KR970707245A - 전착에 사용하기 적합한 양이온 수지 및 캡핑된 폴리이소시아네이트 경화제(cationic resin and capped polyisocyanate curing agent suitable for use in electrodeposition) - Google Patents

전착에 사용하기 적합한 양이온 수지 및 캡핑된 폴리이소시아네이트 경화제(cationic resin and capped polyisocyanate curing agent suitable for use in electrodeposition)

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KR970707245A
KR970707245A KR1019970702963A KR19970702963A KR970707245A KR 970707245 A KR970707245 A KR 970707245A KR 1019970702963 A KR1019970702963 A KR 1019970702963A KR 19970702963 A KR19970702963 A KR 19970702963A KR 970707245 A KR970707245 A KR 970707245A
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group
component
hydroxy ester
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KR100211079B1 (ko
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조셉 티 발코
필립 포셰
리차드 에프 카라빈
토마 씨 모리아리띠
벤카타찰람 에스와라크리쉬난
부스커크 엘러 제이 반
그레고리 제이 맥컬럼
라파엘 오 콜라
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버그스트롬 리타
피피지 인더스트리즈 인코포레이티드
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Abstract

(A) 폴리에폭사이드로부터 유도되고, 수지 분자내에 지방족 하이드록실, 1급 아미노 및 2급 아미노로부터 선택되는 활성 수소기 및 양이온염 기를 함유하는 겔화되지 않은 양이온 수지; 및 별도의 성분으로서 존재하는 (B) 유리이소시아네이트기를 실질적으로 함유하지 않는 완전히 캡핑된 폴리이소시아네이트 경화제를 포함하는 전착 조성물이 제공된다. 전착 조성물은 수지 고형분 g당 약 0.02 내지 1.0밀리당량의 페놀성 하이드록실기, 및 수지 고형분 g당 약 0.1 내지 2.0밀리당량의 베타-하이드록시 에스테르기를 함유한다. 조성물은 강철 기판상에 전착될 때 탁월한 내부식성을 제공하고, 배합시 납을 필요로 하지 않고 전착전에 강철 기판을 예비처리하기 위한 통상적인 크롬 세정을 이용하지도 않는다.

Description

전착에 사용하기 적합한 양이온 수지 및 캡핑된 폴리이소시아네이트 경화제(CATIONIC RESIN AND CAPPED POLYISOCYANATE CURING AGENT SUITABLE FOR USE IN ELECTRODEPOSITION)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (35)

