zh) | 2017-06-30 |
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