MX358219B - Sistema de soldadura automático. - Google Patents

Sistema de soldadura automático.

Info

Publication number
MX358219B
MX358219B MX2014012747A MX2014012747A MX358219B MX 358219 B MX358219 B MX 358219B MX 2014012747 A MX2014012747 A MX 2014012747A MX 2014012747 A MX2014012747 A MX 2014012747A MX 358219 B MX358219 B MX 358219B
Authority
MX
Mexico
Prior art keywords
automatic soldering
soldering system
manipulator
controlled
vision system
Prior art date
Application number
MX2014012747A
Other languages
English (en)
Other versions
MX2014012747A (es
Inventor
Zhang Dandan
Hu Lvhai
Zeng Qinglong
Deng Yingcong
Original Assignee
Tyco Electronics Shanghai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Shanghai Co Ltd filed Critical Tyco Electronics Shanghai Co Ltd
Publication of MX2014012747A publication Critical patent/MX2014012747A/es
Publication of MX358219B publication Critical patent/MX358219B/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02—Soldering irons; Bits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21F—WORKING OR PROCESSING OF METAL WIRE
    • B21F11/00—Cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/063—Solder feeding devices for wire feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manipulator (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)

Abstract

La presente invención describe un sistema de soldadura automática controlado por un programa, que comprende: un sistema de visión; un primer manipulador, en el que está montado una pinza de agarre, configurado para agarrar un objeto bajo la dirección del sistema de visión y colocar el objeto en una ubicación de un producto a soldar; y un segundo manipulador, en el que está montado un calentador, configurado para colocar una punta del calentador en la ubicación del producto para calentar un material de soldadura dispuesto sobre la ubicación del producto y soldar el objeto al producto. El sistema de soldadura automática controlado por un programa puede realizar automáticamente una operación complicada de soldadura en un producto bajo el control del programa, mejorando la eficiencia de la soldadura y la exactitud de soldadura.
MX2014012747A 2013-10-21 2014-10-21 Sistema de soldadura automático. MX358219B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310493639.3A CN104551291A (zh) 2013-10-21 2013-10-21 自动焊接系统

Publications (2)

Publication Number Publication Date
MX2014012747A MX2014012747A (es) 2016-06-28
MX358219B true MX358219B (es) 2018-08-10

Family

ID=52825291

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2014012747A MX358219B (es) 2013-10-21 2014-10-21 Sistema de soldadura automático.

Country Status (5)

Country Link
US (1) US20150108202A1 (es)
JP (1) JP2015091615A (es)
CN (1) CN104551291A (es)
BR (1) BR102014025834A2 (es)
MX (1) MX358219B (es)

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CN105149825A (zh) * 2015-10-08 2015-12-16 上海维宏电子科技股份有限公司 基于机械视觉导引实现自动化缝隙焊接的系统及方法
CN105728880A (zh) * 2016-04-15 2016-07-06 无锡时宇达自动化科技有限公司 一种微型焊接机的焊接模块
CN107363368A (zh) * 2016-05-13 2017-11-21 浙江盾安禾田金属有限公司 一种自动焊机
JP6765221B2 (ja) * 2016-05-30 2020-10-07 Ntn株式会社 パラレルリンク機構を用いた作業装置
CN107052501B (zh) * 2017-03-15 2019-10-22 西安多杰机器人有限公司 一种新型六轴工业机器人
CN108941820A (zh) 2017-05-18 2018-12-07 泰科电子(上海)有限公司 导线自动焊接系统
CN107900485A (zh) * 2017-11-16 2018-04-13 广州市谊华电子设备有限公司 焊锡机控制系统
CN107999921B (zh) * 2017-12-13 2020-04-10 深圳市华盛控科技有限公司 机器人定位焊接装置
CN108419430B (zh) * 2018-01-23 2020-09-11 深圳市卓茂科技有限公司 全自动视觉bga返修工作站
US10780515B2 (en) * 2018-04-26 2020-09-22 Raytheon Technologies Corporation Auto-adaptive braze dispensing systems and methods
EP3569370A1 (en) * 2018-05-18 2019-11-20 SUPSI (Scuola Universitaria Professionale Della Svizzera Italiana) Device for gripping and welding electronic components and associated actuating head, robot and method
CN110814582A (zh) * 2018-08-07 2020-02-21 泰科电子(上海)有限公司 焊接系统
CN111712346A (zh) * 2018-10-18 2020-09-25 深圳配天智能技术研究院有限公司 一种焊接设备
CN111741828B (zh) * 2018-10-24 2022-01-11 深圳配天智能技术研究院有限公司 自动焊接工作站
CN110561006B (zh) * 2019-09-20 2021-05-04 福建迈可博电子科技集团股份有限公司 一种用于电子器件中贴片元件焊接定位的工装
CN110899892B (zh) * 2019-12-16 2021-03-30 东莞市硕动自动化设备有限公司 一种组装电路板的电器元件引脚定位焊接一体机
CN112157328B (zh) * 2020-08-31 2022-05-03 杭州野陆机电技术有限公司 一种电磁系统双头自动焊接装置
CN112171019A (zh) * 2020-10-09 2021-01-05 曾宝香 一种自动氩弧焊接装置
CN115922021A (zh) * 2021-08-12 2023-04-07 台达电子工业股份有限公司 自动焊锡加工系统及自动焊锡加工方法
CN114147310B (zh) * 2021-12-21 2024-06-25 上海轩田智能科技股份有限公司 自动搪锡除金机构及其自动搪锡、除金方法
CN117884754B (zh) * 2024-03-14 2024-06-04 陇东学院 特种加工机器人系统

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Also Published As

Publication number Publication date
US20150108202A1 (en) 2015-04-23
BR102014025834A2 (pt) 2015-09-22
MX2014012747A (es) 2016-06-28
CN104551291A (zh) 2015-04-29
JP2015091615A (ja) 2015-05-14

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