MX346505B - Método y dispositivo para enfriar tableros de circuitos impresos soldados. - Google Patents

Método y dispositivo para enfriar tableros de circuitos impresos soldados.

Info

Publication number
MX346505B
MX346505B MX2014004602A MX2014004602A MX346505B MX 346505 B MX346505 B MX 346505B MX 2014004602 A MX2014004602 A MX 2014004602A MX 2014004602 A MX2014004602 A MX 2014004602A MX 346505 B MX346505 B MX 346505B
Authority
MX
Mexico
Prior art keywords
cooling
printed circuit
circuit boards
zone
soldering
Prior art date
Application number
MX2014004602A
Other languages
English (en)
Other versions
MX2014004602A (es
Inventor
Holger Liebert
Patrick Ridgeway
André Kast
Laurent Coudurier
Original Assignee
Air Liquide
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=47071276&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MX346505(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from EP11186531.7A external-priority patent/EP2586558A1/de
Priority claimed from EP11008959.6A external-priority patent/EP2591871A1/de
Application filed by Air Liquide filed Critical Air Liquide
Publication of MX2014004602A publication Critical patent/MX2014004602A/es
Publication of MX346505B publication Critical patent/MX346505B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Un método para enfriar módulos de tableros de circuitos impresos soldados en una zona de enfriamiento de un sistema de soldadura, en donde al menos un gas de enfriamiento que comprende el gas inerte se introduce en la zona de enfriamiento, en donde los tableros de circuitos impresos son transportados de manera continua de una zona de soldadura del sistema de soldadura a la zona de enfriamiento, en donde el gas de enfriamiento es generado utilizando el gas de enfriamiento líquido. El método de acuerdo con la invención y el dispositivo 1 de acuerdo con la invención, permiten de manera ventajosa un enfriamiento altamente eficiente de los módulos de tableros de circuitos impresos después del proceso de soldadura. El gas de enfriamiento puede utilizarse de manera ventajosa para hacer inerte el sistema de soldadura 2 después de la extracción de la zona de enfriamiento 15. (Figura 1).
MX2014004602A 2011-10-25 2012-10-22 Método y dispositivo para enfriar tableros de circuitos impresos soldados. MX346505B (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11186531.7A EP2586558A1 (de) 2011-10-25 2011-10-25 Verfahren und Vorrichtung zum Abkühlen von gelöteten Flachbaugruppen
EP11008959.6A EP2591871A1 (de) 2011-11-10 2011-11-10 Verfahren und Vorrichtung zum Abkühlen von gelöteten Flachbaugruppen
PCT/EP2012/070842 WO2013060635A1 (en) 2011-10-25 2012-10-22 Method and device for cooling soldered printed circuit boards

Publications (2)

Publication Number Publication Date
MX2014004602A MX2014004602A (es) 2014-05-27
MX346505B true MX346505B (es) 2017-03-22

Family

ID=47071276

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2014004602A MX346505B (es) 2011-10-25 2012-10-22 Método y dispositivo para enfriar tableros de circuitos impresos soldados.

Country Status (10)

Country Link
US (1) US9936569B2 (es)
EP (1) EP2771145B1 (es)
JP (1) JP6301257B2 (es)
CN (1) CN103889631B (es)
BR (1) BR112014010000B1 (es)
DK (1) DK2771145T3 (es)
ES (1) ES2621481T3 (es)
MX (1) MX346505B (es)
PL (1) PL2771145T3 (es)
WO (1) WO2013060635A1 (es)

