MD249Z - Process for manufacturing a thermoelectric cooler for the Chip substrate - Google Patents
Process for manufacturing a thermoelectric cooler for the Chip substrateInfo
- Publication number
- MD249Z MD249Z MDS20090070A MDS20090070A MD249Z MD 249 Z MD249 Z MD 249Z MD S20090070 A MDS20090070 A MD S20090070A MD S20090070 A MDS20090070 A MD S20090070A MD 249 Z MD249 Z MD 249Z
- Authority
- MD
- Moldova
- Prior art keywords
- chip substrate
- manufacturing
- thermoelectric cooler
- layer
- thermoelectric
- Prior art date
Links
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
The invention relates to processes for manufacturing a thermoelectric cooler for the Chip substrate and may find its application in various fields of microelectronics, computer engineering, medicine and other fields, requiring heat removal.The process for manufacturing a thermoelectric cooler for the Chip substrate consists in that the Chip substrate made of silicon is treated chemically, annealed at a temperature of 1073K for 3...5 min in an ultrahigh vacuum chamber. Then, it is applied thereon a double intermediate layer based on fluorides, at a temperature of 973K, composed of a CaF2 layer of a thickness of 2...3 nm and a BaF2 layer of a thickness of about 150 nm, at a speed of 0.1 nm/s. On the double intermediate layer is applied a thermoelectric transforming layer made of a semiconductor material of A4B6 type, on which is paced a radiator with a fan.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MDS20090070A MD249Z (en) | 2009-04-29 | 2009-04-29 | Process for manufacturing a thermoelectric cooler for the Chip substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MDS20090070A MD249Z (en) | 2009-04-29 | 2009-04-29 | Process for manufacturing a thermoelectric cooler for the Chip substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
MD249Y MD249Y (en) | 2010-07-30 |
MD249Z true MD249Z (en) | 2011-02-28 |
Family
ID=45815089
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MDS20090070A MD249Z (en) | 2009-04-29 | 2009-04-29 | Process for manufacturing a thermoelectric cooler for the Chip substrate |
Country Status (1)
Country | Link |
---|---|
MD (1) | MD249Z (en) |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MD627F2 (en) * | 1994-07-25 | 1996-11-29 | Univ De Stat Din Moldova | The method of making epitaxy layers of phosphide indium from gaz phase |
MD957G2 (en) * | 1996-09-12 | 1999-02-28 | Государственный Университет Молд0 | Process and installation for obtaining multilayer epitaxial structures |
RU2129246C1 (en) * | 1993-09-03 | 1999-04-20 | Кабусики Кайся Секуто Кагаку | Heat-radial panel and method of cooling by means of such panel |
MD20000111A (en) * | 2000-06-27 | 2002-07-31 | Vieru Stanislav | Device for vacuum cleaving of epitaxial semiconductor structures |
RU2196683C2 (en) * | 1997-11-07 | 2003-01-20 | Денки Кагаку Когио Кабусики Кайся | Substrate, method for its production (versions) and metallic compound of articles |
RU2198949C2 (en) * | 1999-03-16 | 2003-02-20 | Хитачи, Лтд. | Composite material, process of its production, panel of semiconductor device emitting heat, semiconductor device ( variants ), dielectric panel and electrostatic absorbing facility |
RU2206502C2 (en) * | 2000-11-21 | 2003-06-20 | Акционерное общество закрытого типа "Карбид" | Composite material |
RU2214698C2 (en) * | 1998-07-08 | 2003-10-20 | Квин Мэри Энд Уестфилд Колледж | Heat removing facility, electric system including heat removing facility, process of manufacture of heat removing facility and of electric component |
MD2556G2 (en) * | 2004-06-01 | 2005-03-31 | Ион ТИГИНЯНУ | Process for semiconductor nanostructures obtaining |
RU2004133862A (en) * | 2003-11-21 | 2006-04-27 | Эл Джи Электроникс Инк. (Kr) | SYSTEM AND METHOD OF HEAT RADIATION FOR MOBILE COMMUNICATION TERMINAL |
RU2005137313A (en) * | 2003-05-01 | 2006-04-27 | Квин Мэри Энд Уестфилд Колледж (Gb) | THE THERMAL-CONTROLLING DEVICE INCLUDED IN THE SHELL AND THE METHOD FOR PRODUCING SUCH A DEVICE |
RU2006110512A (en) * | 2003-09-03 | 2007-10-20 | Дженерал Электрик Компани (US) | HEAT-CONDUCTING MATERIAL USING ELECTRONIC NANOPARTICLES |
