MX2016012804A - Dispositivo de procesamiento y metodo de procesamiento. - Google Patents
Dispositivo de procesamiento y metodo de procesamiento.Info
- Publication number
- MX2016012804A MX2016012804A MX2016012804A MX2016012804A MX2016012804A MX 2016012804 A MX2016012804 A MX 2016012804A MX 2016012804 A MX2016012804 A MX 2016012804A MX 2016012804 A MX2016012804 A MX 2016012804A MX 2016012804 A MX2016012804 A MX 2016012804A
- Authority
- MX
- Mexico
- Prior art keywords
- laser
- processing
- output
- processed
- vertical cavity
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
- B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/32—Bonding taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/34—Laser welding for purposes other than joining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/34—Laser welding for purposes other than joining
- B23K26/342—Build-up welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
- H01S5/423—Arrays of surface emitting lasers having a vertical cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
- B23K2103/05—Stainless steel
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Robotics (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
- Semiconductor Lasers (AREA)
Abstract
Se proporciona un dispositivo de procesamiento y un método de procesamiento con el cual el dispositivo puede fabricarse más compacto, y con el cual puede realizarse un procesamiento con gran precisión. El dispositivo de procesamiento, el cual procesa un miembro de trabajo mediante la irradiación del miembro de trabajo con un láser, tiene: un oscilador láser que tiene una pluralidad de virutas del diodo láser emisor superficial de cavidad vertical que generan luz láser que tiene una longitud de onda de 1,070 nm o menos, y un sustrato sobre cuya superficie se disponen en una matriz la pluralidad de virutas del diodo láser emisor superficial de cavidad vertical; un sistema óptico de guiado que gula la luz láser emitida por el oscilador láser; y un dispositivo de control que controla la salida del oscilador láser.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014074055A JP2015196163A (ja) | 2014-03-31 | 2014-03-31 | 加工装置及び加工方法 |
PCT/JP2015/052073 WO2015151562A1 (ja) | 2014-03-31 | 2015-01-26 | 加工装置及び加工方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2016012804A true MX2016012804A (es) | 2016-12-14 |
Family
ID=54239905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2016012804A MX2016012804A (es) | 2014-03-31 | 2015-01-26 | Dispositivo de procesamiento y metodo de procesamiento. |
Country Status (7)
Country | Link |
---|---|
US (1) | US10442032B2 (es) |
EP (1) | EP3117949B1 (es) |
JP (1) | JP2015196163A (es) |
KR (2) | KR20160132098A (es) |
CN (1) | CN106163726B (es) |
MX (1) | MX2016012804A (es) |
WO (1) | WO2015151562A1 (es) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016103055A1 (de) * | 2015-12-22 | 2017-06-22 | Konrad Gmbh | Verfahren zum Bearbeiten eines Werkstücks |
CN108886232B (zh) * | 2015-12-25 | 2021-08-17 | 鸿海精密工业股份有限公司 | 线束光源及线束照射装置以及激光剥离方法 |
JP2017135146A (ja) * | 2016-01-25 | 2017-08-03 | 浜松ホトニクス株式会社 | レーザヘッド、及び、レーザ装置 |
US11095091B2 (en) * | 2016-06-20 | 2021-08-17 | TeraDiode, Inc. | Packages for high-power laser devices |
JP6793481B2 (ja) * | 2016-06-30 | 2020-12-02 | 浜松ホトニクス株式会社 | 焼入れ用レーザ加工装置及び焼入れ用レーザヘッド |
CN106735893B (zh) * | 2016-11-29 | 2019-08-13 | 大族激光科技产业集团股份有限公司 | 一种实现激光微焊接的方法 |
WO2018107164A1 (en) * | 2016-12-09 | 2018-06-14 | mPower Technology, Inc. | High performance solar cells, arrays and manufacturing processes therefor |
DE102017002822A1 (de) | 2017-03-23 | 2017-10-12 | Daimler Ag | Verfahren zur Kurzzeitwärmebehandlung eines Leichtmetallgussbauteils, sowie Leichtmetallgussbauteil |
US10471542B1 (en) * | 2017-06-27 | 2019-11-12 | United States Of America As Represented By The Administrator Of Nasa | Cladding and freeform deposition for coolant channel closeout |
JP6749308B2 (ja) | 2017-12-04 | 2020-09-02 | Dmg森精機株式会社 | レーザ積層造形装置及びレーザ積層方法 |
US11769843B1 (en) * | 2019-07-30 | 2023-09-26 | Hrl Laboratories, Llc | Photonic integrated module with metal embedded chips |
JP6822699B1 (ja) * | 2019-09-24 | 2021-01-27 | フェニックス電機株式会社 | レーザー照射装置、およびそれを用いた表面荒らし処理方法 |
