MX2014008936A - Protección de compensacion y acoplamiento mejorado en tarjetas inteligentes metalizadas. - Google Patents
Protección de compensacion y acoplamiento mejorado en tarjetas inteligentes metalizadas.Info
- Publication number
- MX2014008936A MX2014008936A MX2014008936A MX2014008936A MX2014008936A MX 2014008936 A MX2014008936 A MX 2014008936A MX 2014008936 A MX2014008936 A MX 2014008936A MX 2014008936 A MX2014008936 A MX 2014008936A MX 2014008936 A MX2014008936 A MX 2014008936A
- Authority
- MX
- Mexico
- Prior art keywords
- antenna
- module
- smart card
- reinforcement
- ferrite
- Prior art date
Links
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 18
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- 229910052802 copper Inorganic materials 0.000 claims description 16
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- 239000002184 metal Substances 0.000 description 32
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 15
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 238000001465 metallisation Methods 0.000 description 6
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- 239000002131 composite material Substances 0.000 description 5
- 230000005672 electromagnetic field Effects 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000002679 ablation Methods 0.000 description 2
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- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
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- 241000416536 Euproctis pseudoconspersa Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
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- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0239—Signal transmission by AC coupling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
- Details Of Aerials (AREA)
- Support Of Aerials (AREA)
Applications Claiming Priority (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261589434P | 2012-01-23 | 2012-01-23 | |
| US201261619951P | 2012-04-04 | 2012-04-04 | |
| US201261624384P | 2012-04-15 | 2012-04-15 | |
| US201261693262P | 2012-08-25 | 2012-08-25 | |
| US13/600,140 US8991712B2 (en) | 2010-08-12 | 2012-08-30 | Coupling in and to RFID smart cards |
| US201261697825P | 2012-09-07 | 2012-09-07 | |
| US201261732414P | 2012-12-03 | 2012-12-03 | |
| US201261737746P | 2012-12-15 | 2012-12-15 | |
| US13/730,811 US9165240B2 (en) | 2009-10-15 | 2012-12-28 | Coupling in and to RFID smart cards |
| PCT/EP2013/051175 WO2013110625A1 (en) | 2012-01-23 | 2013-01-23 | Offsetting shielding and enhancing coupling in metallized smart cards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2014008936A true MX2014008936A (es) | 2015-06-02 |
Family
ID=47722223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2014008936A MX2014008936A (es) | 2012-01-23 | 2013-01-23 | Protección de compensacion y acoplamiento mejorado en tarjetas inteligentes metalizadas. |
Country Status (9)
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9798968B2 (en) | 2013-01-18 | 2017-10-24 | Féinics Amatech Teoranta | Smartcard with coupling frame and method of increasing activation distance of a transponder chip module |
| US9475086B2 (en) | 2013-01-18 | 2016-10-25 | Féinics Amatech Teoranta | Smartcard with coupling frame and method of increasing activation distance of a transponder chip module |
| US10733494B2 (en) | 2014-08-10 | 2020-08-04 | Féinics Amatech Teoranta | Contactless metal card constructions |
| US10518518B2 (en) | 2013-01-18 | 2019-12-31 | Féinics Amatech Teoranta | Smart cards with metal layer(s) and methods of manufacture |
| US9697459B2 (en) | 2014-08-10 | 2017-07-04 | Féinics Amatech Teoranta | Passive smart cards, metal cards, payment objects and smart jewelry |
| US10552722B2 (en) | 2014-08-10 | 2020-02-04 | Féinics Amatech Teoranta | Smartcard with coupling frame antenna |
