MD2173G2 - Dispozitiv pentru efectuarea procesului continuu de depunere electrolitică - Google Patents

Dispozitiv pentru efectuarea procesului continuu de depunere electrolitică Download PDF

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Publication number
MD2173G2
MD2173G2 MD99-0273A MD990273A MD2173G2 MD 2173 G2 MD2173 G2 MD 2173G2 MD 990273 A MD990273 A MD 990273A MD 2173 G2 MD2173 G2 MD 2173G2
Authority
MD
Moldova
Prior art keywords
live cylinder
coating
precipitation process
anode
live
Prior art date
Application number
MD99-0273A
Other languages
English (en)
Russian (ru)
Other versions
MD990273A (ro
MD2173F2 (ro
Inventor
Ханс Джозеф МЕЙ
Роланд ШНЕТТЛЕР
Мишель КОЛЛАРД
Original Assignee
АНДРИЦ-РАТЕНТФЕРВАЛТУНГС-ГЕЗЕЛШАФТ м.б.Х.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by АНДРИЦ-РАТЕНТФЕРВАЛТУНГС-ГЕЗЕЛШАФТ м.б.Х. filed Critical АНДРИЦ-РАТЕНТФЕРВАЛТУНГС-ГЕЗЕЛШАФТ м.б.Х.
Publication of MD990273A publication Critical patent/MD990273A/ro
Publication of MD2173F2 publication Critical patent/MD2173F2/ro
Publication of MD2173G2 publication Critical patent/MD2173G2/ro

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0635—In radial cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0671—Selective plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Secondary Cells (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

Invenţia se referă la galvanotehnică şi poate fi utilizată în procesul continuu de depunere electrolitică, în special pentru confecţionarea benzilor metalice sau foliei, de asemenea pentru depunerea acoperirii electrolitice unilaterale pe benzi metalice.Dispozitivul include un tambur catodic sub tensiune (3) cu o suprafaţă electroconductoare pe toată lăţimea utilizată, un anod (A) amplasat concentric faţă de tamburul sub tensiune la o anumită distanţă, spaţiul intermediar (6) dintre tamburul sub tensiune şi anod fiind spălat de electrolit. Cu tamburul sub tensiune sunt juxtapuse benzile de ecranare (9, 9'), amplasate între suprafaţa catodică a tamburului sub tensiune şi anod. Ele ecranează electric, astfel excluzând depunerea electrolitică pe zonele periferice ale tamburului sub tensiune. În procesul depunerii electrolitice între benzile de ecranare se plasează zona de lucru a tamburului sub tensiune. Partea benzii de ecranare orientată, în funcţie de circumstanţe, spre zona de lucru are un prag, datorită căruia grosimea benzii metalice sau a învelişului unilateral se micşorează spre margine, reducându-se la zero, astfel evitându-se acoperirea tamburului sub tensiune în afara zonei de lucru.<SDOAD>
MD99-0273A 1997-04-18 1998-04-11 Dispozitiv pentru efectuarea procesului continuu de depunere electrolitică MD2173G2 (ro)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19716369A DE19716369A1 (de) 1997-04-18 1997-04-18 Vorrichtung zum Durchführen kontinuierlicher elektrolytischer Abscheidungsprozesse
PCT/EP1998/002117 WO1998048083A2 (de) 1997-04-18 1998-04-11 Vorrichtung zum durchführen kontinuierlicher elektrolytischer abscheidungsprozesse

Publications (3)

Publication Number Publication Date
MD990273A MD990273A (ro) 2002-06-30
MD2173F2 MD2173F2 (ro) 2003-05-31
MD2173G2 true MD2173G2 (ro) 2003-11-30

Family

ID=7826990

Family Applications (1)

Application Number Title Priority Date Filing Date
MD99-0273A MD2173G2 (ro) 1997-04-18 1998-04-11 Dispozitiv pentru efectuarea procesului continuu de depunere electrolitică

Country Status (15)

