MX2009007930A - Materiales de pelicula adhesiva fundidos en caliente capaces de calentarse intrinsecamente. - Google Patents

Materiales de pelicula adhesiva fundidos en caliente capaces de calentarse intrinsecamente.

Info

Publication number
MX2009007930A
MX2009007930A MX2009007930A MX2009007930A MX2009007930A MX 2009007930 A MX2009007930 A MX 2009007930A MX 2009007930 A MX2009007930 A MX 2009007930A MX 2009007930 A MX2009007930 A MX 2009007930A MX 2009007930 A MX2009007930 A MX 2009007930A
Authority
MX
Mexico
Prior art keywords
hot melt
sheet materials
melt adhesive
adhesive sheet
heatable hot
Prior art date
Application number
MX2009007930A
Other languages
English (en)
Inventor
Klaus Keite-Telgenbuescher
Christina Hirt
Jara Fernandez-Pastor
Original Assignee
Tesa Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa Se filed Critical Tesa Se
Publication of MX2009007930A publication Critical patent/MX2009007930A/es

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/027Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28Metal sheet
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35Heat-activated
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/20Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/34Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/84Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • H05B3/845Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields specially adapted for reflecting surfaces, e.g. bathroom - or rearview mirrors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/20Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/006Heaters using a particular layout for the resistive material or resistive elements using interdigitated electrodes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/009Heaters using conductive material in contact with opposing surfaces of the resistive element or resistive layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/02Heaters using heating elements having a positive temperature coefficient
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/26Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813Heat or solvent activated or sealable
    • Y10T428/2817Heat sealable
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813Heat or solvent activated or sealable
    • Y10T428/2817Heat sealable
    • Y10T428/2826Synthetic resin or polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Surface Heating Bodies (AREA)
  • Resistance Heating (AREA)

Abstract

La invención se relaciona con materiales de película que comprenden por lo menos una capa de una masa de adhesivo, dentro de la cual puede producirse calor, en donde la masa de adhesivo es una masa de adhesivo fundido en caliente y un resistor del PTC.
MX2009007930A 2007-02-13 2008-02-01 Materiales de pelicula adhesiva fundidos en caliente capaces de calentarse intrinsecamente. MX2009007930A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007007617A DE102007007617A1 (de) 2007-02-13 2007-02-13 Intrinsisch erwärmbare heißschmelzklebrige Flächengebilde
PCT/EP2008/051250 WO2008098847A1 (de) 2007-02-13 2008-02-01 Intrinsisch erwärmbare heissschmelzklebrige flächengebilde

Publications (1)

Publication Number Publication Date
MX2009007930A true MX2009007930A (es) 2009-08-18

Family

ID=39367533

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2009007930A MX2009007930A (es) 2007-02-13 2008-02-01 Materiales de pelicula adhesiva fundidos en caliente capaces de calentarse intrinsecamente.

Country Status (10)