| US10824931B2 (en) | 2012-08-30 | 2020-11-03 | Féinics Amatech Teoranta | Contactless smartcards with multiple coupling frames |
| US10977542B2 (en) | 2013-01-18 | 2021-04-13 | Amtech Group Limited Industrial Estate | Smart cards with metal layer(s) and methods of manufacture |
| US10599972B2 (en) | 2013-01-18 | 2020-03-24 | Féinics Amatech Teoranta | Smartcard constructions and methods |
| US11354558B2 (en) | 2013-01-18 | 2022-06-07 | Amatech Group Limited | Contactless smartcards with coupling frames |
| US11354560B2 (en) | 2013-01-18 | 2022-06-07 | Amatech Group Limited | Smartcards with multiple coupling frames |
| US11551051B2 (en) | 2013-01-18 | 2023-01-10 | Amatech Group Limiied | Coupling frames for smartcards with various module opening shapes |
| US11386317B2 (en) | 2013-01-18 | 2022-07-12 | Amatech Group Limited | Transponder chip module with module antenna(s) and coupling frame(s) |
| FR3009410B1 (fr) * | 2013-07-31 | 2015-08-28 | Oberthur Technologies | Entite electronique a couplage integre entre un microcircuit et une antenne et procede de fabrication |
| ES3007784T3 (en) * | 2013-11-13 | 2025-03-20 | Feinics Amatech Teoranta | Smartcard with coupling frame and method of increasing activation distance of a transponder chip module |
| EP3754554A1 (en) * | 2014-03-26 | 2020-12-23 | Féinics Amatech Teoranta | Module tape and transponder chip module |
| EP3751463A1 (en) * | 2014-09-22 | 2020-12-16 | Féinics Amatech Teoranta | Smartcards and card body constructions |
| WO2016046184A1 (en) * | 2014-09-22 | 2016-03-31 | Féinics Amatech Teoranta | Passive smart cards, metal cards, payment objects and smart jewelry |
| WO2016059285A1 (en) * | 2014-10-14 | 2016-04-21 | Confidex Oy | Rfid transponder and rfid transponder web |
| US10289944B2 (en) * | 2015-07-08 | 2019-05-14 | Composecure, Llc | Metal smart card with dual interface capability |
| ES2982667T3 (es) | 2015-07-08 | 2024-10-17 | Composecure Llc | Tarjeta inteligente de metal con capacidad de interfaz dual |
| CN105205527A (zh) * | 2015-09-15 | 2015-12-30 | 武汉天喻信息产业股份有限公司 | 一种金属射频卡 |
| FR3047101B1 (fr) * | 2016-01-26 | 2022-04-01 | Linxens Holding | Procede de fabrication d’un module de carte a puce et d’une carte a puce |
| US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
| US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
| US11267172B2 (en) | 2016-07-27 | 2022-03-08 | Composecure, Llc | Overmolded electronic components for transaction cards and methods of making thereof |
| US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
| KR101868478B1 (ko) * | 2016-08-17 | 2018-07-23 | 주식회사 아이씨케이 | 비접촉식 카드 기능을 갖는 메탈 카드 |
| JP6888402B2 (ja) * | 2017-05-01 | 2021-06-16 | 凸版印刷株式会社 | 基板モジュール |
| MX2020002107A (es) * | 2017-08-25 | 2020-09-18 | Cpi Card Group Colorado Inc | Tarjeta de transaccion ponderada. |
| EP3679523B1 (en) * | 2017-09-07 | 2023-02-01 | Composecure LLC | Transaction card with embedded electronic components and process for manufacture |
| US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| KR102741051B1 (ko) | 2017-10-18 | 2024-12-09 | 컴포시큐어 엘엘씨 | 윈도우 또는 윈도우 패턴 및 선택적인 백라이팅을 갖는 금속, 세라믹, 또는 세라믹 코팅된 트랜잭션 카드 |
| US10268946B1 (en) * | 2017-11-20 | 2019-04-23 | Capital One Services, Llc | Antenna formed using laser plating or print-and-plating for field-powered short range communications |
| WO2019173455A1 (en) | 2018-03-07 | 2019-09-12 | X-Card Holdings, Llc | Metal card |
| CN112384932A (zh) * | 2018-05-10 | 2021-02-19 | 安全创造有限责任公司 | 具有增强天线的双接口金属智能卡 |
| KR102039900B1 (ko) * | 2018-09-19 | 2019-11-04 | 코나아이 (주) | 메탈 카드 및 메탈 카드 제조 방법 |
| FR3089090B1 (fr) * | 2018-11-22 | 2021-03-19 | Smart Packaging Solutions | Procédé de fabrication d’un module souple et module obtenu |
| CN109657762A (zh) * | 2018-12-10 | 2019-04-19 | 天津博苑高新材料有限公司 | 一种制卡基片，其制备方法和含有其的ic卡或电子标签 |
