MX174443B - Procedimiento para preparar una dispercion acuosa de polimeros modificados de latex, para fabricar sistemas de circuitos electronicos flexibles - Google Patents

Procedimiento para preparar una dispercion acuosa de polimeros modificados de latex, para fabricar sistemas de circuitos electronicos flexibles

Info

Publication number
MX174443B
MX174443B MX017525A MX1752589A MX174443B MX 174443 B MX174443 B MX 174443B MX 017525 A MX017525 A MX 017525A MX 1752589 A MX1752589 A MX 1752589A MX 174443 B MX174443 B MX 174443B
Authority
MX
Mexico
Prior art keywords
initial
monomer
ethylenically unsaturated
polymer
latex
Prior art date
Application number
MX017525A
Other languages
English (en)
Inventor
Yen-Yau Harrison Chao
Albert Steven Will
Reginald T Smart
Original Assignee
Rohm & Haas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas filed Critical Rohm & Haas
Publication of MX174443B publication Critical patent/MX174443B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/04—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Abstract

La presente invención se refiere a procedimiento para preparar una dispersión acuosa de una composiicón de polímeros modificados de látex, que como una mejora es usada como un adhesivo laminador para fabricar sistemas de circuitos electrónicos flexibles. (A) preparar, por la polimerización en emulsión, una dispersión acuosa inicial de un polímero inicial de látex, insoluble en agua, de la menos un monómero etilénicamente insaturado, en que el monómero etilénicamente insaturado comprende no más de alrededor de dos por ciento en peso, con base en el peso total del monómero etilénicamente insaturado, de un monómero multi-alfa, beta-etilénicamente insaturado y en que el polímero inicial de látex, insoluble en agua, de otra manera, no contiene esencialmente sitios de insaturación etilénica; (B) dispersar en la dispersión acuosa inicial del polímero inicial de látex, insoluble en agua, monómeros adicionales etilénicamente insaturados, que comprenden al menos un monómero que tiene cuando menos dos sitios de insaturación alfa, beta-etilénica, por lo cual el monómero adicional hincha el polímero inicial de látex, y (C) polimerizar el monómero adicional dentro del polímero de látex inicial hinchado con el monómero, para formar el polímero modificado de látex, insoluble en agua.
MX017525A 1988-09-16 1989-09-12 Procedimiento para preparar una dispercion acuosa de polimeros modificados de latex, para fabricar sistemas de circuitos electronicos flexibles MX174443B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US24543088A 1988-09-16 1988-09-16

Publications (1)

Publication Number Publication Date
MX174443B true MX174443B (es) 1994-05-17

Family

ID=22926622

Family Applications (1)

Application Number Title Priority Date Filing Date
MX017525A MX174443B (es) 1988-09-16 1989-09-12 Procedimiento para preparar una dispercion acuosa de polimeros modificados de latex, para fabricar sistemas de circuitos electronicos flexibles

Country Status (16)

Country Link
EP (1) EP0359562A3 (es)
JP (1) JPH02169679A (es)
KR (1) KR900004767A (es)
CN (1) CN1043331A (es)
AU (1) AU4128289A (es)
BR (1) BR8904662A (es)
CA (1) CA1331442C (es)
DK (1) DK455489A (es)
FI (1) FI894373A (es)
IE (1) IE892901L (es)
IL (1) IL91621A0 (es)
MX (1) MX174443B (es)
NO (1) NO893673L (es)
NZ (1) NZ230635A (es)
PH (1) PH27583A (es)
ZA (1) ZA897012B (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4213964A1 (de) * 1992-04-29 1993-11-04 Basf Ag Waessrige polymerisatdispersionen
DE4213969A1 (de) * 1992-04-29 1993-11-04 Basf Ag Waessrige polymerisatdispersion
DE4213965A1 (de) * 1992-04-29 1993-11-04 Basf Ag Waessrige polymerisatdispersion
DE4213968A1 (de) * 1992-04-29 1993-11-04 Basf Ag Waessrige polymerisatdispersion
DE4213967A1 (de) * 1992-04-29 1993-11-04 Basf Ag Waessrige polymerisatdispersion
DE4307683A1 (de) * 1993-03-11 1994-09-15 Basf Ag Verfahren zur Herstellung einer wäßrigen Polymerisatdispersion
ID21083A (id) 1996-09-09 1999-04-15 Basf Ag Pembuatan dispersi polimer berair
US7179531B2 (en) 2002-09-12 2007-02-20 Rohm And Haas Company Polymer particles having select pendant groups and composition prepared therefrom
JP5251518B2 (ja) * 2007-01-22 2013-07-31 信越化学工業株式会社 粘着剤組成物及び粘着剤付き光学フィルム
CN102286127B (zh) 2010-06-18 2014-12-10 罗门哈斯公司 含微区域的乳液聚合物
TW202110908A (zh) * 2019-09-03 2021-03-16 美商羅門哈斯公司 黏著劑組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3616195A (en) * 1968-12-26 1971-10-26 Richardson Co Printed circuit board having metal layer bonded to hydrocarbon base and method of making it
JPS6092372A (ja) * 1983-10-25 1985-05-23 Nitto Electric Ind Co Ltd エマルジヨン型感圧性接着剤の製造方法
CA1284695C (en) * 1984-12-20 1991-06-04 Rohm And Haas Company Modified latex polymer compositions

Also Published As

Publication number Publication date
PH27583A (en) 1993-08-18
AU4128289A (en) 1990-03-22
CN1043331A (zh) 1990-06-27
EP0359562A2 (en) 1990-03-21
EP0359562A3 (en) 1991-09-11
NZ230635A (en) 1992-04-28
ZA897012B (en) 1991-12-24
IL91621A0 (en) 1990-04-29
FI894373A (fi) 1990-03-17
IE892901L (en) 1990-03-16
BR8904662A (pt) 1990-05-01
NO893673L (no) 1990-03-19
NO893673D0 (no) 1989-09-14
JPH02169679A (ja) 1990-06-29
DK455489A (da) 1990-03-17
CA1331442C (en) 1994-08-16
DK455489D0 (da) 1989-09-15
KR900004767A (ko) 1990-04-13
FI894373A0 (fi) 1989-09-15

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