MX2010006778A - Procedimiento y dispositivo de tratamiento de pastillas de silicio. - Google Patents

Procedimiento y dispositivo de tratamiento de pastillas de silicio.

Info

Publication number
MX2010006778A
MX2010006778A MX2010006778A MX2010006778A MX2010006778A MX 2010006778 A MX2010006778 A MX 2010006778A MX 2010006778 A MX2010006778 A MX 2010006778A MX 2010006778 A MX2010006778 A MX 2010006778A MX 2010006778 A MX2010006778 A MX 2010006778A
Authority
MX
Mexico
Prior art keywords
silicon wafers
etching solution
treating silicon
wafers
treating
Prior art date
Application number
MX2010006778A
Other languages
English (en)
Inventor
Heinz Kappler
Original Assignee
Schmid Gmbh & Co Geb
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40409901&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MX2010006778(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Schmid Gmbh & Co Geb filed Critical Schmid Gmbh & Co Geb
Publication of MX2010006778A publication Critical patent/MX2010006778A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/02—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
    • B05C1/025—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles to flat rectangular articles, e.g. flat sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
    • B05C1/08—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
    • B05C1/0813—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line characterised by means for supplying liquid or other fluent material to the roller
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Photovoltaic Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

La invención se refiere a un método y dispositivo para tratar pastillas de silico. En una primera etapa, se transportan pastillas de silicio (22) en posición horizontal a lo largo de un trayecto de transporte horizontal (12, 32) para tratarlas en un primer paso del procedimiento y se las rocía desde arriba con una solución corrosiva (21) de texturación por medio de boquillas (20) o similares. Desde debajo de las pastillas de silicio (22) se efectúa aquí solamente una pequeña aplicación de solución corrosiva (21). En un segundo paso del procedimiento se humectan las pastillas de silicio (22) desde abajo con una solución corrosiva (35) para la corrosión pulidora, en concreto exclusivamente desde abajo, con la misma orientación de dichas pastillas que en el primer paso del procedimiento.
MX2010006778A 2007-12-19 2008-12-18 Procedimiento y dispositivo de tratamiento de pastillas de silicio. MX2010006778A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007063202A DE102007063202A1 (de) 2007-12-19 2007-12-19 Verfahren und Vorrichtung zur Behandlung von Silizium-Wafern
PCT/EP2008/010894 WO2009077201A2 (de) 2007-12-19 2008-12-18 Verfahren und vorrichtung zur behandlung von silizium-wafern

Publications (1)

Publication Number Publication Date
MX2010006778A true MX2010006778A (es) 2010-08-10

Family

ID=40409901

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2010006778A MX2010006778A (es) 2007-12-19 2008-12-18 Procedimiento y dispositivo de tratamiento de pastillas de silicio.

Country Status (14)

Country Link
US (1) US8623232B2 (es)
EP (1) EP2232526B1 (es)
JP (1) JP5243550B2 (es)
KR (1) KR101622752B1 (es)
CN (1) CN101983415B (es)
AT (1) ATE508472T1 (es)
AU (1) AU2008337880B2 (es)
CA (1) CA2709384A1 (es)
DE (2) DE102007063202A1 (es)
ES (1) ES2366894T3 (es)
IL (1) IL206426A0 (es)
MX (1) MX2010006778A (es)
MY (1) MY157503A (es)
WO (1) WO2009077201A2 (es)