| CN113906444A (zh) * | 2019-05-31 | 2022-01-07 | 安全创造有限责任公司 | Rfid装置 |
| USD948613S1 (en) | 2020-04-27 | 2022-04-12 | Composecure, Llc | Layer of a transaction card |
| JP7463858B2 (ja) * | 2020-06-08 | 2024-04-09 | Ｔｏｐｐａｎホールディングス株式会社 | デュアルｉｃカード |
| CA3185591A1 (en) | 2020-07-24 | 2022-01-27 | Linxens Holding | Electrical circuit for a smart card chip module, smart card chip module and method for manufacturing a smart card chip module |
| CN116368491A (zh) * | 2020-12-02 | 2023-06-30 | 凸版印刷株式会社 | 卡片型介质、卡片型介质用的电子元件及卡片型介质用的金属制卡片基材 |
| US20240289584A1 (en) * | 2023-02-24 | 2024-08-29 | Protec Secure Card | Dual interface smart card |
| WO2025133662A1 (en) | 2023-12-21 | 2025-06-26 | Linxens Holding | Substrate for an rfid transponder with metal inlay |
| CN119250098B (zh) * | 2024-10-28 | 2025-04-15 | 深圳市茂业鑫精密科技有限公司 | 一种微晶纳米悬浮工艺智能卡清洗装置 |
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| WO1997030418A2 (de) | 1996-02-12 | 1997-08-21 | David Finn | Verfahren und vorrichtung zur kontaktierung eines drahtleiters |
| DE19634661A1 (de) | 1996-08-28 | 1998-03-05 | David Finn | Verfahren und Vorrichtung zur Herstellung einer Spulenanordnung |
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| US6329958B1 (en) | 1998-09-11 | 2001-12-11 | Tdk Rf Solutions, Inc. | Antenna formed within a conductive surface |
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| EP1158601A1 (de) * | 2000-05-15 | 2001-11-28 | Häni Prolectron Ag | Trägerelement für eine Antenne mit geringer Handempfindlichkeit |
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| JP4333555B2 (ja) * | 2004-10-27 | 2009-09-16 | 富士通株式会社 | Ｒｆｉｄタグ |
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| FR2890212B1 (fr) | 2005-08-30 | 2009-08-21 | Smart Packaging Solutions Sps | Module electronique a double interface de communication, notamment pour carte a puce |
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| US7980477B2 (en) | 2007-05-17 | 2011-07-19 | Féinics Amatech Teoranta | Dual interface inlays |
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| JP5332254B2 (ja) | 2008-03-25 | 2013-11-06 | Ｔｄｋ株式会社 | フェライト焼結体 |
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| US8366009B2 (en) | 2010-08-12 | 2013-02-05 | Féinics Amatech Teoranta | Coupling in and to RFID smart cards |
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| US20120055013A1 (en) | 2010-07-13 | 2012-03-08 | Féinics AmaTech Nominee Limited | Forming microstructures and antennas for transponders |
| US8944810B2 (en) | 2010-02-02 | 2015-02-03 | Composecure, Llc | Metal card |
| CN201853247U (zh) * | 2010-09-21 | 2011-06-01 | 上海卡美循环技术有限公司 | 一种高强度抗污高速公路通行卡 |
-
2013
- 2013-01-23 BR BR112014018042A patent/BR112014018042A8/pt not_active IP Right Cessation
- 2013-01-23 CA CA2860909A patent/CA2860909C/en active Active
- 2013-01-23 MX MX2014008936A patent/MX2014008936A/es not_active Application Discontinuation
- 2013-01-23 KR KR1020147023591A patent/KR20140117614A/ko not_active Ceased
- 2013-01-23 CN CN201380006299.5A patent/CN104471791A/zh active Pending
- 2013-01-23 WO PCT/EP2013/051175 patent/WO2013110625A1/en active Application Filing
- 2013-01-23 AU AU2013211649A patent/AU2013211649A1/en not_active Abandoned
- 2013-01-23 EP EP13704726.2A patent/EP2807700A1/en not_active Withdrawn
- 2013-01-23 JP JP2014552661A patent/JP2015513712A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015513712A (ja) | 2015-05-14 |
| CA2860909C (en) | 2021-11-16 |
| BR112014018042A2 (enrdf_load_stackoverflow) | 2017-06-20 |
| KR20140117614A (ko) | 2014-10-07 |
| CA2860909A1 (en) | 2013-08-01 |
| EP2807700A1 (en) | 2014-12-03 |
| AU2013211649A1 (en) | 2014-07-31 |
| CN104471791A (zh) | 2015-03-25 |
| BR112014018042A8 (pt) | 2017-07-11 |
| WO2013110625A1 (en) | 2013-08-01 |
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