MX2016000056A - Anticatodo para el deposito por chisporroteo reactivo de capas electricamente aislantes. - Google Patents
Anticatodo para el deposito por chisporroteo reactivo de capas electricamente aislantes.Info
- Publication number
- MX2016000056A MX2016000056A MX2016000056A MX2016000056A MX2016000056A MX 2016000056 A MX2016000056 A MX 2016000056A MX 2016000056 A MX2016000056 A MX 2016000056A MX 2016000056 A MX2016000056 A MX 2016000056A MX 2016000056 A MX2016000056 A MX 2016000056A
- Authority
- MX
- Mexico
- Prior art keywords
- target
- electrically insulating
- insulating layers
- reactive sputter
- sputter deposition
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
- H01J37/3429—Plural materials
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/081—Oxides of aluminium, magnesium or beryllium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3485—Sputtering using pulsed power to the target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3417—Arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3423—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3464—Operating strategies
- H01J37/3467—Pulsed operation, e.g. HIPIMS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3321—CVD [Chemical Vapor Deposition]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3322—Problems associated with coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Coating By Spraying Or Casting (AREA)
Abstract
La presente invención se refiere a un anticátodo cuya superficie de anticátodo se incorpora de modo que el uso del anticátodo para el depósito por chisporroteo reactivo de capas eléctricamente aislantes en una cámara de revestimiento impide la producción de una descarga de chispas de la superficie de anticátodo a un ánodo que está situado en la cámara de revestimiento.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361843998P | 2013-07-09 | 2013-07-09 | |
PCT/EP2014/001884 WO2015003806A1 (de) | 2013-07-09 | 2014-07-09 | Target zur reaktiven sputter-abscheidung elektrisch-isolierender schichten |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2016000056A true MX2016000056A (es) | 2016-08-17 |
Family
ID=51210406
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2016000056A MX2016000056A (es) | 2013-07-09 | 2014-07-09 | Anticatodo para el deposito por chisporroteo reactivo de capas electricamente aislantes. |
MX2021002242A MX2021002242A (es) | 2013-07-09 | 2016-01-07 | Objetivo para el deposito por pulverizacion catodica reactiva de capas electricamente aislantes. |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2021002242A MX2021002242A (es) | 2013-07-09 | 2016-01-07 | Objetivo para el deposito por pulverizacion catodica reactiva de capas electricamente aislantes. |
Country Status (15)
Country | Link |
---|---|
US (1) | US20160141157A1 (es) |
EP (1) | EP3019640B1 (es) |
JP (1) | JP6539649B2 (es) |
KR (1) | KR102234456B1 (es) |
CN (1) | CN105378138B (es) |
BR (1) | BR112016000035B1 (es) |
CA (1) | CA2932841C (es) |
HK (1) | HK1217976A1 (es) |
IL (1) | IL243464B (es) |
MX (2) | MX2016000056A (es) |
MY (1) | MY185599A (es) |
PH (1) | PH12015502842A1 (es) |
RU (1) | RU2016103909A (es) |
SG (1) | SG11201510706UA (es) |
WO (1) | WO2015003806A1 (es) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI754542B (zh) * | 2016-07-11 | 2022-02-01 | 日商半導體能源研究所股份有限公司 | 濺射靶材及金屬氧化物 |
KR102626873B1 (ko) * | 2021-11-17 | 2024-01-17 | 이계영 | HiPIMS를 이용한 전극 증착 방법 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4465575A (en) * | 1981-09-21 | 1984-08-14 | Atlantic Richfield Company | Method for forming photovoltaic cells employing multinary semiconductor films |
US4448659A (en) * | 1983-09-12 | 1984-05-15 | Vac-Tec Systems, Inc. | Method and apparatus for evaporation arc stabilization including initial target cleaning |
JPS60131965A (ja) * | 1983-12-19 | 1985-07-13 | Matsushita Electric Ind Co Ltd | スパツタ用タ−ゲツト装置 |