MD20070209A (en) * | 2007-07-23 | 2009-01-31 | Технический университет Молдовы | Process for obtaining thin films of oxide semiconductors |
MD3934B1 (en) * | 2008-09-08 | 2009-06-30 | Institutul De Inginerie Electronica Si Tehnologii Industriale Al Academiei De Stiinte A Moldovei | Process for obtaining the substrate of BaF2 with perfect surface |
MD20070296A (en) * | 2007-10-31 | 2009-07-31 | Institutul De Inginerie Electronica Si Tehnologii Industriale Al Academiei De Stiinte A Moldovei | Method for increasing the microwire magnetic resistance on base of solid heterogeneous materials |
MD20080058A (en) * | 2008-02-25 | 2009-08-31 | Институт Электронной Инженерии И Промышленных Технологий Академии Наук Молдовы | Device for obtaining superconducting layers |
-
2009
- 2009-04-29 MD MDS20090070A patent/MD249Z/en not_active IP Right Cessation
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2129246C1 (en) * | 1993-09-03 | 1999-04-20 | Кабусики Кайся Секуто Кагаку | Heat-radial panel and method of cooling by means of such panel |
MD627F2 (en) * | 1994-07-25 | 1996-11-29 | Univ De Stat Din Moldova | The method of making epitaxy layers of phosphide indium from gaz phase |
MD957G2 (en) * | 1996-09-12 | 1999-02-28 | Государственный Университет Молд0 | Process and installation for obtaining multilayer epitaxial structures |
RU2196683C2 (en) * | 1997-11-07 | 2003-01-20 | Денки Кагаку Когио Кабусики Кайся | Substrate, method for its production (versions) and metallic compound of articles |
RU2214698C2 (en) * | 1998-07-08 | 2003-10-20 | Квин Мэри Энд Уестфилд Колледж | Heat removing facility, electric system including heat removing facility, process of manufacture of heat removing facility and of electric component |
RU2198949C2 (en) * | 1999-03-16 | 2003-02-20 | Хитачи, Лтд. | Composite material, process of its production, panel of semiconductor device emitting heat, semiconductor device ( variants ), dielectric panel and electrostatic absorbing facility |
MD20000111A (en) * | 2000-06-27 | 2002-07-31 | Vieru Stanislav | Device for vacuum cleaving of epitaxial semiconductor structures |
RU2206502C2 (en) * | 2000-11-21 | 2003-06-20 | Акционерное общество закрытого типа "Карбид" | Composite material |
RU2005137313A (en) * | 2003-05-01 | 2006-04-27 | Квин Мэри Энд Уестфилд Колледж (Gb) | THE THERMAL-CONTROLLING DEVICE INCLUDED IN THE SHELL AND THE METHOD FOR PRODUCING SUCH A DEVICE |
RU2006110512A (en) * | 2003-09-03 | 2007-10-20 | Дженерал Электрик Компани (US) | HEAT-CONDUCTING MATERIAL USING ELECTRONIC NANOPARTICLES |
RU2004133862A (en) * | 2003-11-21 | 2006-04-27 | Эл Джи Электроникс Инк. (Kr) | SYSTEM AND METHOD OF HEAT RADIATION FOR MOBILE COMMUNICATION TERMINAL |
RU2291599C2 (en) * | 2003-11-21 | 2007-01-10 | Эл Джи Электроникс Инк. | System and method for thermo-radiation for mobile communication terminal |
MD2556G2 (en) * | 2004-06-01 | 2005-03-31 | Ион ТИГИНЯНУ | Process for semiconductor nanostructures obtaining |
MD20070209A (en) * | 2007-07-23 | 2009-01-31 | Технический университет Молдовы | Process for obtaining thin films of oxide semiconductors |
MD20070296A (en) * | 2007-10-31 | 2009-07-31 | Institutul De Inginerie Electronica Si Tehnologii Industriale Al Academiei De Stiinte A Moldovei | Method for increasing the microwire magnetic resistance on base of solid heterogeneous materials |
MD20080058A (en) * | 2008-02-25 | 2009-08-31 | Институт Электронной Инженерии И Промышленных Технологий Академии Наук Молдовы | Device for obtaining superconducting layers |
MD3934B1 (en) * | 2008-09-08 | 2009-06-30 | Institutul De Inginerie Electronica Si Tehnologii Industriale Al Academiei De Stiinte A Moldovei | Process for obtaining the substrate of BaF2 with perfect surface |
Non-Patent Citations (1)
Title |
---|
Chowdhury I., Ravi Prasher R., Lofgreen K., Chrysler G., Narasimhan S., Mahajan R., Koester D., Alley R., Venkatasubramanian R. Pn-chip cooling by superlattice-based thin-film thermoelectrics. Nature Nanotechnology. 2009, Vol. 4, Issure 4, p. 235-238 * |
Also Published As
Publication number | Publication date |
---|---|
MD249Y (en) | 2010-07-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
KA4Y | Short-term patent lapsed due to non-payment of fees (with right of restoration) |