MX165936B - Cubierta semiconductora para un componente electrico - Google Patents

Cubierta semiconductora para un componente electrico

Info

Publication number
MX165936B
MX165936B MX012125A MX1212588A MX165936B MX 165936 B MX165936 B MX 165936B MX 012125 A MX012125 A MX 012125A MX 1212588 A MX1212588 A MX 1212588A MX 165936 B MX165936 B MX 165936B
Authority
MX
Mexico
Prior art keywords
metal
electrical component
metal alloy
oxide
adherent oxide
Prior art date
Application number
MX012125A
Other languages
English (en)
Inventor
Satyam C Cherukuri
Sheldon H Butt
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of MX165936B publication Critical patent/MX165936B/es

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Other Surface Treatments For Metallic Materials (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

La presente invención se refiere a una cubierta semiconductora para un componente eléctrico, caracterizada por: un conductor o guía de metal o aleación de metal que contiene primera y segunda superficies opuestas y que está adaptado a dicho componente eléctrico conectado a la misma, tanto la primera como la segunda superficies contienen una primera capa de óxido adherida a la misma; un miembro de la base de metal o aleación de metal que tiene superficies opuestas primera y segunda, con lados entre ellas; dicho miembro de base tiene un revestimiento de metal o aleación de metal relativamente delgado sobre al menos la primera superficie y los lados de la misma, el revestimiento tiene una segunda capa delgada de óxido adherente sobre la superficie exterior de la misma; un miembro de tapa de metal o aleación de metal con una tercera capa delgada de óxido adherente sobre la superficie inferior de la misma; y un componente de vidrio ó cerámico que une las capas primera y segunda, delgadas, de óxido adherente y las capas primera y tercera delgadas de óxido adherente.
MX012125A 1987-07-02 1988-07-01 Cubierta semiconductora para un componente electrico MX165936B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/069,125 US4796083A (en) 1987-07-02 1987-07-02 Semiconductor casing

Publications (1)

Publication Number Publication Date
MX165936B true MX165936B (es) 1992-12-10

Family

ID=22086909

Family Applications (1)

Application Number Title Priority Date Filing Date
MX012125A MX165936B (es) 1987-07-02 1988-07-01 Cubierta semiconductora para un componente electrico

Country Status (10)

Country Link
US (1) US4796083A (es)
EP (1) EP0366711B1 (es)
JP (1) JPH03500225A (es)
KR (1) KR970005705B1 (es)
AU (1) AU2084788A (es)
DE (1) DE3882998T2 (es)
MX (1) MX165936B (es)
MY (1) MY103113A (es)
PH (1) PH24236A (es)
WO (1) WO1989000338A1 (es)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4888449A (en) * 1988-01-04 1989-12-19 Olin Corporation Semiconductor package
US5043222A (en) * 1988-03-17 1991-08-27 Olin Corporation Metal sealing glass composite with matched coefficients of thermal expansion
JP2572823B2 (ja) * 1988-09-22 1997-01-16 日本碍子株式会社 セラミック接合体
US5155299A (en) * 1988-10-05 1992-10-13 Olin Corporation Aluminum alloy semiconductor packages
US5015803A (en) * 1989-05-31 1991-05-14 Olin Corporation Thermal performance package for integrated circuit chip
US5223746A (en) * 1989-06-14 1993-06-29 Hitachi, Ltd. Packaging structure for a solid-state imaging device with selectively aluminium coated leads
US5073521A (en) * 1989-11-15 1991-12-17 Olin Corporation Method for housing a tape-bonded electronic device and the package employed
US5043534A (en) * 1990-07-02 1991-08-27 Olin Corporation Metal electronic package having improved resistance to electromagnetic interference
JPH0831490B2 (ja) * 1991-03-21 1996-03-27 株式会社住友金属セラミックス ガラス封止型セラミックパッケージ
US5596231A (en) * 1991-08-05 1997-01-21 Asat, Limited High power dissipation plastic encapsulated package for integrated circuit die
US5284706A (en) * 1991-12-23 1994-02-08 Olin Corporation Sealing glass composite
US5315155A (en) * 1992-07-13 1994-05-24 Olin Corporation Electronic package with stress relief channel
TW238419B (es) * 1992-08-21 1995-01-11 Olin Corp
US5650592A (en) * 1993-04-05 1997-07-22 Olin Corporation Graphite composites for electronic packaging
KR100279217B1 (ko) * 1994-04-13 2001-02-01 야마자끼 순페이 반도체 장치 형성 방법, 결정성 반도체 막 형성 방법, 박막 트랜지스터 형성 방법 및 반도체 장치 제조 방법
US6974763B1 (en) 1994-04-13 2005-12-13 Semiconductor Energy Laboratory Co., Ltd. Method of forming semiconductor device by crystallizing amorphous silicon and forming crystallization promoting material in the same chamber
WO1995031826A1 (en) * 1994-05-17 1995-11-23 Olin Corporation Electronic packages with improved electrical performance
US6060779A (en) * 1997-04-30 2000-05-09 Shinko Electric Industries, Co., Ltd. Resin sealed ceramic package and semiconductor device
US7446411B2 (en) * 2005-10-24 2008-11-04 Freescale Semiconductor, Inc. Semiconductor structure and method of assembly
EP2925484A4 (en) * 2012-11-29 2016-07-27 Corning Inc CONNECTION METHOD FOR METALLIC MASSIVE GLASSES
DE112014003944B4 (de) * 2013-08-30 2018-08-02 Yazaki Corporation Verbindungsstruktur eines elektronischen Bauelements und von Metallanschlussstücken

