MX2016004075A - Pila de semiconductor para convertir con capacitores amortiguadores. - Google Patents

Pila de semiconductor para convertir con capacitores amortiguadores.

Info

Publication number
MX2016004075A
MX2016004075A MX2016004075A MX2016004075A MX2016004075A MX 2016004075 A MX2016004075 A MX 2016004075A MX 2016004075 A MX2016004075 A MX 2016004075A MX 2016004075 A MX2016004075 A MX 2016004075A MX 2016004075 A MX2016004075 A MX 2016004075A
Authority
MX
Mexico
Prior art keywords
converter
semiconductor switches
snubber capacitors
semiconductor stack
terminals
Prior art date
Application number
MX2016004075A
Other languages
English (en)
Inventor
Steimer Peter
Senturk Osman
Original Assignee
Abb Technology Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Technology Ag filed Critical Abb Technology Ag
Publication of MX2016004075A publication Critical patent/MX2016004075A/es

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/32—Means for protecting converters other than automatic disconnection
    • H02M1/34—Snubber circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49589—Capacitor integral with or on the leadframe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/074—Stacked arrangements of non-apertured devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
    • H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/74—Thyristor-type devices, e.g. having four-zone regenerative action
    • H01L29/7404—Thyristor-type devices, e.g. having four-zone regenerative action structurally associated with at least one other device
    • H01L29/7412—Thyristor-type devices, e.g. having four-zone regenerative action structurally associated with at least one other device the device being a diode
    • H01L29/7416—Thyristor-type devices, e.g. having four-zone regenerative action structurally associated with at least one other device the device being a diode the device being an antiparallel diode, e.g. RCT
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/483—Converters with outputs that each can have more than two voltages levels
    • H02M7/4835—Converters with outputs that each can have more than two voltages levels comprising two or more cells, each including a switchable capacitor, the capacitors having a nominal charge voltage which corresponds to a given fraction of the input voltage, and the capacitors being selectively connected in series to determine the instantaneous output voltage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/74—Thyristor-type devices, e.g. having four-zone regenerative action
    • H01L29/749—Thyristor-type devices, e.g. having four-zone regenerative action with turn-on by field effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Inverter Devices (AREA)
  • Power Conversion In General (AREA)
  • Dc-Dc Converters (AREA)

Abstract

Una pila de semiconductor (18) para un convertidor (10) comprende dos interruptores de semiconductor conectados en serie (S1, S2); dos terminales (14, 16) para conectar un capacitor de celda (de), que se conectan entre sí por los dos interruptores de semiconductor (S1, S2); al menos un elemento de enfriamiento (20) dispuesto entre los interruptores de semiconductor (S1, S2); un marco (22) por el cual los interruptores de semiconductor (S1, S2) y el elemento de enfriamiento (20) se fijan entre sí y que proporciona las terminales; y al menos dos capacitores amortiguadores (CC11, CC12) que se fijan mecánicamente al marco (22) y que se conectan en paralelo, se conectan a las terminales y que en cada caso forman un circuito de conmutación (12, 12´) con los interruptores de semiconductor (S1, S2).
MX2016004075A 2013-10-04 2014-10-06 Pila de semiconductor para convertir con capacitores amortiguadores. MX2016004075A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202013104510U DE202013104510U1 (de) 2013-10-04 2013-10-04 Halbleiterstapel für Umrichter mit Snubber-Kondensatoren
PCT/EP2014/071296 WO2015049387A1 (de) 2013-10-04 2014-10-06 Halbleiterstapel für umrichter mit snubber-kondensatoren

Publications (1)

Publication Number Publication Date
MX2016004075A true MX2016004075A (es) 2016-08-11

Family

ID=49781040

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2016004075A MX2016004075A (es) 2013-10-04 2014-10-06 Pila de semiconductor para convertir con capacitores amortiguadores.

Country Status (9)

Country Link
US (1) US10164519B2 (es)
EP (1) EP2989660B1 (es)
CN (1) CN105593989B (es)
AU (1) AU2014331067A1 (es)
BR (1) BR112016006798A2 (es)
CA (1) CA2926022A1 (es)
DE (1) DE202013104510U1 (es)
MX (1) MX2016004075A (es)
WO (1) WO2015049387A1 (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014209690B4 (de) * 2014-05-21 2020-02-20 Robert Bosch Gmbh Kommutierungszelle
FR3043284B1 (fr) * 2015-10-29 2023-06-23 Ifp Energies Now Systeme de conversion d'une puissance electrique continue en puissance electrique alternative avec module recuperateur d'energie
WO2018006970A1 (en) * 2016-07-07 2018-01-11 Abb Schweiz Ag Semiconductor power stack of a modular multilevel converter
DE102017203420A1 (de) * 2017-03-02 2018-09-06 Siemens Aktiengesellschaft Halbbrücke für leistungselektronische Schaltungen
WO2021073721A1 (en) 2019-10-15 2021-04-22 Abb Power Grids Switzerland Ag Switching circuit with snubber components

