MX2021013700A - Aparato de medición tridimensional y método de medición tridimensional. - Google Patents

Aparato de medición tridimensional y método de medición tridimensional.

Info

Publication number
MX2021013700A
MX2021013700A MX2021013700A MX2021013700A MX2021013700A MX 2021013700 A MX2021013700 A MX 2021013700A MX 2021013700 A MX2021013700 A MX 2021013700A MX 2021013700 A MX2021013700 A MX 2021013700A MX 2021013700 A MX2021013700 A MX 2021013700A
Authority
MX
Mexico
Prior art keywords
measurement
height
range
dimensional measurement
height position
Prior art date
Application number
MX2021013700A
Other languages
English (en)
Inventor
Tsuyoshi Ohyama
Norihiko Sakaida
Takayuki Shinyama
Original Assignee
Ckd Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ckd Corp filed Critical Ckd Corp
Publication of MX2021013700A publication Critical patent/MX2021013700A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2513—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object with several lines being projected in more than one direction, e.g. grids, patterns
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95646—Soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Theoretical Computer Science (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Analysis (AREA)

Abstract

Se proporciona un aparato de medición tridimensional y un método de medición tridimensional que obtiene mejoras de precisión de medición y similares. Un aparato de inspección de sustrato 10 incluye una cabeza de medición 12 que se proporciona con un dispositivo de irradiación 13, un dispositivo de proyección 14 y una cámara 15. El aparato de inspección de sustrato 10 primero irradia un intervalo de inspección sobre un tablero de circuito impreso 1 con luz de ranura desde el dispositivo de irradiación 13 y mide la altura del intervalo de inspección. El aparato de inspección de sustrato 10 subsecuentemente determina la altura de una superficie de referencia de medición de cada pasta de soldadura incluida en el intervalo de inspección, con base en la altura de este intervalo de inspección y específica un intervalo de enfoque requerido que se requiere para generación de imagen de un intervalo completo en una dirección de altura de cada pasta de soldadura en un estado de enfoque. El aparato de inspección de sustrato 10 subsecuentemente cartografía una posición de altura de una cabeza de medición 12 a la pasta de soldadura que es un objetivo medido en la posición de altura, con base en los intervalos de enfoque requeridos de las pastas de soldadura respectivas y una profundidad de campo de la cámara 15. El aparato de inspección de sustrato 10 sucesivamente mueve la cabeza de medición 12 a una posición de altura predeterminada determinada por la cartografía y realiza la medición de soldadura con respecto a la pasta de soldadura 5 que es el objetivo medido en la posición de altura.
MX2021013700A 2019-05-29 2020-04-07 Aparato de medición tridimensional y método de medición tridimensional. MX2021013700A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019099886A JP7000380B2 (ja) 2019-05-29 2019-05-29 三次元計測装置及び三次元計測方法
PCT/JP2020/015674 WO2020241061A1 (ja) 2019-05-29 2020-04-07 三次元計測装置及び三次元計測方法

Publications (1)

Publication Number Publication Date
MX2021013700A true MX2021013700A (es) 2022-05-30

Family

ID=73548653

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2021013700A MX2021013700A (es) 2019-05-29 2020-04-07 Aparato de medición tridimensional y método de medición tridimensional.

Country Status (6)

Country Link
US (1) US11930600B2 (es)
JP (1) JP7000380B2 (es)
CN (1) CN113767263B (es)
DE (1) DE112020002626T5 (es)
MX (1) MX2021013700A (es)
WO (1) WO2020241061A1 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019126419A1 (de) * 2019-05-08 2020-11-12 Docter Optics Se Vorrichtung zum optischen Abbilden von Merkmalen einer Hand

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JP6189984B2 (ja) * 2016-02-12 2017-08-30 Ckd株式会社 三次元計測装置
JP6450697B2 (ja) * 2016-03-22 2019-01-09 Ckd株式会社 基板検査装置
JP6450700B2 (ja) * 2016-03-29 2019-01-09 Ckd株式会社 基板検査装置
JP6722522B2 (ja) * 2016-06-24 2020-07-15 株式会社キーエンス 三次元測定装置及びその制御方法

Also Published As

Publication number Publication date
JP2020193880A (ja) 2020-12-03
US20220071073A1 (en) 2022-03-03
JP7000380B2 (ja) 2022-01-19
US11930600B2 (en) 2024-03-12
CN113767263A (zh) 2021-12-07
WO2020241061A1 (ja) 2020-12-03
CN113767263B (zh) 2024-05-07
DE112020002626T5 (de) 2022-02-17

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