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3676292A (en) * 1970-10-07 1972-07-11 Olin Corp Composites of glass-ceramic-to-metal,seals and method of making same
US3726987A (en) * 1970-10-07 1973-04-10 Olin Corp Glass or ceramic-to-metal seals
US4149910A (en) * 1975-05-27 1979-04-17 Olin Corporation Glass or ceramic-to-metal composites or seals involving iron base alloys
JPS5586144A (en) * 1978-12-25 1980-06-28 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor device
US4570337A (en) * 1982-04-19 1986-02-18 Olin Corporation Method of assembling a chip carrier
US4491622A (en) * 1982-04-19 1985-01-01 Olin Corporation Composites of glass-ceramic to metal seals and method of making the same
US4656499A (en) * 1982-08-05 1987-04-07 Olin Corporation Hermetically sealed semiconductor casing
US4682414A (en) * 1982-08-30 1987-07-28 Olin Corporation Multi-layer circuitry
US4524238A (en) * 1982-12-29 1985-06-18 Olin Corporation Semiconductor packages
US4500605A (en) * 1983-02-17 1985-02-19 Olin Corporation Electrical component forming process
US4649083A (en) * 1983-02-17 1987-03-10 Olin Corporation Electrical component forming process
US4532222A (en) * 1983-03-21 1985-07-30 Olin Corporation Reinforced glass composites
US4572924A (en) * 1983-05-18 1986-02-25 Spectrum Ceramics, Inc. Electronic enclosures having metal parts
US4607276A (en) * 1984-03-08 1986-08-19 Olin Corporation Tape packages
US4577056A (en) * 1984-04-09 1986-03-18 Olin Corporation Hermetically sealed metal package
JPS6142156A (ja) * 1984-08-02 1986-02-28 Kyocera Corp ガラス封止形半導体パツケ−ジ
US4542259A (en) * 1984-09-19 1985-09-17 Olin Corporation High density packages
US4712161A (en) * 1985-03-25 1987-12-08 Olin Corporation Hybrid and multi-layer circuitry
US4704626A (en) * 1985-07-08 1987-11-03 Olin Corporation Graded sealing systems for semiconductor package
US4725333A (en) * 1985-12-20 1988-02-16 Olin Corporation Metal-glass laminate and process for producing same
JPH06142156A (ja) * 1992-10-31 1994-05-24 Miyaden:Kk 浴槽装置

Also Published As

Publication number Publication date
PH24236A (en) 1990-05-04
KR890702248A (ko) 1989-12-23
EP0366711B1 (en) 1993-08-04
EP0366711A4 (en) 1990-06-26
JPH03500225A (ja) 1991-01-17
WO1989000338A1 (en) 1989-01-12
US4796083A (en) 1989-01-03
KR970005705B1 (ko) 1997-04-19
DE3882998D1 (de) 1993-09-09
EP0366711A1 (en) 1990-05-09
AU2084788A (en) 1989-01-30
MY103113A (en) 1993-04-30
DE3882998T2 (de) 1994-03-31

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