MX165936B - Cubierta semiconductora para un componente electrico - Google Patents
Cubierta semiconductora para un componente electricoInfo
- Publication number
- MX165936B MX165936B MX012125A MX1212588A MX165936B MX 165936 B MX165936 B MX 165936B MX 012125 A MX012125 A MX 012125A MX 1212588 A MX1212588 A MX 1212588A MX 165936 B MX165936 B MX 165936B
- Authority
- MX
- Mexico
- Prior art keywords
- metal
- electrical component
- metal alloy
- oxide
- adherent oxide
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
La presente invención se refiere a una cubierta semiconductora para un componente eléctrico, caracterizada por: un conductor o guía de metal o aleación de metal que contiene primera y segunda superficies opuestas y que está adaptado a dicho componente eléctrico conectado a la misma, tanto la primera como la segunda superficies contienen una primera capa de óxido adherida a la misma; un miembro de la base de metal o aleación de metal que tiene superficies opuestas primera y segunda, con lados entre ellas; dicho miembro de base tiene un revestimiento de metal o aleación de metal relativamente delgado sobre al menos la primera superficie y los lados de la misma, el revestimiento tiene una segunda capa delgada de óxido adherente sobre la superficie exterior de la misma; un miembro de tapa de metal o aleación de metal con una tercera capa delgada de óxido adherente sobre la superficie inferior de la misma; y un componente de vidrio ó cerámico que une las capas primera y segunda, delgadas, de óxido adherente y las capas primera y tercera delgadas de óxido adherente.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/069,125 US4796083A (en) | 1987-07-02 | 1987-07-02 | Semiconductor casing |
Publications (1)
Publication Number | Publication Date |
---|---|
MX165936B true MX165936B (es) | 1992-12-10 |
Family
ID=22086909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX012125A MX165936B (es) | 1987-07-02 | 1988-07-01 | Cubierta semiconductora para un componente electrico |
Country Status (10)
Country | Link |
---|---|
US (1) | US4796083A (es) |
EP (1) | EP0366711B1 (es) |
JP (1) | JPH03500225A (es) |
KR (1) | KR970005705B1 (es) |
AU (1) | AU2084788A (es) |
DE (1) | DE3882998T2 (es) |
MX (1) | MX165936B (es) |
MY (1) | MY103113A (es) |
PH (1) | PH24236A (es) |
WO (1) | WO1989000338A1 (es) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4888449A (en) * | 1988-01-04 | 1989-12-19 | Olin Corporation | Semiconductor package |
US5043222A (en) * | 1988-03-17 | 1991-08-27 | Olin Corporation | Metal sealing glass composite with matched coefficients of thermal expansion |
JP2572823B2 (ja) * | 1988-09-22 | 1997-01-16 | 日本碍子株式会社 | セラミック接合体 |
US5155299A (en) * | 1988-10-05 | 1992-10-13 | Olin Corporation | Aluminum alloy semiconductor packages |
US5015803A (en) * | 1989-05-31 | 1991-05-14 | Olin Corporation | Thermal performance package for integrated circuit chip |
US5223746A (en) * | 1989-06-14 | 1993-06-29 | Hitachi, Ltd. | Packaging structure for a solid-state imaging device with selectively aluminium coated leads |
US5073521A (en) * | 1989-11-15 | 1991-12-17 | Olin Corporation | Method for housing a tape-bonded electronic device and the package employed |
US5043534A (en) * | 1990-07-02 | 1991-08-27 | Olin Corporation | Metal electronic package having improved resistance to electromagnetic interference |
JPH0831490B2 (ja) * | 1991-03-21 | 1996-03-27 | 株式会社住友金属セラミックス | ガラス封止型セラミックパッケージ |
US5596231A (en) * | 1991-08-05 | 1997-01-21 | Asat, Limited | High power dissipation plastic encapsulated package for integrated circuit die |
US5284706A (en) * | 1991-12-23 | 1994-02-08 | Olin Corporation | Sealing glass composite |
US5315155A (en) * | 1992-07-13 | 1994-05-24 | Olin Corporation | Electronic package with stress relief channel |
TW238419B (es) * | 1992-08-21 | 1995-01-11 | Olin Corp | |
US5650592A (en) * | 1993-04-05 | 1997-07-22 | Olin Corporation | Graphite composites for electronic packaging |
US6974763B1 (en) | 1994-04-13 | 2005-12-13 | Semiconductor Energy Laboratory Co., Ltd. | Method of forming semiconductor device by crystallizing amorphous silicon and forming crystallization promoting material in the same chamber |