Country Link
US (1) US20100038025A1 (es)
EP (1) EP2118911B1 (es)
JP (1) JP2010518590A (es)
KR (1) KR101549981B1 (es)
CN (1) CN101681703B (es)
DE (1) DE102007007617A1 (es)
ES (1) ES2773844T3 (es)
MX (1) MX2009007930A (es)
TW (1) TW200848488A (es)
WO (1) WO2008098847A1 (es)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008034748A1 (de) * 2008-07-24 2010-01-28 Tesa Se Flexibles beheiztes Flächenelement
DE102008049850A1 (de) * 2008-10-01 2010-04-08 Tesa Se Wärmeleitende Haftklebemasse
DE102008063849A1 (de) * 2008-12-19 2010-06-24 Tesa Se Beheiztes Flächenelement und Verfahren zu seiner Befestigung
DE102009005517A1 (de) * 2009-01-20 2010-07-22 Tesa Se Verfahren zur Korrosionsschutzbehandlung
DE102009010437A1 (de) 2009-02-26 2010-09-02 Tesa Se Beheiztes Flächenelement
CN101602867B (zh) * 2009-07-09 2011-04-13 浙江三力士橡胶股份有限公司 一种改性氯丁橡胶v带及其制备方法
DE102009055099A1 (de) * 2009-12-21 2011-06-22 tesa SE, 20253 Hitzeaktiviert verklebbare Flächenelemente
DE102010003440A1 (de) * 2010-03-30 2011-10-06 Lisa Dräxlmaier GmbH Verfahren zum Herstellen von Innenverkleidungsteilen durch Kaschieren sowie Innenverkleidungsteil
TWI406755B (zh) * 2010-10-04 2013-09-01 Advanced Int Multitech Co Ltd Manufacturing Method of Composite Workpiece with Embedded Magnetic Element
WO2012107548A1 (de) * 2011-02-10 2012-08-16 Futurecarbon Gmbh Klebstoffmaterial mit kohlenstoffmaterial sowie verfahren zu dessen herstellung und verwendung
DE102011005901A1 (de) * 2011-03-22 2012-09-27 Lisa Dräxlmaier GmbH Kaltkaschierung mit Strahlung
DE102011080724A1 (de) 2011-08-10 2013-02-14 Tesa Se Elektrisch leitfähige hitzeaktivierbare Klebemasse
DE102011080729A1 (de) 2011-08-10 2013-02-14 Tesa Se Elektrisch leitfähige Haftklebemasse und Haftklebeband
DE102011082425A1 (de) * 2011-09-09 2013-03-14 Hochschule für Nachhaltige Entwicklung Eberswalde Vorrichtung und Verfahren zur permanenten Prüfung von Klebeverbindungen
EP2578624A1 (en) 2011-10-06 2013-04-10 Henkel Italia S.p.A. Polymeric PTC thermistors
DE102014208094A1 (de) 2014-04-29 2015-10-29 MAGNA STEYR Engineering AG & Co KG Vorrichtung zum Aushärten eines elektrisch leitenden Klebstoffes
KR101578479B1 (ko) * 2014-05-07 2015-12-28 신충근 천연 접착제 함유 세라믹 발열 장치
US10077372B2 (en) 2014-06-12 2018-09-18 Lms Consulting Group, Llc Electrically conductive PTC screen printable ink with double switching temperatures and method of making the same
US10373745B2 (en) 2014-06-12 2019-08-06 LMS Consulting Group Electrically conductive PTC ink with double switching temperatures and applications thereof in flexible double-switching heaters
CN104669708B (zh) * 2015-02-12 2017-01-18 张继承 一种地暖加热片及其制造方法
DE102015207818A1 (de) * 2015-04-28 2016-11-17 Benecke-Kaliko Ag Leitfähige Folie für eine Widerstandsheizung
EP3170657B1 (en) 2015-11-19 2020-09-09 3M Innovative Properties Company Multilayer structural adhesive film
CN106916546A (zh) * 2015-12-28 2017-07-04 严能进 一种增强型免钉胶薄片及其制造方法
US11332632B2 (en) 2016-02-24 2022-05-17 Lms Consulting Group, Llc Thermal substrate with high-resistance magnification and positive temperature coefficient ink
US10822512B2 (en) 2016-02-24 2020-11-03 LMS Consulting Group Thermal substrate with high-resistance magnification and positive temperature coefficient
EP3420041A4 (en) * 2016-02-24 2019-11-13 LMS Consulting Group DOUBLE SWITCHING ELECTROCONDUCTIVE PTC INK INPUT AND ITS APPLICATIONS IN DOUBLE-SWITCHING HEATING FLEXIBLE HEATING DEVICES
DE102016203497A1 (de) * 2016-03-03 2017-09-07 Röchling Automotive SE & Co. KG Heizeinrichtung für einen Kfz-Betriebsflüssigkeitstank mit einem PTC-Kunststoffkörper
CN105670550B (zh) * 2016-03-31 2017-11-14 东莞新能源科技有限公司 一种导热胶及含有该导热胶的二次电池
KR101911468B1 (ko) 2017-03-14 2019-01-04 한국생산기술연구원 열가소성 엘라스토머 조성물 및 그를 포함하는 열융착 필름
WO2019157805A1 (zh) * 2018-02-13 2019-08-22 陈志勇 中底材料与其制作方法、大底材料、热熔胶膜、贴合设备及鞋底
DE102018203430A1 (de) * 2018-03-07 2019-09-12 Voestalpine Stahl Gmbh Flächenelektrobauteil und verfahren zur herstellung
CN108641610A (zh) * 2018-04-25 2018-10-12 常州驰科光电科技有限公司 一种高强度自粘性导电导热膜及其制备方法
JP7172288B2 (ja) * 2018-08-28 2022-11-16 東洋インキScホールディングス株式会社 導電性ホットメルト接着剤組成物、および積層体
DE102018133112A1 (de) * 2018-12-20 2020-06-25 Lisa Dräxlmaier GmbH Fahrzeugbauteil mit zumindest einem elektrisch beheizbaren Heizbereich und Verfahren zum Herstellen desselben
DE202020101775U1 (de) * 2020-04-01 2020-05-26 Certoplast Technische Klebebänder Gmbh Klebeband, insbesondere Kabelwickelband zum Umwickeln von Kabeln in Automobilen