DE102020107800A1 (de) | 2020-03-20 | 2021-09-23 | Carl Zeiss Ag | Fertigungsvorrichtung zur additiven fertigung eines objekts und verfahren zum additiven herstellen eines objekts |
KR102305655B1 (ko) * | 2020-03-27 | 2021-09-27 | 한양대학교 에리카산학협력단 | 레이저 패턴이 형성된 충돌부재 및 그 제조 방법 |
US20220176495A1 (en) * | 2020-12-04 | 2022-06-09 | Lawrence Livermore National Security, Llc | System and method for radius of curvature modification of optical plates and lenses by irradiation with optical energy |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH05329674A (ja) | 1992-05-28 | 1993-12-14 | Kawasaki Heavy Ind Ltd | 光軸調整方法およびそれに用いる光軸調整装置 |
JP2831215B2 (ja) | 1992-11-13 | 1998-12-02 | 三菱重工業株式会社 | レーザによる切断、穴あけ加工方法 |
JP3713725B2 (ja) | 1994-09-28 | 2005-11-09 | 富士ゼロックス株式会社 | 半導体レーザ装置、その製造方法およびその駆動方法 |
JP3213882B2 (ja) * | 1997-03-21 | 2001-10-02 | 住友重機械工業株式会社 | レーザ加工装置及び加工方法 |
US5991318A (en) | 1998-10-26 | 1999-11-23 | Coherent, Inc. | Intracavity frequency-converted optically-pumped semiconductor laser |
ATE354877T1 (de) | 1998-10-26 | 2007-03-15 | Coherent Inc | Optisch gepumpte hochleistungshalbleiterlaser mit externem resonator |
JP2002026452A (ja) | 2000-07-12 | 2002-01-25 | Toyota Central Res & Dev Lab Inc | 面発光型光源及びその製造方法、レーザ加工機用光源 |
US7006237B2 (en) * | 2002-03-26 | 2006-02-28 | Mitsubishi Denki Kabushiki Kaisha | Laser beam positioning device for laser processing equipment |
JP2004191564A (ja) * | 2002-12-10 | 2004-07-08 | Mitsubishi Electric Corp | 光路変換コネクタ |
JP2004230458A (ja) * | 2003-01-31 | 2004-08-19 | Fujitsu Hitachi Plasma Display Ltd | レーザー加工装置 |
JP2006305620A (ja) * | 2005-05-02 | 2006-11-09 | Research Foundation For Opto-Science & Technology | レーザ加工装置及びレーザ加工方法 |
JP5105944B2 (ja) | 2007-04-16 | 2012-12-26 | パナソニック株式会社 | レーザ装置 |
JP2009094308A (ja) | 2007-10-10 | 2009-04-30 | Fuji Xerox Co Ltd | 半導体発光モジュール |
KR101453878B1 (ko) * | 2008-08-07 | 2014-10-23 | 삼성디스플레이 주식회사 | 평판 표시장치의 제조방법 |
JP5894529B2 (ja) * | 2009-08-20 | 2016-03-30 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 設定変更可能な輝度分布を備えるレーザー装置 |
US9144934B2 (en) * | 2009-09-15 | 2015-09-29 | Koninklijke Philips N.V. | Method of heating a preform, a driving arrangement, a preform heating system and a computer program |
JP5717989B2 (ja) * | 2010-06-15 | 2015-05-13 | 古河電気工業株式会社 | レーザ装置 |
US10124410B2 (en) * | 2010-09-25 | 2018-11-13 | Ipg Photonics Corporation | Methods and systems for coherent imaging and feedback control for modification of materials |
EP2631999B1 (en) | 2010-10-18 | 2015-09-16 | Nippon Steel & Sumitomo Metal Corporation | Laser apparatus and laser materials processing apparatus provided with same |
US9696035B2 (en) | 2010-10-29 | 2017-07-04 | General Electric Company | Method of forming a cooling hole by laser drilling |
JP2013171892A (ja) | 2012-02-20 | 2013-09-02 | Ricoh Co Ltd | 光学センサ及び画像形成装置 |
PL2972479T3 (pl) * | 2013-03-13 | 2021-04-19 | Ipg Photonics (Canada) Inc. | Sposoby i układy do charakteryzacji właściwości obróbki laserem poprzez pomiar dynamiki kapilary z zastosowaniem interferometrii |
-
2014
- 2014-03-31 JP JP2014074055A patent/JP2015196163A/ja active Pending
-
2015
- 2015-01-26 EP EP15773699.2A patent/EP3117949B1/en active Active
- 2015-01-26 KR KR1020167028273A patent/KR20160132098A/ko active Application Filing
- 2015-01-26 WO PCT/JP2015/052073 patent/WO2015151562A1/ja active Application Filing
- 2015-01-26 MX MX2016012804A patent/MX2016012804A/es active IP Right Grant
- 2015-01-26 US US15/300,207 patent/US10442032B2/en not_active Expired - Fee Related
- 2015-01-26 CN CN201580017448.7A patent/CN106163726B/zh not_active Expired - Fee Related
- 2015-01-26 KR KR1020187036745A patent/KR102064697B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US10442032B2 (en) | 2019-10-15 |
EP3117949B1 (en) | 2020-09-09 |
EP3117949A4 (en) | 2017-08-23 |
JP2015196163A (ja) | 2015-11-09 |
KR20180137045A (ko) | 2018-12-26 |
CN106163726A (zh) | 2016-11-23 |
KR102064697B1 (ko) | 2020-01-09 |
CN106163726B (zh) | 2019-10-11 |
KR20160132098A (ko) | 2016-11-16 |
EP3117949A1 (en) | 2017-01-18 |
US20170182590A1 (en) | 2017-06-29 |
WO2015151562A1 (ja) | 2015-10-08 |
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