  1. (A) 폴리에폭사이드로부터 유도되고, 지방족 하이드록실, 1급 아미노 및 2급 아미노로부터 선택된 활성 수소기 및 양이온염 기를 수지내에 함유하는 양이온 수지; 및 별도의 성분으로서 존재하는 (B) 유리 이소시아네이트기를 실질적으로 함유하지 않는 완전히 캡핑된 폴리이소시아네이트 경화제를 포함하며, 수지 고형분 g당 하기 일반식(1)로 계산된 페놀성 하이드록실기 약 0.02 내지 1.0밀리당량 및 수지 고형분 g당 하기 일반식(2)로 계싼된 베타-하이드록시 에스테르기 약 0.1 내지 2.0밀리당량을 함유하는 것을 특징으로 하는 전착조성물 :
  2. 제1항에 있어서, 페놀성 하이드록실기가 성분(A)에 존재하는 전착 조성물.
  3. 제1항에 있어서, 베타-하이드록시 에스테르기가 성분(A)에 존재하는 전착 조성물.
  4. 제1항에 있어서, 페놀성 하이드록시기가 성분(B)에 존재하는 전착 조성물.
  5. 제1항에 있어서, 베타-하이드록시 에스테르기가 성분(B)에 존재하는 전착 조성물.
  6. 제1항에 있어서, 페놀성 하이드록실기 및 베타-하이드록시 에스테르기가 성분(B)에 존재하는 전착 조성물.
  7. 제1항에 있어서, 페놀성 하이드록실기 성분(A) 및 (B)와는 상이한 별도의 성분(C)에 존재하는 전착 조성물.
  8. 제1항에 있어서, 베타-하이드록시 에스테르기가 성분(A) 및 (B)와는 상이한 별도의 성분(C)에 존재하는 전착 조성물.
  9. 제1항에 있어서, 페놀성 하이드록실기 및 베타-하이드록시 에스테르기가 둘다 성분(A) 및 (B)와는 상이한 별도의 성분(C)에 존재한느 전착 조성물.
  10. 제1항에 있어서, 페놀성 하이드록실기가 별도의 성분(C)에 존재하고, 베타-하이드록시 에스테르기가 별도의 성분(D)에 존재하며, (C) 및 (D)가 서로 상이하고 또한 (A) 및 (B)와도 상이한 전착 조성물.
  11. 제1항에 있어서, 페놀성 하이드록실기가 성분(A) 또는 (B)에 존재하고, 베타-하이드록시 에스테르기가 성분(A) 및 (B)와는 상이한 별도의 성분(C)에 존재하는 전착 조성물.
  12. 제1항에 있어서, 베타-하이드록시 에스테르기가 성분(A) 및 (B)에 존재하고, 페놀성 하이드록실기가 성분(A) 및 (B)와는 상이한 별도의 성분(C)에 존재하는 전착 조성물.
  13. 제1항에 있어서, 페놀성 하이드록실기가 다가 페놀로부터 유도되는 전착 조성물.
  14. 제13항에 있어서, 다가 페놀이 비스페놀 A인 전착 조성물.
  15. 제1항에 있어서, 베타-하이드록시 에스테르기가 1,2-에폭시기-함유 물질을 카복실산으로 개환반응시킴으로써 형성되는 전착 조성물.
  16. 제15항에 있어서, 카복실산이 하이드록실기-함유 카복실산인 전착 조성물.
  17. 제16항에 있어서, 하이드록실기-함유 카복실산인 디메틸올로프로피온산인 전착 조성물.
  18. 제15항에 있어서, 1,2-에폭시기-함유 물질이 폴리에폭사이드인 전착 조성물.
  19. 양극과 음극 사이에 전류를 통과시켜, (A) 폴리에폭사이드로부터 유도되고, 지방족 하이드록실, 1급 아미노 및 2급 아미노로부터 선택되는 활성 수소기 및 양이온염 기를 수지내에 함유하는 양이온 수지; 및 별도의 성분으로서 존재하는 (B) 유리 이소시아네이트기를 실질적으로 함유하지 않는 완전히 캡핑된 폴리이소시아네이트 경화제를 포함하며, 수지 고형분 g당 하기 일반식(1)로 계산된 페놀성 하이드록실기 약 0.02 내지 1.0밀리당량 및 수지 고형분 g당 하기 일반식(2)로 계산된 베타-하이드록시 에스테르기 약 0.1 내지 2.0밀리당량을 함유함을 특징으로 하는 전착 조성물을 실질적인 연속 필름으로서 음극상에 전착시키고, 전착된 필름을 승온에서 가열하여 필름을 경화시킴을 포함하는, 수분산성 양이온 수지를 함유하는 수성 전착 조성물에 침지된 음극 및 양극을 포함하는 전기회로에서 음극으로서 작용하는 전기전도성 기판을 전기코팅시키는 방법 :
  20. 제19항에 있어서, 페놀성 하이드록실기가 성분(A)에 존재하는 방법.
  21. 제19항에 있어서, 베타-하이드록시 에스테르기가 성분(A)에 존재하는 방법.
  22. 제19항에 있어서, 페놀성 하이드록실기가 성분(B)에 존재하는 방법.
  23. 제19항에 있어서, 베타-하이드록시 에스테르기가 성분(A)에 존재하는 방법.
  24. 제19항에 있어서, 페놀성 하이드록실기 및 베타-하이드록시 에스테르기가 성분(B)에 존재하는 방법.
  25. 제19항에 있어서, 페놀성 하이드록실기가 성분(A) 및 성분(B)와는 상이한 별도의 성분(C)에 존재하는 방법.
  26. 제19항에 있어서, 베타-하이드록시 에스테르기가 성분(A) 및 (B)와는 상이한 별도의 성분(C)에 존재하는 방법.
  27. 제19항에 있어서, 페놀성 하이드록실기 및 베타-하이드록시 에스테르기가 둘다 성분(A) 및 (B)와는 상이한 별도의 성분(C)에 존재하는 방법.
  28. 제19항에 있어서, 페놀성 하이드록실기가 닥 페놀로부터 유도되는 방법.
  29. 제19항에 있어서, 다가 페놀이 비스페놀 A인 방법.
  30. 제19항에 있어서, 베타-하이드록시 에스테르기가 1,2-에폭시기-함유 물질을 카복실산으로 개환반응시켜 제조되는 방법.
  31. 제30항에 있어서, 카복실산이 하이드록실기-함유 카복실산인 방법.
  32. 제31항에 있어서, 하이드록실기-함유 카복실산인 디메틸올로프로피온산인 방법.
  33. 제30항에 있어서, 1,2-에폭시기-함유 물질이 폴리에폭사이드인 방법.
  34. 제19항에 페놀성 하이드록실기가 성분(A) 또는 (B)에 존재하고, 베타-하이드록시 에스테르기가 성분(A) 및 (B)와는 상이한 제3성분(C)에 존재하는 방법.
  35. 제19항에 있어서, 베타-하이드록시 에스테르기가 성분(A) 및 (B)에 존재하고, 페놀성 하이드록실기가 성분(A) 및 (B)와는 상이한 별도의 성분(C)에 존재하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970702963A 1994-11-04 1995-10-17 전착에 사용하기 적합한 양이온 수지 및 캡핑된 폴리이소시아네이트 경화제 KR100211079B1 (ko)

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US08/334,712 US5582704A (en) 1994-11-04 1994-11-04 Cationic resin and capped polyisocyanate curing agent suitable for use in electrodeposition
US8/334,712 1994-11-04
PCT/US1995/012993 WO1996014363A1 (en) 1994-11-04 1995-10-17 Cationic resin and capped polyisocyanate curing agent suitable for use in electrodeposition

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EP0789732B1 (en) 1999-07-21
CA2204434C (en) 2000-07-04
ZA958960B (en) 1997-04-23
US5760107A (en) 1998-06-02
JPH10500172A (ja) 1998-01-06
MX9703240A (es) 1997-07-31
US5582704A (en) 1996-12-10
AU691046B2 (en) 1998-05-07
ES2136884T3 (es) 1999-12-01
EP0789732A1 (en) 1997-08-20
DE69510951D1 (de) 1999-08-26
CA2204434A1 (en) 1996-05-17
ATE182353T1 (de) 1999-08-15
KR100211079B1 (ko) 1999-07-15
CN1167497A (zh) 1997-12-10
CN1128849C (zh) 2003-11-26
TW339352B (en) 1998-09-01
MY113409A (en) 2002-02-28
JP3110047B2 (ja) 2000-11-20
DE69510951T2 (de) 2000-03-30
AU3891895A (en) 1996-05-31

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