TW200726332A - Circuit board and its production method - Google Patents

Circuit board and its production method

Info

Publication number
TW200726332A
TW200726332A TW095127109A TW95127109A TW200726332A TW 200726332 A TW200726332 A TW 200726332A TW 095127109 A TW095127109 A TW 095127109A TW 95127109 A TW95127109 A TW 95127109A TW 200726332 A TW200726332 A TW 200726332A
Authority
TW
Taiwan
Prior art keywords
circuit board
production method
holes
heat
soldering
Prior art date
Application number
TW095127109A
Other languages
Chinese (zh)
Inventor
Georg Busch
Ralph Elshorst
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of TW200726332A publication Critical patent/TW200726332A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09572—Solder filled plated through-hole in the final product
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

A circuit board and its production method is provided, which facilitate an effective and cost-advantageous heat-removal of electrical members arranged on one side of the circuit board, the waste heat to be removed in electrical members is conducted to the other side of the circuit board. With respect to the circuit board, the purpose above is attained by the fact that the circuit board is provided with through-holes filled with soldering tin, the through-holes conduct the waste heat to be removed from one side of the circuit board to the other side. With respect to the method, the purpose above is attained by the fact that the through-holes for the removal of heat in the circuit board are pressed with soldering paste and in the following soldering process are filled with soldering tin.
TW095127109A 2005-09-30 2006-07-25 Circuit board and its production method TW200726332A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005047026A DE102005047026A1 (en) 2005-09-30 2005-09-30 Printed circuit board and method for its production

Publications (1)

Publication Number Publication Date
TW200726332A true TW200726332A (en) 2007-07-01

Family

ID=36834187

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095127109A TW200726332A (en) 2005-09-30 2006-07-25 Circuit board and its production method

Country Status (3)

Country Link
DE (1) DE102005047026A1 (en)
TW (1) TW200726332A (en)
WO (1) WO2007039330A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2925255B1 (en) * 2007-12-18 2010-01-08 Thales Sa METHOD OF MANUFACTURING THERMAL DRAIN FOR SURFACE MOUNTING POWER COMPONENTS
DE102009019782A1 (en) * 2009-05-02 2010-11-04 Valeo Schalter Und Sensoren Gmbh Method for producing plated-through printed circuit board, involves producing connections of components and conducting connections in recesses for forming plated-through holes between conducting layers in reflow process

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5769989A (en) * 1995-09-19 1998-06-23 International Business Machines Corporation Method and system for reworkable direct chip attach (DCA) structure with thermal enhancement
KR20020074073A (en) * 2001-03-16 2002-09-28 엘지전자 주식회사 Heat dissipation structure of ic
JP3804861B2 (en) * 2002-08-29 2006-08-02 株式会社デンソー Electrical device and wiring board

Also Published As

Publication number Publication date
DE102005047026A1 (en) 2007-04-05
WO2007039330A1 (en) 2007-04-12

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