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS589349A (ja) * 1981-07-10 1983-01-19 Hitachi Ltd Ｇｔｏスタツク
US4674024A (en) * 1986-06-05 1987-06-16 Westinghouse Electric Corp. High voltage modular inverter and control system thereof
FI880817A (fi) * 1987-07-17 1989-01-18 Siemens Ag Anordning foer koppling med laog foerlust av ett halvledarkopplingselement i en trepunktvaexelriktare.
DE3743436C1 (de) * 1987-12-21 1989-05-11 Siemens Ag Schaltentlasteter,verlustarmer Dreipunktwechselrichter
US5045924A (en) * 1988-02-26 1991-09-03 Kabushiki Kaisha Toshiba Mounting structure of semiconductor converter
JP2658427B2 (ja) * 1989-01-17 1997-09-30 富士電機株式会社 電力変換用半導体素子のスナバ回路とそのモジュール装置
JP3325030B2 (ja) * 1991-06-06 2002-09-17 三菱電機株式会社 ３レベルインバータ装置
DE69233450T2 (de) 1991-09-20 2005-12-15 Hitachi, Ltd. Halbleitermodul
JP3173068B2 (ja) * 1991-10-22 2001-06-04 株式会社日立製作所 電力変換器
JP2735497B2 (ja) * 1995-01-31 1998-04-02 株式会社東芝 スナバ回路
DE19523095A1 (de) * 1995-06-26 1997-01-02 Abb Management Ag Stromrichterschaltungsanordnung
US6169672B1 (en) * 1996-07-03 2001-01-02 Hitachi, Ltd. Power converter with clamping circuit
DE19632173A1 (de) * 1996-08-09 1998-02-12 Asea Brown Boveri Stromrichterschaltungsanordnung
US5982646A (en) * 1998-06-30 1999-11-09 General Electric Company Voltage clamp snubbers for three level converter
JP2001057407A (ja) 1999-08-19 2001-02-27 Meidensha Corp ヒートシンク配置装置
JP3652934B2 (ja) * 1999-09-06 2005-05-25 東芝三菱電機産業システム株式会社 電力変換装置
DE10062075A1 (de) * 2000-12-13 2002-06-27 Bosch Gmbh Robert Umrichter mit integrierten Zwischenkreiskondensatoren
CN1291543C (zh) * 2001-08-13 2006-12-20 应达公司 容错电源变换电路
EP1768244A1 (en) * 2004-07-01 2007-03-28 The Kansai Electric Power Co., Inc. Snubber circuit and power semiconductor device having snubber circuit
JP4661645B2 (ja) 2005-03-23 2011-03-30 トヨタ自動車株式会社 パワー半導体モジュール
BRPI0822356B1 (pt) * 2008-03-20 2019-02-05 Abb Schweiz Ag conversor de fonte de voltagem e instalação para transmissão de potência elétrica
US8385068B2 (en) * 2009-06-16 2013-02-26 Abb Technology Ag Cooling of electrical components
JP5218541B2 (ja) 2010-12-14 2013-06-26 株式会社デンソー スイッチングモジュール
FR2976404B1 (fr) * 2011-06-10 2013-07-12 Converteam Technology Ltd Pile de composants electroniques maintenus suivant un empilement presse
WO2013009711A1 (en) * 2011-07-08 2013-01-17 Timler John P Insulator based upon one or more dielectric structures
DE202012008739U1 (de) 2012-09-12 2013-12-16 Abb Technology Ag Kühlkreislauf mit ausreichend knapp bemessenem Wärmetauscher

Also Published As

Publication number Publication date
EP2989660A1 (de) 2016-03-02
EP2989660B1 (de) 2017-01-04
CA2926022A1 (en) 2015-04-09
CN105593989A (zh) 2016-05-18
US10164519B2 (en) 2018-12-25
WO2015049387A1 (de) 2015-04-09
BR112016006798A2 (pt) 2017-08-01
DE202013104510U1 (de) 2013-11-14
CN105593989B (zh) 2019-12-24
US20160218615A1 (en) 2016-07-28
AU2014331067A1 (en) 2016-05-05

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