MX2014015146A - Fuente de evaporacion de arco. - Google Patents
Fuente de evaporacion de arco.Info
- Publication number
- MX2014015146A MX2014015146A MX2014015146A MX2014015146A MX2014015146A MX 2014015146 A MX2014015146 A MX 2014015146A MX 2014015146 A MX2014015146 A MX 2014015146A MX 2014015146 A MX2014015146 A MX 2014015146A MX 2014015146 A MX2014015146 A MX 2014015146A
- Authority
- MX
- Mexico
- Prior art keywords
- magnetic field
- induction magnet
- target
- field induction
- arc
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/354—Introduction of auxiliary energy into the plasma
- C23C14/358—Inductive energy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/548—Controlling the composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32055—Arc discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
- H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Se proporciona una fuente de evaporación de arco equipada con una diana, un imán guía de campo magnético con forma de anillo y una fuente de generación de campo magnético del lado trasero. El imán guía de campo magnético se almea en una dirección perpendicular a la cara de evaporación de la diana y tiene una polaridad que es la dirección de magnetización que se orienta hacia delante o hacia atrás. La fuente de generación de campo magnético del lado trasero está dispuesta en la parte trasera del imán guía de campo magnético, que está en el lado del lado trasero de la diana, y forma líneas de fuerza magnética que se desarrollan en la dirección de magnetización del imán guía de campo magnético. La diana está dispuesta de manera que la cara de evaporación se coloca enfrente del imán guía de campo magnético.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012139078A JP5946337B2 (ja) | 2012-06-20 | 2012-06-20 | アーク式蒸発源 |
PCT/JP2013/066088 WO2013191038A1 (ja) | 2012-06-20 | 2013-06-11 | アーク式蒸発源 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2014015146A true MX2014015146A (es) | 2015-03-05 |
Family
ID=49768638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2014015146A MX2014015146A (es) | 2012-06-20 | 2013-06-11 | Fuente de evaporacion de arco. |
Country Status (10)
Country | Link |
---|---|
US (1) | US9818586B2 (es) |
EP (1) | EP2865783B1 (es) |
JP (1) | JP5946337B2 (es) |
KR (1) | KR101629131B1 (es) |
BR (1) | BR112014031757B1 (es) |
CA (1) | CA2871419C (es) |
IL (1) | IL235153A0 (es) |
MX (1) | MX2014015146A (es) |
TW (1) | TWI491752B (es) |
WO (1) | WO2013191038A1 (es) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6403269B2 (ja) * | 2014-07-30 | 2018-10-10 | 株式会社神戸製鋼所 | アーク蒸発源 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11269634A (ja) | 1998-03-20 | 1999-10-05 | Kobe Steel Ltd | 真空アーク蒸発源 |
TWI242049B (en) | 1999-01-14 | 2005-10-21 | Kobe Steel Ltd | Vacuum arc evaporation source and vacuum arc vapor deposition apparatus |
BR0116951B1 (pt) | 2001-03-27 | 2011-06-14 | evaporador de arco com guia magnÉtico poderoso para alvos tendo uma grande Área de superfÍcie. | |
US7211138B2 (en) | 2003-02-07 | 2007-05-01 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Hard film, method of forming the same and target for hard film formation |
JP4456374B2 (ja) * | 2003-02-07 | 2010-04-28 | 株式会社神戸製鋼所 | 硬質皮膜及びその製造方法並びに硬質皮膜形成用ターゲット |
DE602005019800D1 (de) * | 2005-12-16 | 2010-04-15 | Fundacion Tekniker | Kathodenverdampfungsmaschine |
WO2007131944A2 (de) | 2006-05-16 | 2007-11-22 | Oerlikon Trading Ag, Trübbach | Arcquelle und magnetanordnung |
JP5063143B2 (ja) * | 2007-03-02 | 2012-10-31 | 株式会社リケン | アーク式蒸発源 |
WO2008125397A1 (de) | 2007-04-17 | 2008-10-23 | Sulzer Metaplas Gmbh | Vakuum lichtbogenverdampfungsquelle, sowie eine lichtbogenverdampfungskammer mit einer vakuum lichtbogenverdampfungsquelle |
WO2009090994A1 (ja) * | 2008-01-15 | 2009-07-23 | Ulvac, Inc. | 基板ステージ、これを備えたスパッタ装置及び成膜方法 |
WO2010072850A1 (es) * | 2008-12-26 | 2010-07-01 | Fundacion Tekniker | Evaporador de arco y método para operar el evaporador |
JP5649308B2 (ja) | 2009-04-28 | 2015-01-07 | 株式会社神戸製鋼所 | 成膜速度が速いアーク式蒸発源及びこのアーク式蒸発源を用いた皮膜の製造方法 |
JP5318052B2 (ja) | 2010-06-23 | 2013-10-16 | 株式会社神戸製鋼所 | 成膜速度が速いアーク式蒸発源、このアーク式蒸発源を用いた皮膜の製造方法及び成膜装置 |
MX363412B (es) | 2011-02-23 | 2019-03-22 | Kobe Steel Ltd | Fuente de evaporacion por arco. |
KR20130106575A (ko) * | 2012-03-20 | 2013-09-30 | (주)유진에스엠씨 | 진공 아크 증발 유닛 및 이를 포함하는 아크 이온 플레이팅 장치 |
-
2012
- 2012-06-20 JP JP2012139078A patent/JP5946337B2/ja active Active
-
2013
- 2013-06-11 EP EP13806135.3A patent/EP2865783B1/en active Active
- 2013-06-11 MX MX2014015146A patent/MX2014015146A/es unknown
- 2013-06-11 US US14/397,550 patent/US9818586B2/en active Active
- 2013-06-11 KR KR1020147035083A patent/KR101629131B1/ko active IP Right Grant
- 2013-06-11 WO PCT/JP2013/066088 patent/WO2013191038A1/ja active Application Filing
- 2013-06-11 BR BR112014031757-7A patent/BR112014031757B1/pt active IP Right Grant
- 2013-06-11 CA CA2871419A patent/CA2871419C/en not_active Expired - Fee Related
- 2013-06-19 TW TW102121731A patent/TWI491752B/zh active
-
2014
- 2014-10-19 IL IL235153A patent/IL235153A0/en unknown
Also Published As
Publication number | Publication date |
---|---|
US9818586B2 (en) | 2017-11-14 |
IL235153A0 (en) | 2014-12-31 |
WO2013191038A1 (ja) | 2013-12-27 |
BR112014031757B1 (pt) | 2021-05-25 |
EP2865783A1 (en) | 2015-04-29 |
EP2865783B1 (en) | 2019-12-11 |
US20150122644A1 (en) | 2015-05-07 |
CA2871419C (en) | 2019-03-12 |
JP2014001440A (ja) | 2014-01-09 |
BR112014031757A2 (pt) | 2017-06-27 |
TW201414866A (zh) | 2014-04-16 |
JP5946337B2 (ja) | 2016-07-06 |
EP2865783A4 (en) | 2015-12-30 |
KR20150008494A (ko) | 2015-01-22 |
KR101629131B1 (ko) | 2016-06-09 |
CA2871419A1 (en) | 2013-12-27 |
TWI491752B (zh) | 2015-07-11 |
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