KR970067796A - LOC package with internal leads directly bonded to bonding pads - Google Patents

LOC package with internal leads directly bonded to bonding pads Download PDF

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Publication number
KR970067796A
KR970067796A KR1019960008009A KR19960008009A KR970067796A KR 970067796 A KR970067796 A KR 970067796A KR 1019960008009 A KR1019960008009 A KR 1019960008009A KR 19960008009 A KR19960008009 A KR 19960008009A KR 970067796 A KR970067796 A KR 970067796A
Authority
KR
South Korea
Prior art keywords
bonding pads
loc package
leads
chip
directly bonded
Prior art date
Application number
KR1019960008009A
Other languages
Korean (ko)
Inventor
조인식
최희국
노희선
김태형
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019960008009A priority Critical patent/KR970067796A/en
Publication of KR970067796A publication Critical patent/KR970067796A/en

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  • Wire Bonding (AREA)

Abstract

본 발명은 LOC 패키지에 관한 것으로서, 내부리드가 칩 상면에 접착 고장되고, 그 내부리드의 끝 부분이 본딩패드부까지 연장되어 전기 전도성 접착 테입 등의 전기적으로 연결되는 수단으로 접착 고정되어 전기적 신호를 전달하는 수단을 제공함으로서, 기존의 와이어 본딩 공정을 생략하고, 기존의 와이어 본딩으로 전기적으로 연결하였을 때 발생하는 와이어 밀림 향상 등을 제거하여 불량의 발생을 줄인 획기적인 구조를 제공하고 있다.The present invention relates to an LOC package, in which an inner lead is bonded to an upper surface of a chip, an end portion of the inner lead extends to a bonding pad portion and is adhesively fixed by means of an electrically conductive adhesive tape or the like, The present invention provides an innovative structure which eliminates the conventional wire bonding process and eliminates the wire jigging and the like which are caused when the conventional wire bonding is electrically connected to reduce the occurrence of defects.

Description

내부 리드가 본딩패드에 직접 접착된 LOC 패키지LOC package with internal leads directly bonded to bonding pads

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제2도는 본 발명에 의한 전기 전도성 접착 테입이 내부리드 하면에 부착되어 내부 리드와 본딩패드가 전기적으로 연결된 구조를 보여주는 LOC 패키지의 구조 단면도.FIG. 2 is a structural cross-sectional view of an LOC package showing the structure in which the electrically conductive adhesive tape according to the present invention is attached to the inner surface of the inner lead and the inner lead and the bonding pad are electrically connected.

Claims (5)

복수 개의 본딩패드들을 갖는 칩; 각기 대응된 상기 본딩패드들의 상부면까지 연장되어 직접 전기적 연결된 리드들; 및 상기 칩과 리드들을 포함하여 전지적 연결 부분을 내재. 봉지한 성형수지를 포함하는 것을 특징으로 하는 LOC 패키지.A chip having a plurality of bonding pads; Leads electrically connected to the upper surfaces of the corresponding bonding pads; And a battery connection portion including the chip and the leads. ≪ / RTI > wherein the package comprises an encapsulated molding resin. 제1항에 있어서, 상기 내부리드들과 상기 본딩패드들이 각각 대응되어 전기적으로 연결되는 수단이 전기 전도성 접착 테입인 것을 특징으로 하는 LOC 패키지.The LOC package according to claim 1, wherein the means for electrically connecting the inner leads and the bonding pads to each other is an electrically conductive adhesive tape. 제1항에 있어서, 상기 내부리드와 상기 본딩패드들이 각각 대응되어 전기적으로 연결되는 수단이 솔더 볼을 형성하여 접착되는 것을 특징으로 하는 LOC 패키지.The LOC package according to claim 1, wherein the inner leads and the bonding pads are electrically connected to each other by solder balls. 제1항에 있어서, 상기 칩의 상부면이 상기 리드들의 하부면과 전기 절연 접착 고정된 것을 특징으로 하는 LOC 패키지.The LOC package according to claim 1, wherein an upper surface of the chip is electrically insulated and fixed to a lower surface of the leads. 제4항에 있어서, 상기 칩의 상부면이 상기 리드들의 하부면과 전기 절연 접착 고정된 수단이 폴리이미드 테이프인 것을 특징으로 하는 LOC 패키지.The LOC package according to claim 4, wherein the upper surface of the chip is electrically insulated and fixed to the lower surface of the leads by a polyimide tape.
KR1019960008009A 1996-03-23 1996-03-23 LOC package with internal leads directly bonded to bonding pads KR970067796A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960008009A KR970067796A (en) 1996-03-23 1996-03-23 LOC package with internal leads directly bonded to bonding pads

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960008009A KR970067796A (en) 1996-03-23 1996-03-23 LOC package with internal leads directly bonded to bonding pads

Publications (1)

Publication Number Publication Date
KR970067796A true KR970067796A (en) 1997-10-13

Family

ID=66216410

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960008009A KR970067796A (en) 1996-03-23 1996-03-23 LOC package with internal leads directly bonded to bonding pads

Country Status (1)

Country Link
KR (1) KR970067796A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990000204A (en) * 1997-06-03 1999-01-15 윤종용 Connection method of bonding pad and internal lead of semiconductor chip by adhesive means and LOC type semiconductor chip package using same
KR100460072B1 (en) * 1998-06-30 2005-02-24 주식회사 하이닉스반도체 Semiconductor Package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990000204A (en) * 1997-06-03 1999-01-15 윤종용 Connection method of bonding pad and internal lead of semiconductor chip by adhesive means and LOC type semiconductor chip package using same
KR100460072B1 (en) * 1998-06-30 2005-02-24 주식회사 하이닉스반도체 Semiconductor Package

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