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WO2010025125A1 (en) * 2008-08-29 2010-03-04 Evergreen Solar, Inc. Single-sided textured sheet wafer and manufactoring method therefore
DE102009032217A1 (de) * 2009-07-06 2011-01-13 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zur Behandlung von Substraten
MY158452A (en) * 2009-09-21 2016-10-14 Basf Se Aqueous acidic etching solution and method for texturing the surface of single crystal and polycrystal silicon substrates
DE102009050845A1 (de) 2009-10-19 2011-04-21 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zur Behandlung einer Substratoberfläche eines Substrats
DE102009051847A1 (de) * 2009-10-29 2011-05-19 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zur Behandlung einer Substratoberlfäche eines Substrats
DE102009060931A1 (de) * 2009-12-23 2011-06-30 Gebr. Schmid GmbH & Co., 72250 Verfahren und Vorrichtung zur Behandlung von Siliziumsubstraten
WO2012020274A1 (en) * 2010-08-10 2012-02-16 Rena Gmbh Process and apparatus for texturizing a flat semiconductor substrate
CN102185011A (zh) * 2010-12-02 2011-09-14 江阴浚鑫科技有限公司 太阳能电池片的制绒方法
DE102011109568A1 (de) * 2011-08-05 2013-02-07 Rena Gmbh Abluftsystem und Verfahren dazu
DE102013202138A1 (de) * 2013-02-08 2014-08-14 Gebr. Schmid Gmbh Vorrichtung zur Substratnassbehandlung und Verwendung
CN103258918A (zh) * 2013-05-31 2013-08-21 英利集团有限公司 硅片的制绒方法、太阳能电池片及其制作方法
ES2664762T3 (es) 2013-09-18 2018-04-23 Flint Group Germany Gmbh Elemento de impresión flexográfica en donde puede realizarse la formación de imagen de forma digital y procedimiento para fabricar placas de impresión flexográfica
DE102013218693A1 (de) * 2013-09-18 2015-03-19 lP RENA GmbH Vorrichtung und Verfahren zur asymmetrischen alkalischen Textur von Oberflächen
CN103985630A (zh) * 2014-06-03 2014-08-13 天津源天晟科技发展有限公司 液体内吸附传输方法
DE102014110222B4 (de) * 2014-07-21 2016-06-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur Strukturierung von Ober- und Unterseite eines Halbleitersubstrats
DE102015205437A1 (de) * 2015-03-25 2016-09-29 Rct Solutions Gmbh Vorrichtung und Verfahren zur chemischen Behandlung eines Halbleiter-Substrats
DE102015223227A1 (de) * 2015-11-24 2017-05-24 Rct Solutions Gmbh Vorrichtung und Verfahren zur chemischen Behandlung eines Halbleiter-Substrats
CN105696083B (zh) * 2016-01-29 2018-03-09 盐城阿特斯协鑫阳光电力科技有限公司 一种太阳能电池绒面的制备方法
DE102016210883A1 (de) 2016-06-17 2017-12-21 Singulus Technologies Ag Vorrichtung und Verfahren zur Behandlung von Substraten unter Verwendung einer Auflagerolle mit porösem Material
DE102017203977A1 (de) 2017-03-10 2018-09-13 Gebr. Schmid Gmbh Verfahren zur Herstellung texturierter Wafer und Aufrausprühstrahlbehandlungsvorrichtung
DE102017212442A1 (de) * 2017-07-20 2019-01-24 Singulus Technologies Ag Verfahren und Vorrichtung zum Texturieren einer Oberfläche eines multikristallinen Diamantdraht-gesägten Siliziumsubstrats unter Verwendung von ozonhaltigem Medium
DE102018206978A1 (de) 2018-01-26 2019-08-01 Singulus Technologies Ag Verfahren und Vorrichtung zur Behandlung von geätzten Oberflächen eines Halbleitersubstrats unter Verwendung von ozonhaltigem Medium
DE102018206980A1 (de) 2018-01-26 2019-08-01 Singulus Technologies Ag Verfahren und Vorrichtung zur Reinigung von geätzten Oberflächen eines Halbleitersubstrats
FR3084601B1 (fr) * 2018-07-31 2020-06-26 Safran Aircraft Engines Procede et dispositif pour l'amelioration de l'etat de surface d'une piece de turbomachine
DE202018005266U1 (de) 2018-11-14 2019-03-22 H2GEMINI Technology Consulting GmbH Vorrichtung zur Ätzung von Silizium Substraten
CN109340251A (zh) * 2018-12-13 2019-02-15 武汉华星光电半导体显示技术有限公司 轴承和蚀刻机台及蚀刻方法

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DE4107464A1 (de) * 1991-03-08 1992-09-10 Schmid Gmbh & Co Geb Verfahren und vorrichtung zum einseitigen behandeln von plattenfoermigen gegenstaenden
US5753135A (en) 1995-10-23 1998-05-19 Jablonsky; Julius James Apparatus and method for recovering photoresist developers and strippers
EP0836370A1 (en) 1996-10-08 1998-04-15 Takanori Tsubaki Method and system for etching substrates for printed circuit boards
JP2001210615A (ja) * 2000-01-27 2001-08-03 Seiko Epson Corp 電気光学装置の製造方法および電気光学装置の製造装置
JP2003170086A (ja) * 2001-12-11 2003-06-17 Sumitomo Precision Prod Co Ltd ノズル装置及びこれを備えた基板処理装置
DE10225848A1 (de) 2002-06-04 2003-12-24 Schmid Gmbh & Co Geb Vorrichtung und Verfahren zum Lösen von Schichten von der Oberseite von flächigen Substraten
KR100675628B1 (ko) * 2002-10-16 2007-02-01 엘지.필립스 엘시디 주식회사 절연막 식각장치 및 식각방법
DE20304601U1 (de) * 2003-03-19 2003-06-26 Gebr. Schmid GmbH & Co., 72250 Freudenstadt Vorrichtung zum Transport von flexiblem Flachmaterial, insbesondere Leiterplatten
DE20321702U1 (de) * 2003-05-07 2008-12-24 Universität Konstanz Vorrichtung zum Texturieren von Oberflächen von Silizium-Scheiben
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JP4776380B2 (ja) * 2006-01-20 2011-09-21 株式会社東芝 処理装置及び処理方法
US20080041526A1 (en) * 2006-08-16 2008-02-21 Pass Thomas P Single-sided etching

Also Published As

Publication number Publication date
KR20100105688A (ko) 2010-09-29
ES2366894T3 (es) 2011-10-26
EP2232526A2 (de) 2010-09-29
US20100311247A1 (en) 2010-12-09
JP2011512645A (ja) 2011-04-21
CA2709384A1 (en) 2009-06-25
US8623232B2 (en) 2014-01-07
AU2008337880A1 (en) 2009-06-25
KR101622752B1 (ko) 2016-05-31
DE502008003460D1 (de) 2011-06-16
DE102007063202A1 (de) 2009-06-25
ATE508472T1 (de) 2011-05-15
EP2232526B1 (de) 2011-05-04
WO2009077201A3 (de) 2009-09-11
JP5243550B2 (ja) 2013-07-24
MY157503A (en) 2016-06-15
CN101983415B (zh) 2012-08-08
IL206426A0 (en) 2010-12-30
WO2009077201A2 (de) 2009-06-25
CN101983415A (zh) 2011-03-02
AU2008337880B2 (en) 2013-07-11

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Legal Events

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FA Abandonment or withdrawal