Country Link
US (1) US6306268B1 (ro)
EP (1) EP0975825B1 (ro)
JP (1) JP3237762B2 (ro)
KR (1) KR100340349B1 (ro)
CN (1) CN1113984C (ro)
AT (1) ATE201724T1 (ro)
AU (1) AU7523898A (ro)
BR (1) BR9808683A (ro)
CA (1) CA2286813C (ro)
DE (2) DE19716369A1 (ro)
ES (1) ES2157661T3 (ro)
MD (1) MD2173G2 (ro)
PL (1) PL336496A1 (ro)
RU (1) RU2180021C2 (ro)
WO (1) WO1998048083A2 (ro)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2258770C2 (ru) * 2003-06-02 2005-08-20 Вольхин Александр Иванович Способ изготовления металлической ленты электролизом и устройство для его осуществления
US20060163073A1 (en) * 2003-06-27 2006-07-27 Nobuhiro Higashihara Process for producing metal plating film, process for producing electronic part and plating film forming apparatus
NL1025446C2 (nl) * 2004-02-09 2005-08-10 Besi Plating B V Werkwijze en inrichting voor het elektrolytisch doen toenemen van de dikte van een elektrisch geleidend patroon op een dielektrische drager alsmede dielektrische drager.
FR2900161A1 (fr) * 2006-04-21 2007-10-26 Frederic Vacheron Installation de traitement de pieces, notamment par electrolyse
CN103732803A (zh) * 2010-12-23 2014-04-16 Fci公司 电镀方法和装置以及通过该方法获得的带材
MD502Z (ro) * 2011-12-01 2012-11-30 Институт Прикладной Физики Академии Наук Молдовы Procedeu de obţinere a tablei laminate subţiri din fier
RU2720288C2 (ru) * 2018-04-02 2020-04-28 федеральное государственное бюджетное образовательное учреждение высшего образования "Тольяттинский государственный университет" Способ изготовления фильтрующего элемента с металлической сеткой и устройства для его реализации

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2044415A (en) * 1932-07-13 1936-06-16 Anaconda Copper Mining Co Method and apparatus for electrodeposition
WO1994010360A1 (de) * 1992-10-31 1994-05-11 Hans Josef May Vorrichtung zum einseitigen elektrolytischen beschichten von metallbändern

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU109530A1 (ru) * 1957-03-08 1957-11-30 М.А. Поляков Многобарабанный электролизер дл непрерывного получени катодного цинка
JPH07116636B2 (ja) * 1986-09-26 1995-12-13 川崎製鉄株式会社 ラジアル型めつきセル
US5069762A (en) 1991-01-18 1991-12-03 Usx Corporation Appartaus for improved current transfer in radial cell electroplating
RU2022062C1 (ru) * 1991-08-14 1994-10-30 Исаев Владимир Николаевич Устройство для нанесения селективно-локального гальванического покрытия на длинномерные ленты
FR2736364B1 (fr) * 1995-07-07 1997-08-08 Lorraine Laminage Dispositif de masquage de rives de bande metallique adapte a une cellule d'electrodeposition de type radial, pour la prevention des dendrites
TWI293897B (en) 2002-08-21 2008-03-01 Toray Industries Modified substrates and process for producing the same
JP6055598B2 (ja) 2012-02-17 2016-12-27 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP7116636B2 (ja) 2018-05-11 2022-08-10 信越ポリマー株式会社 導電性高分子分散液及びその製造方法、並びに導電性フィルムの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2044415A (en) * 1932-07-13 1936-06-16 Anaconda Copper Mining Co Method and apparatus for electrodeposition
WO1994010360A1 (de) * 1992-10-31 1994-05-11 Hans Josef May Vorrichtung zum einseitigen elektrolytischen beschichten von metallbändern

Also Published As

Publication number Publication date
KR100340349B1 (ko) 2002-06-12
RU2180021C2 (ru) 2002-02-27
PL336496A1 (en) 2000-07-03
MD990273A (ro) 2002-06-30
ES2157661T3 (es) 2001-08-16
JP2000510532A (ja) 2000-08-15
AU7523898A (en) 1998-11-13
EP0975825A2 (de) 2000-02-02
EP0975825B1 (de) 2001-05-30
DE59800799D1 (de) 2001-07-05
WO1998048083A3 (de) 1999-02-11
MD2173F2 (ro) 2003-05-31
CN1251624A (zh) 2000-04-26
US6306268B1 (en) 2001-10-23
BR9808683A (pt) 2000-07-11
CA2286813C (en) 2003-10-07
ATE201724T1 (de) 2001-06-15
DE19716369A1 (de) 1998-10-22
CA2286813A1 (en) 1998-10-29
WO1998048083A2 (de) 1998-10-29
JP3237762B2 (ja) 2001-12-10
CN1113984C (zh) 2003-07-09
KR20010006412A (ko) 2001-01-26

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