KR100279217B1 (ko) * | 1994-04-13 | 2001-02-01 | 야마자끼 순페이 | 반도체 장치 형성 방법, 결정성 반도체 막 형성 방법, 박막 트랜지스터 형성 방법 및 반도체 장치 제조 방법 |
WO1995031826A1 (en) * | 1994-05-17 | 1995-11-23 | Olin Corporation | Electronic packages with improved electrical performance |
US6060779A (en) * | 1997-04-30 | 2000-05-09 | Shinko Electric Industries, Co., Ltd. | Resin sealed ceramic package and semiconductor device |
US7446411B2 (en) * | 2005-10-24 | 2008-11-04 | Freescale Semiconductor, Inc. | Semiconductor structure and method of assembly |
WO2014085241A1 (en) * | 2012-11-29 | 2014-06-05 | Corning Incorporated | Joining methods for bulk metallic glasses |
DE112014003944B4 (de) * | 2013-08-30 | 2018-08-02 | Yazaki Corporation | Verbindungsstruktur eines elektronischen Bauelements und von Metallanschlussstücken |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3726987A (en) * | 1970-10-07 | 1973-04-10 | Olin Corp | Glass or ceramic-to-metal seals |
US3676292A (en) * | 1970-10-07 | 1972-07-11 | Olin Corp | Composites of glass-ceramic-to-metal,seals and method of making same |
US4149910A (en) * | 1975-05-27 | 1979-04-17 | Olin Corporation | Glass or ceramic-to-metal composites or seals involving iron base alloys |
JPS5586144A (en) * | 1978-12-25 | 1980-06-28 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Semiconductor device |
US4570337A (en) * | 1982-04-19 | 1986-02-18 | Olin Corporation | Method of assembling a chip carrier |
US4491622A (en) * | 1982-04-19 | 1985-01-01 | Olin Corporation | Composites of glass-ceramic to metal seals and method of making the same |
US4656499A (en) * | 1982-08-05 | 1987-04-07 | Olin Corporation | Hermetically sealed semiconductor casing |
US4682414A (en) * | 1982-08-30 | 1987-07-28 | Olin Corporation | Multi-layer circuitry |
US4524238A (en) * | 1982-12-29 | 1985-06-18 | Olin Corporation | Semiconductor packages |
US4649083A (en) * | 1983-02-17 | 1987-03-10 | Olin Corporation | Electrical component forming process |
US4500605A (en) * | 1983-02-17 | 1985-02-19 | Olin Corporation | Electrical component forming process |
US4532222A (en) * | 1983-03-21 | 1985-07-30 | Olin Corporation | Reinforced glass composites |
US4572924A (en) * | 1983-05-18 | 1986-02-25 | Spectrum Ceramics, Inc. | Electronic enclosures having metal parts |
US4607276A (en) * | 1984-03-08 | 1986-08-19 | Olin Corporation | Tape packages |
US4577056A (en) * | 1984-04-09 | 1986-03-18 | Olin Corporation | Hermetically sealed metal package |
JPS6142156A (ja) * | 1984-08-02 | 1986-02-28 | Kyocera Corp | ガラス封止形半導体パツケ−ジ |
US4542259A (en) * | 1984-09-19 | 1985-09-17 | Olin Corporation | High density packages |
US4712161A (en) * | 1985-03-25 | 1987-12-08 | Olin Corporation | Hybrid and multi-layer circuitry |
US4704626A (en) * | 1985-07-08 | 1987-11-03 | Olin Corporation | Graded sealing systems for semiconductor package |
US4725333A (en) * | 1985-12-20 | 1988-02-16 | Olin Corporation | Metal-glass laminate and process for producing same |
JPH06142156A (ja) * | 1992-10-31 | 1994-05-24 | Miyaden:Kk | 浴槽装置 |
-
1987
- 1987-07-02 US US07/069,125 patent/US4796083A/en not_active Expired - Fee Related
-
1988
- 1988-06-27 DE DE88906432T patent/DE3882998T2/de not_active Expired - Fee Related
- 1988-06-27 JP JP63506110A patent/JPH03500225A/ja active Pending
- 1988-06-27 KR KR1019890700261A patent/KR970005705B1/ko active IP Right Grant
- 1988-06-27 EP EP88906432A patent/EP0366711B1/en not_active Expired - Lifetime
- 1988-06-27 AU AU20847/88A patent/AU2084788A/en not_active Abandoned
- 1988-06-27 WO PCT/US1988/002089 patent/WO1989000338A1/en active IP Right Grant
- 1988-07-01 MY MYPI88000728A patent/MY103113A/en unknown
- 1988-07-01 MX MX012125A patent/MX165936B/es unknown
- 1988-07-04 PH PH37168A patent/PH24236A/en unknown
Also Published As
Publication number | Publication date |
---|---|
MY103113A (en) | 1993-04-30 |
PH24236A (en) | 1990-05-04 |
DE3882998D1 (de) | 1993-09-09 |
JPH03500225A (ja) | 1991-01-17 |
AU2084788A (en) | 1989-01-30 |
EP0366711B1 (en) | 1993-08-04 |
EP0366711A4 (en) | 1990-06-26 |
US4796083A (en) | 1989-01-03 |
WO1989000338A1 (en) | 1989-01-12 |
EP0366711A1 (en) | 1990-05-09 |
KR970005705B1 (ko) | 1997-04-19 |
DE3882998T2 (de) | 1994-03-31 |
KR890702248A (ko) | 1989-12-23 |
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