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BR102012032031A2 (pt) * 2012-12-14 2014-09-09 Air Liquide Brasil Ltda Equipamento portátil para monitoramento e controle do nível de oxigênio em atmosfera de fornos de refusão
JP6188671B2 (ja) * 2014-12-12 2017-08-30 株式会社Ｓｓテクノ 水蒸気リフロー装置及び水蒸気リフロー方法
CN106881517A (zh) * 2017-03-30 2017-06-23 北京康普锡威科技有限公司 二氧化碳气体保护的电子产品焊接方法
JP6322746B1 (ja) * 2017-03-30 2018-05-09 オリジン電気株式会社 ワーク処理装置及び処理済ワークの製造方法
CN108063108A (zh) * 2018-01-22 2018-05-22 广安市嘉乐电子科技有限公司 一种mb桥堆焊接机
CN110355438A (zh) * 2018-04-09 2019-10-22 中芯长电半导体（江阴）有限公司 快速冷却系统
CN110798965B (zh) * 2019-11-13 2022-10-14 重庆大学 集成于pcb上的电子元器件可控制主动流体散热系统
CN113941752A (zh) * 2021-10-14 2022-01-18 安徽新富新能源科技有限公司 一种提高微通道冷板表面粗糙度的方法
CN113941746B (zh) * 2021-10-18 2022-12-13 安徽新富新能源科技股份有限公司 一种圆柱形电芯散热用水冷板焊接工艺
DE102021129131B4 (de) * 2021-11-09 2024-02-29 Ersa Gmbh Lötanlage, insbesondere eine Reflowlötanlage mit seitlich neben einem Prozesskanal vorgesehenen Lüftereinheiten
CN117583684A (zh) * 2024-01-16 2024-02-23 无锡市古德电子有限公司 一种smt焊接方法

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JPH04111388A (ja) * 1990-08-30 1992-04-13 Fujitsu Ltd 半導体装置の製造方法および加熱炉
JP2835210B2 (ja) * 1991-06-19 1998-12-14 古河電気工業株式会社 半田付け用加熱炉
DE4242820A1 (de) 1992-12-17 1994-06-23 Linde Ag Lötverfahren mit Abgasreinigung
JPH06334327A (ja) * 1993-05-24 1994-12-02 Matsushita Electric Ind Co Ltd リフロー装置
JP3083035B2 (ja) * 1993-12-28 2000-09-04 日本電熱計器株式会社 はんだ付け装置
US5577658A (en) 1995-06-23 1996-11-26 Electrovert Usa Corp. Gas knife cooling system
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JP2002141658A (ja) * 2000-08-21 2002-05-17 Matsushita Electric Ind Co Ltd フローはんだ付け方法および装置
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DE10301102B3 (de) 2003-01-08 2004-03-25 Siemens Ag Verfahren zum Reinigen von Prozessgas eines Lötofens, sowie Lötofen und Reinigungssystem zur Durchführung des Verfahrens
KR20070021817A (ko) * 2005-08-19 2007-02-23 삼성전자주식회사 솔더링 장치 및 솔더링 방법
JP4640170B2 (ja) * 2005-12-28 2011-03-02 株式会社豊田自動織機 半田付け方法及び半導体モジュールの製造方法並びに半田付け装置
US20080006294A1 (en) 2006-06-27 2008-01-10 Neeraj Saxena Solder cooling system
US8110015B2 (en) * 2007-05-30 2012-02-07 Illinois Tool Works, Inc. Method and apparatus for removing contaminants from a reflow apparatus
DE102007032067A1 (de) * 2007-07-10 2009-01-15 Linde Ag Vorrichtung und Verfahren zur CO2 Reinigung beim Schweißen von Metallen
JP4082462B1 (ja) * 2007-09-27 2008-04-30 株式会社ヤスカワ リフロー炉
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Also Published As

Publication number Publication date
BR112014010000A2 (pt) 2017-04-25
WO2013060635A1 (en) 2013-05-02
US9936569B2 (en) 2018-04-03
PL2771145T3 (pl) 2017-07-31
BR112014010000B1 (pt) 2019-04-09
US20140290286A1 (en) 2014-10-02
CN103889631B (zh) 2016-08-24
EP2771145B1 (en) 2017-02-22
ES2621481T3 (es) 2017-07-04
MX2014004602A (es) 2014-05-27
DK2771145T3 (en) 2017-04-10
CN103889631A (zh) 2014-06-25
JP6301257B2 (ja) 2018-03-28
EP2771145A1 (en) 2014-09-03
JP2014531137A (ja) 2014-11-20

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