MX2011012433A - Microscopia de rayos x para caracterizar las dimensiones y la forma del orificio en agujas quirurgicas. - Google Patents

Microscopia de rayos x para caracterizar las dimensiones y la forma del orificio en agujas quirurgicas.

Info

Publication number
MX2011012433A
MX2011012433A MX2011012433A MX2011012433A MX2011012433A MX 2011012433 A MX2011012433 A MX 2011012433A MX 2011012433 A MX2011012433 A MX 2011012433A MX 2011012433 A MX2011012433 A MX 2011012433A MX 2011012433 A MX2011012433 A MX 2011012433A
Authority
MX
Mexico
Prior art keywords
dimensions
hole shape
ray microscopy
surgical needles
characterizing
Prior art date
Application number
MX2011012433A
Other languages
English (en)
Inventor
Robert E Maurer
Eric Hinrichs
Original Assignee
Ethicon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ethicon Inc filed Critical Ethicon Inc
Publication of MX2011012433A publication Critical patent/MX2011012433A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/04—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring contours or curvatures
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B15/00—Systems controlled by a computer
    • G05B15/02—Systems controlled by a computer electric
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0012—Biomedical image inspection
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B17/00—Surgical instruments, devices or methods, e.g. tourniquets
    • A61B17/04—Surgical instruments, devices or methods, e.g. tourniquets for suturing wounds; Holders or packages for needles or suture materials
    • A61B17/06—Needles ; Sutures; Needle-suture combinations; Holders or packages for needles or suture materials
    • A61B17/06004—Means for attaching suture to needle
    • A61B2017/06028—Means for attaching suture to needle by means of a cylindrical longitudinal blind bore machined at the suture-receiving end of the needle, e.g. opposite to needle tip
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Theoretical Computer Science (AREA)
  • Medical Informatics (AREA)
  • Health & Medical Sciences (AREA)
  • Radiology & Medical Imaging (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Surgical Instruments (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Laser Beam Processing (AREA)

Abstract

Se describe un método novedoso para caracterizar perforaciones realizadas mediante láser; el método usa microscopia de rayos X para la caracterización dimensional; la salida de rayos X podría procesarse para controlar el equipo de fabricación en los sistemas de producción automática, que incluyen los sistemas de taladrado láser y los aparatos de estampado.
MX2011012433A 2009-05-20 2010-05-17 Microscopia de rayos x para caracterizar las dimensiones y la forma del orificio en agujas quirurgicas. MX2011012433A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/469,279 US8389892B2 (en) 2009-05-20 2009-05-20 X-ray microscopy for characterizing hole shape and dimensions in surgical needles
PCT/US2010/035054 WO2010135212A1 (en) 2009-05-20 2010-05-17 X-ray microscopy for characterizing hole shape and dimensions in surgical needles

Publications (1)

Publication Number Publication Date
MX2011012433A true MX2011012433A (es) 2011-12-12

Family

ID=42366948

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2011012433A MX2011012433A (es) 2009-05-20 2010-05-17 Microscopia de rayos x para caracterizar las dimensiones y la forma del orificio en agujas quirurgicas.

Country Status (10)

Country Link
US (2) US8389892B2 (es)
EP (1) EP2433090B1 (es)
JP (1) JP5485380B2 (es)
CN (1) CN102460068B (es)
BR (1) BRPI1013005B1 (es)
CA (1) CA2762669C (es)
ES (1) ES2416105T3 (es)
MX (1) MX2011012433A (es)
RU (1) RU2525318C2 (es)
WO (1) WO2010135212A1 (es)

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CN102481151A (zh) * 2009-08-28 2012-05-30 马尼株式会社 医疗用缝合针
JP5664186B2 (ja) * 2010-12-03 2015-02-04 株式会社島津製作所 固体間接触部位解析方法及び解析装置
US8951266B2 (en) 2011-01-07 2015-02-10 Restoration Robotics, Inc. Methods and systems for modifying a parameter of an automated procedure
CN102107291A (zh) * 2011-03-17 2011-06-29 威海威高富森医用材料有限公司 图像识别针尾自动钻孔方法
DE102011103282B4 (de) * 2011-06-03 2015-09-03 Lessmüller Lasertechnik GmbH Verfahren zum Überwachen der Bearbeitung sowie Vorrichtung zum Bearbeiten eines Werkstücks mit einem hochenergetischen Bearbeitungsstrahl
EP2845661A1 (de) * 2013-09-10 2015-03-11 Bystronic Laser AG Verfahren zum Biegen eines Werkstückes

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SU148531A1 (ru) * 1961-09-29 1961-11-30 В.Д. Семенов Калибр-пробка дл контрол отверстий по иглам игольчатых подшипников без внутреннего кольца
US3390769A (en) 1966-11-23 1968-07-02 Continental Can Co X-ray thickness gauging and classifying apparatus
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JPS626113A (ja) * 1985-07-03 1987-01-13 Toshiba Ceramics Co Ltd 熱電温度計用保護管の製造方法
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US5241419A (en) * 1992-01-27 1993-08-31 General Electric Company Co-axial viewing device for lasers
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US5477609A (en) 1994-01-13 1995-12-26 Ethicon, Inc. Needle and suture swaging station
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Also Published As

Publication number Publication date
BRPI1013005B1 (pt) 2019-11-19
US8389892B2 (en) 2013-03-05
CA2762669C (en) 2015-02-24
CN102460068B (zh) 2014-06-04
CA2762669A1 (en) 2010-11-25
JP2012527616A (ja) 2012-11-08
RU2011151997A (ru) 2013-06-27
JP5485380B2 (ja) 2014-05-07
US20100294747A1 (en) 2010-11-25
EP2433090A1 (en) 2012-03-28
EP2433090B1 (en) 2013-05-01
RU2525318C2 (ru) 2014-08-10
BRPI1013005A2 (pt) 2018-01-16
US8581143B2 (en) 2013-11-12
CN102460068A (zh) 2012-05-16
US20130150992A1 (en) 2013-06-13
ES2416105T3 (es) 2013-07-30
WO2010135212A1 (en) 2010-11-25

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