US5126318A (en) * | 1991-03-13 | 1992-06-30 | Westinghouse Electric Corp. | Sputtering method for forming superconductive films using water vapor addition |
US5466355A (en) * | 1993-07-15 | 1995-11-14 | Japan Energy Corporation | Mosaic target |
JPH09143706A (ja) * | 1995-11-14 | 1997-06-03 | Mitsubishi Chem Corp | スパッタリングターゲット |
US5674367A (en) * | 1995-12-22 | 1997-10-07 | Sony Corporation | Sputtering target having a shrink fit mounting ring |
US5738770A (en) * | 1996-06-21 | 1998-04-14 | Sony Corporation | Mechanically joined sputtering target and adapter therefor |
US6086735A (en) * | 1998-06-01 | 2000-07-11 | Praxair S.T. Technology, Inc. | Contoured sputtering target |
US6716321B2 (en) * | 2001-10-04 | 2004-04-06 | Northrop Grumman Corporation | Modified electrical properties of sputtered thermal coatings |
JP2004269939A (ja) * | 2003-03-06 | 2004-09-30 | Seiko Epson Corp | スパッタ装置及びスパッタリング方法及び半導体装置 |
WO2005019493A2 (en) * | 2003-08-11 | 2005-03-03 | Honeywell International Inc. | Target/backing plate constructions, and methods of forming them |
US20060137969A1 (en) * | 2004-12-29 | 2006-06-29 | Feldewerth Gerald B | Method of manufacturing alloy sputtering targets |
US20070056843A1 (en) * | 2005-09-13 | 2007-03-15 | Applied Materials, Inc. | Method of processing a substrate using a large-area magnetron sputtering chamber with individually controlled sputtering zones |
US8043488B2 (en) * | 2006-06-02 | 2011-10-25 | Bekaert Advanced Coatings | Rotatable sputter target |
EP2166128B1 (de) * | 2008-09-19 | 2011-11-09 | Oerlikon Trading AG, Trübbach | Verfahren zum Herstellen von Metalloxidschichten durch Funkenverdampfung |
US20100025229A1 (en) * | 2008-07-30 | 2010-02-04 | Guardian Industries Corp. | Apparatus and method for sputtering target debris reduction |
KR20150092375A (ko) * | 2010-06-17 | 2015-08-12 | 울박, 인크 | 스퍼터 성막 장치 및 방착부재 |
JP5968740B2 (ja) * | 2012-09-20 | 2016-08-10 | 株式会社アルバック | ターゲット装置、スパッタ装置、及び、ターゲット装置の製造方法 |
-
2014
- 2014-07-09 SG SG11201510706UA patent/SG11201510706UA/en unknown
- 2014-07-09 RU RU2016103909A patent/RU2016103909A/ru not_active Application Discontinuation
- 2014-07-09 BR BR112016000035-8A patent/BR112016000035B1/pt not_active IP Right Cessation
- 2014-07-09 CN CN201480039448.2A patent/CN105378138B/zh active Active
- 2014-07-09 EP EP14739679.0A patent/EP3019640B1/de active Active
- 2014-07-09 CA CA2932841A patent/CA2932841C/en active Active
- 2014-07-09 JP JP2016524702A patent/JP6539649B2/ja active Active
- 2014-07-09 MY MYPI2016700040A patent/MY185599A/en unknown
- 2014-07-09 WO PCT/EP2014/001884 patent/WO2015003806A1/de active Application Filing
- 2014-07-09 US US14/904,343 patent/US20160141157A1/en not_active Abandoned
- 2014-07-09 KR KR1020167003139A patent/KR102234456B1/ko active IP Right Grant
- 2014-07-09 MX MX2016000056A patent/MX2016000056A/es unknown
-
2015
- 2015-12-21 PH PH12015502842A patent/PH12015502842A1/en unknown
-
2016
- 2016-01-05 IL IL24346416A patent/IL243464B/en active IP Right Grant
- 2016-01-07 MX MX2021002242A patent/MX2021002242A/es unknown
- 2016-05-25 HK HK16105957.2A patent/HK1217976A1/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
HK1217976A1 (zh) | 2017-01-27 |
CA2932841C (en) | 2021-11-23 |
EP3019640B1 (de) | 2020-01-08 |
BR112016000035B1 (pt) | 2022-01-25 |
US20160141157A1 (en) | 2016-05-19 |
IL243464A0 (en) | 2016-02-29 |
CN105378138B (zh) | 2017-11-17 |
JP6539649B2 (ja) | 2019-07-03 |
KR20160029113A (ko) | 2016-03-14 |
BR112016000035A8 (pt) | 2018-01-02 |
CN105378138A (zh) | 2016-03-02 |
PH12015502842A1 (en) | 2016-03-21 |
WO2015003806A1 (de) | 2015-01-15 |
RU2016103909A (ru) | 2017-08-14 |
KR102234456B1 (ko) | 2021-04-01 |
SG11201510706UA (en) | 2016-01-28 |
EP3019640A1 (de) | 2016-05-18 |
JP2016524049A (ja) | 2016-08-12 |
BR112016000035A2 (es) | 2017-07-25 |
MX2021002242A (es) | 2021-05-27 |
CA2932841A1 (en) | 2015-01-15 |
IL243464B (en) | 2019-11-28 |
MY185599A (en) | 2021-05-24 |
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