KR970067796A - LOC package with internal leads directly bonded to bonding pads - Google Patents
LOC package with internal leads directly bonded to bonding pads Download PDFInfo
- Publication number
- KR970067796A KR970067796A KR1019960008009A KR19960008009A KR970067796A KR 970067796 A KR970067796 A KR 970067796A KR 1019960008009 A KR1019960008009 A KR 1019960008009A KR 19960008009 A KR19960008009 A KR 19960008009A KR 970067796 A KR970067796 A KR 970067796A
- Authority
- KR
- South Korea
- Prior art keywords
- bonding pads
- loc package
- leads
- chip
- directly bonded
- Prior art date
Links
Landscapes
- Wire Bonding (AREA)
Abstract
본 발명은 LOC 패키지에 관한 것으로서, 내부리드가 칩 상면에 접착 고장되고, 그 내부리드의 끝 부분이 본딩패드부까지 연장되어 전기 전도성 접착 테입 등의 전기적으로 연결되는 수단으로 접착 고정되어 전기적 신호를 전달하는 수단을 제공함으로서, 기존의 와이어 본딩 공정을 생략하고, 기존의 와이어 본딩으로 전기적으로 연결하였을 때 발생하는 와이어 밀림 향상 등을 제거하여 불량의 발생을 줄인 획기적인 구조를 제공하고 있다.The present invention relates to an LOC package, in which an inner lead is bonded to an upper surface of a chip, an end portion of the inner lead extends to a bonding pad portion and is adhesively fixed by means of an electrically conductive adhesive tape or the like, The present invention provides an innovative structure which eliminates the conventional wire bonding process and eliminates the wire jigging and the like which are caused when the conventional wire bonding is electrically connected to reduce the occurrence of defects.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.
제2도는 본 발명에 의한 전기 전도성 접착 테입이 내부리드 하면에 부착되어 내부 리드와 본딩패드가 전기적으로 연결된 구조를 보여주는 LOC 패키지의 구조 단면도.FIG. 2 is a structural cross-sectional view of an LOC package showing the structure in which the electrically conductive adhesive tape according to the present invention is attached to the inner surface of the inner lead and the inner lead and the bonding pad are electrically connected.
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960008009A KR970067796A (en) | 1996-03-23 | 1996-03-23 | LOC package with internal leads directly bonded to bonding pads |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960008009A KR970067796A (en) | 1996-03-23 | 1996-03-23 | LOC package with internal leads directly bonded to bonding pads |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970067796A true KR970067796A (en) | 1997-10-13 |
Family
ID=66216410
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960008009A KR970067796A (en) | 1996-03-23 | 1996-03-23 | LOC package with internal leads directly bonded to bonding pads |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970067796A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990000204A (en) * | 1997-06-03 | 1999-01-15 | 윤종용 | Connection method of bonding pad and internal lead of semiconductor chip by adhesive means and LOC type semiconductor chip package using same |
KR100460072B1 (en) * | 1998-06-30 | 2005-02-24 | 주식회사 하이닉스반도체 | Semiconductor Package |
-
1996
- 1996-03-23 KR KR1019960008009A patent/KR970067796A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990000204A (en) * | 1997-06-03 | 1999-01-15 | 윤종용 | Connection method of bonding pad and internal lead of semiconductor chip by adhesive means and LOC type semiconductor chip package using same |
KR100460072B1 (en) * | 1998-06-30 | 2005-02-24 | 주식회사 하이닉스반도체 | Semiconductor Package |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |