ZA897012B - Fabrication of flexible electronic circuitry using a modified latex polymer laminating adhesive composition - Google Patents

Fabrication of flexible electronic circuitry using a modified latex polymer laminating adhesive composition

Info

Publication number
ZA897012B
ZA897012B ZA897012A ZA897012A ZA897012B ZA 897012 B ZA897012 B ZA 897012B ZA 897012 A ZA897012 A ZA 897012A ZA 897012 A ZA897012 A ZA 897012A ZA 897012 B ZA897012 B ZA 897012B
Authority
ZA
South Africa
Prior art keywords
fabrication
adhesive composition
electronic circuitry
flexible electronic
latex polymer
Prior art date
Application number
ZA897012A
Other languages
English (en)
Inventor
Yen-Yau Harrison Chao
Harrison Chao Yen-Yau
Reginald T Smart
T Smart Reginald
Albert Steven Will
Steven Will Albert
Original Assignee
Rohm & Haas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas filed Critical Rohm & Haas
Publication of ZA897012B publication Critical patent/ZA897012B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/04—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Graft Or Block Polymers (AREA)
  • Laminated Bodies (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
ZA897012A 1988-09-16 1989-09-14 Fabrication of flexible electronic circuitry using a modified latex polymer laminating adhesive composition ZA897012B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US24543088A 1988-09-16 1988-09-16

Publications (1)

Publication Number Publication Date
ZA897012B true ZA897012B (en) 1991-12-24

Family

ID=22926622

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA897012A ZA897012B (en) 1988-09-16 1989-09-14 Fabrication of flexible electronic circuitry using a modified latex polymer laminating adhesive composition

Country Status (16)

Country Link
EP (1) EP0359562A3 (xx)
JP (1) JPH02169679A (xx)
KR (1) KR900004767A (xx)
CN (1) CN1043331A (xx)
AU (1) AU4128289A (xx)
BR (1) BR8904662A (xx)
CA (1) CA1331442C (xx)
DK (1) DK455489A (xx)
FI (1) FI894373A (xx)
IE (1) IE892901L (xx)
IL (1) IL91621A0 (xx)
MX (1) MX174443B (xx)
NO (1) NO893673L (xx)
NZ (1) NZ230635A (xx)
PH (1) PH27583A (xx)
ZA (1) ZA897012B (xx)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4213967A1 (de) * 1992-04-29 1993-11-04 Basf Ag Waessrige polymerisatdispersion
DE4213969A1 (de) * 1992-04-29 1993-11-04 Basf Ag Waessrige polymerisatdispersion
DE4213968A1 (de) * 1992-04-29 1993-11-04 Basf Ag Waessrige polymerisatdispersion
DE4213965A1 (de) * 1992-04-29 1993-11-04 Basf Ag Waessrige polymerisatdispersion
DE4213964A1 (de) * 1992-04-29 1993-11-04 Basf Ag Waessrige polymerisatdispersionen
DE4307683A1 (de) * 1993-03-11 1994-09-15 Basf Ag Verfahren zur Herstellung einer wäßrigen Polymerisatdispersion
EP0927208B1 (de) 1996-09-09 2002-01-02 Basf Aktiengesellschaft Verfahren zur herstellung wässriger polymerisatdispersionen
US7179531B2 (en) * 2002-09-12 2007-02-20 Rohm And Haas Company Polymer particles having select pendant groups and composition prepared therefrom
WO2008090813A1 (ja) * 2007-01-22 2008-07-31 Shin-Etsu Chemical Co., Ltd. 粘着剤組成物及び粘着剤付き光学フィルム
CN102286127B (zh) 2010-06-18 2014-12-10 罗门哈斯公司 含微区域的乳液聚合物
TW202110908A (zh) * 2019-09-03 2021-03-16 美商羅門哈斯公司 黏著劑組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3616195A (en) * 1968-12-26 1971-10-26 Richardson Co Printed circuit board having metal layer bonded to hydrocarbon base and method of making it
JPS6092372A (ja) * 1983-10-25 1985-05-23 Nitto Electric Ind Co Ltd エマルジヨン型感圧性接着剤の製造方法
CA1284695C (en) * 1984-12-20 1991-06-04 Rohm And Haas Company Modified latex polymer compositions

Also Published As

Publication number Publication date
KR900004767A (ko) 1990-04-13
EP0359562A2 (en) 1990-03-21
CN1043331A (zh) 1990-06-27
NZ230635A (en) 1992-04-28
NO893673D0 (no) 1989-09-14
PH27583A (en) 1993-08-18
IL91621A0 (en) 1990-04-29
EP0359562A3 (en) 1991-09-11
IE892901L (en) 1990-03-16
BR8904662A (pt) 1990-05-01
JPH02169679A (ja) 1990-06-29
DK455489A (da) 1990-03-17
FI894373A0 (fi) 1989-09-15
FI894373A (fi) 1990-03-17
DK455489D0 (da) 1989-09-15
CA1331442C (en) 1994-08-16
AU4128289A (en) 1990-03-22
NO893673L (no) 1990-03-19
MX174443B (es) 1994-05-17

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