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4775778A (en) 1976-10-15 1988-10-04 Raychem Corporation PTC compositions and devices comprising them
US4237441A (en) 1978-12-01 1980-12-02 Raychem Corporation Low resistivity PTC compositions
GB2096393B (en) 1981-04-02 1986-01-02 Raychem Corp Radiation cross-linking of ptc conductive polymers
DE3443789A1 (de) * 1983-12-02 1985-06-27 Osaka Soda Co. Ltd., Osaka Elektrische leitende klebstoffmasse
JPS61151283A (ja) * 1984-12-24 1986-07-09 Dainippon Printing Co Ltd 導電性接着剤
FI884126A (fi) 1987-09-09 1989-03-10 Raychem Ltd Konduktiv polymerkomposition.
KR100224945B1 (ko) 1988-09-20 1999-10-15 허버트 지. 버카드 전도성 중합체 조성물을 포함하는 전기장치
JPH0320378A (ja) * 1989-06-17 1991-01-29 Fujikura Ltd 導電性接着剤
JPH03131679A (ja) * 1989-10-17 1991-06-05 Fujikura Ltd 導電性接着剤
GB9109856D0 (en) 1991-05-04 1991-06-26 Cabot Plastics Ltd Conductive polymer compositions
JP2647589B2 (ja) * 1992-01-27 1997-08-27 矢崎総業株式会社 電磁波遮蔽用複合シート
US6059997A (en) 1995-09-29 2000-05-09 Littlelfuse, Inc. Polymeric PTC compositions
DE29922805U1 (de) 1999-12-24 2001-05-03 Coroplast Fritz Mueller Gmbh Doppelseitiges Klebeband
DE10210661A1 (de) * 2001-11-13 2003-05-28 Fraunhofer Ges Forschung Induktiv härtbare und wieder lösbare Verbindungen
DE10310722A1 (de) 2003-03-10 2004-09-23 Tesa Ag Elektrisch erwärmbare Haftklebemasse
TWI463615B (zh) * 2004-11-04 2014-12-01 Taiwan Semiconductor Mfg Co Ltd 以奈米管為基礎之具方向性導電黏著
US8045846B2 (en) * 2005-01-27 2011-10-25 Sk Kaken Co., Ltd. Composition for heat-storage object formation, heat-storage object, and process for producing heat-storage object

Also Published As

Publication number Publication date
EP2118911A1 (de) 2009-11-18
TW200848488A (en) 2008-12-16
EP2118911B1 (de) 2020-01-15
KR20100015308A (ko) 2010-02-12
WO2008098847A1 (de) 2008-08-21
DE102007007617A1 (de) 2008-08-14
JP2010518590A (ja) 2010-05-27
CN101681703B (zh) 2015-01-07
KR101549981B1 (ko) 2015-09-03
ES2773844T3 (es) 2020-07-15
CN101681703A (zh) 2010-03-24
US20100038025A1 (en) 2010-02-18

Similar Documents

Publication Publication Date Title
MX2009007930A (es) Materiales de pelicula adhesiva fundidos en caliente capaces de calentarse intrinsecamente.
EP2279648A4 (en) THERMOPLASTIC ISOLATED HIGH-TEMPERATURE THICK HEATING ELEMENT
EP2173829A4 (en) HEAT RESISTANT ADHESIVE SHEET
EP2059290A4 (en) HUMIDIFIER WITH INTERNAL HEATING ELEMENT AND HOT PLATE
EP2207674A4 (en) THERMAL INTERMEDIATE MATERIAL WITH THIN TRANSFER FILM OR METALLIZATION
GB2445458B (en) Electrothermal heater comprising thermally conducting film comprising polymer material and hexagonal boron nitride
EP2133399A4 (en) ADHESIVE MATERIAL, ADHESIVE AND USE OF THE ADHESIVE
BRPI1010733A2 (pt) composição adesiva de fusão a quente termicamente reversível contendo compostos de dieno e dienófilo multifuncionais.
HK1150058A1 (en) Low application temperature hot melt adhesive composition and articles including the same
DK2081609T3 (da) Varmesmelteklæbemasse
PL2092606T3 (pl) Pochłaniacz mikrofal, zwłaszcza do zastosowań wysokotemperaturowych
PL2215173T3 (pl) Kompozycja przylepna i człon optyczny, powierzchniowy arkusz ochronny
EP2009030A4 (en) RESIN COMPOSITION AND HEAT-RESISTANT ADHESIVE
TW200744838A (en) Thin film and thin film laminate comprising the same
TR201907897T4 (tr) Basınca duyarlı geçirgen yapıştırıcı.
EP2219414A4 (en) HEATING ELEMENT IN CERAMIC AND PREHEATING CUP EQUIPPED WITH THE HEATING ELEMENT
EP2020161A4 (en) FAST THERMAL RESPONSE INDUCTION HEATING SYSTEM FOR TRAY EMBOSSING
EP2170612A4 (en) HEATING ELEMENT
EP2222132A4 (en) HEATER ELEMENT AND HEATER
GB2445464B (en) A self-regulating electrical resistance heating element
EP2189430A4 (en) Semiconductor ceramic material and ntc thermistor
EP2170613A4 (en) HEATING ELEMENT
WO2007130270A3 (en) Calibrated thermal sensing system
HK1138149A1 (en) Heating element
PL2813346T3 (pl) Element grzejący

Legal Events

Date Code Title Description
FG Grant or registration