WO2018189130A3 - Verfahren und vorrichtung zur chemischen bearbeitung eines halbleiter-substrats - Google Patents
Verfahren und vorrichtung zur chemischen bearbeitung eines halbleiter-substrats Download PDFInfo
- Publication number
- WO2018189130A3 WO2018189130A3 PCT/EP2018/059069 EP2018059069W WO2018189130A3 WO 2018189130 A3 WO2018189130 A3 WO 2018189130A3 EP 2018059069 W EP2018059069 W EP 2018059069W WO 2018189130 A3 WO2018189130 A3 WO 2018189130A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor substrate
- chemically treating
- treating
- chemically
- asymmetrically
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
- 235000012431 wafers Nutrition 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
- H01L21/30608—Anisotropic liquid etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
Abstract
Die Erfindung betrifft eine Vorrichtung und ein Verfahren zur asymmetrischen Bearbeitung von Wafern (2) in einem einzigen Prozessschritt.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017206455.2 | 2017-04-13 | ||
DE102017206455.2A DE102017206455A1 (de) | 2017-04-13 | 2017-04-13 | Verfahren und Vorrichtung zur chemischen Bearbeitung eines Halbleiter-Substrats |
DE102017215482 | 2017-09-04 | ||
DE102017215482.9 | 2017-09-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2018189130A2 WO2018189130A2 (de) | 2018-10-18 |
WO2018189130A3 true WO2018189130A3 (de) | 2018-12-06 |
Family
ID=61913182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2018/059069 WO2018189130A2 (de) | 2017-04-13 | 2018-04-10 | Verfahren und vorrichtung zur chemischen bearbeitung eines halbleiter-substrats |
Country Status (2)
Country | Link |
---|---|
CN (2) | CN108735595A (de) |
WO (1) | WO2018189130A2 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112877741B (zh) * | 2021-01-13 | 2022-05-03 | 硅密芯镀(海宁)半导体技术有限公司 | 气泡去除方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007073887A1 (de) * | 2005-12-16 | 2007-07-05 | Gebr. Schmid Gmbh + Co. | Vorrichtung und verfahren zur oberflächenbehandlung von substraten |
WO2016150788A1 (de) * | 2015-03-25 | 2016-09-29 | Rct Solutions Gmbh | Vorrichtung und verfahren zur chemischen behandlung eines halbleiter-substrats |
DE102015113589A1 (de) * | 2015-08-17 | 2017-02-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zum Aufbereiten eines HNO3 enthaltenden flüssigen Prozessmittels |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011056495A1 (de) | 2011-12-15 | 2013-06-20 | Rena Gmbh | Verfahren zum einseitigen Glattätzen eines Siliziumsubstrats |
DE102014110222B4 (de) | 2014-07-21 | 2016-06-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur Strukturierung von Ober- und Unterseite eines Halbleitersubstrats |
-
2017
- 2017-11-07 CN CN201711100490.2A patent/CN108735595A/zh active Pending
- 2017-11-07 CN CN201721476130.8U patent/CN208433367U/zh active Active
-
2018
- 2018-04-10 WO PCT/EP2018/059069 patent/WO2018189130A2/de active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007073887A1 (de) * | 2005-12-16 | 2007-07-05 | Gebr. Schmid Gmbh + Co. | Vorrichtung und verfahren zur oberflächenbehandlung von substraten |
WO2016150788A1 (de) * | 2015-03-25 | 2016-09-29 | Rct Solutions Gmbh | Vorrichtung und verfahren zur chemischen behandlung eines halbleiter-substrats |
DE102015113589A1 (de) * | 2015-08-17 | 2017-02-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zum Aufbereiten eines HNO3 enthaltenden flüssigen Prozessmittels |
Also Published As
Publication number | Publication date |
---|---|
WO2018189130A2 (de) | 2018-10-18 |
CN208433367U (zh) | 2019-01-25 |
CN108735595A (zh) | 2018-11-02 |
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