BR112014018042A8 - Deslocando blindagem e aprimorando acoplamento em cartões inteligentes metalizados - Google Patents

Deslocando blindagem e aprimorando acoplamento em cartões inteligentes metalizados

Info

Publication number
BR112014018042A8
BR112014018042A8 BR112014018042A BR112014018042A BR112014018042A8 BR 112014018042 A8 BR112014018042 A8 BR 112014018042A8 BR 112014018042 A BR112014018042 A BR 112014018042A BR 112014018042 A BR112014018042 A BR 112014018042A BR 112014018042 A8 BR112014018042 A8 BR 112014018042A8
Authority
BR
Brazil
Prior art keywords
antenna
module
amplifier
shield
faceplate
Prior art date
Application number
BR112014018042A
Other languages
English (en)
Portuguese (pt)
Other versions
BR112014018042A2 (enrdf_load_stackoverflow
Inventor
Finn David
Original Assignee
Feinics Amatech Teoranta
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/600,140 external-priority patent/US8991712B2/en
Priority claimed from US13/730,811 external-priority patent/US9165240B2/en
Application filed by Feinics Amatech Teoranta filed Critical Feinics Amatech Teoranta
Publication of BR112014018042A2 publication Critical patent/BR112014018042A2/pt
Publication of BR112014018042A8 publication Critical patent/BR112014018042A8/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0239—Signal transmission by AC coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Support Of Aerials (AREA)
BR112014018042A 2012-01-23 2013-01-23 Deslocando blindagem e aprimorando acoplamento em cartões inteligentes metalizados BR112014018042A8 (pt)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US201261589434P 2012-01-23 2012-01-23
US201261619951P 2012-04-04 2012-04-04
US201261624384P 2012-04-15 2012-04-15
US201261693262P 2012-08-25 2012-08-25
US13/600,140 US8991712B2 (en) 2010-08-12 2012-08-30 Coupling in and to RFID smart cards
US201261697825P 2012-09-07 2012-09-07
US201261732414P 2012-12-03 2012-12-03
US201261737746P 2012-12-15 2012-12-15
US13/730,811 US9165240B2 (en) 2009-10-15 2012-12-28 Coupling in and to RFID smart cards
PCT/EP2013/051175 WO2013110625A1 (en) 2012-01-23 2013-01-23 Offsetting shielding and enhancing coupling in metallized smart cards

Publications (2)

Publication Number Publication Date
BR112014018042A2 BR112014018042A2 (enrdf_load_stackoverflow) 2017-06-20
BR112014018042A8 true BR112014018042A8 (pt) 2017-07-11

Family

ID=47722223

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014018042A BR112014018042A8 (pt) 2012-01-23 2013-01-23 Deslocando blindagem e aprimorando acoplamento em cartões inteligentes metalizados

Country Status (9)

Country Link
EP (1) EP2807700A1 (enrdf_load_stackoverflow)
JP (1) JP2015513712A (enrdf_load_stackoverflow)
KR (1) KR20140117614A (enrdf_load_stackoverflow)
CN (1) CN104471791A (enrdf_load_stackoverflow)
AU (1) AU2013211649A1 (enrdf_load_stackoverflow)
BR (1) BR112014018042A8 (enrdf_load_stackoverflow)
CA (1) CA2860909C (enrdf_load_stackoverflow)
MX (1) MX2014008936A (enrdf_load_stackoverflow)
WO (1) WO2013110625A1 (enrdf_load_stackoverflow)

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US9697459B2 (en) 2014-08-10 2017-07-04 Féinics Amatech Teoranta Passive smart cards, metal cards, payment objects and smart jewelry
US9798968B2 (en) 2013-01-18 2017-10-24 Féinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
US9475086B2 (en) 2013-01-18 2016-10-25 Féinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
US10824931B2 (en) 2012-08-30 2020-11-03 Féinics Amatech Teoranta Contactless smartcards with multiple coupling frames
US10552722B2 (en) 2014-08-10 2020-02-04 Féinics Amatech Teoranta Smartcard with coupling frame antenna
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US11386317B2 (en) 2013-01-18 2022-07-12 Amatech Group Limited Transponder chip module with module antenna(s) and coupling frame(s)
US11354558B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Contactless smartcards with coupling frames
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FR3047101B1 (fr) * 2016-01-26 2022-04-01 Linxens Holding Procede de fabrication d’un module de carte a puce et d’une carte a puce
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KR20250004919A (ko) 2017-10-18 2025-01-08 컴포시큐어 엘엘씨 윈도우 또는 윈도우 패턴 및 선택적인 백라이팅을 갖는 금속, 세라믹, 또는 세라믹 코팅된 트랜잭션 카드
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Also Published As

Publication number Publication date
BR112014018042A2 (enrdf_load_stackoverflow) 2017-06-20
MX2014008936A (es) 2015-06-02
KR20140117614A (ko) 2014-10-07
JP2015513712A (ja) 2015-05-14
AU2013211649A1 (en) 2014-07-31
WO2013110625A1 (en) 2013-08-01
EP2807700A1 (en) 2014-12-03
CN104471791A (zh) 2015-03-25
CA2860909C (en) 2021-11-16
CA2860909A1 (en) 2013-08-01

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]