KR970053352A - 반도체 웨이퍼의 로딩/언로딩 방법 - Google Patents

반도체 웨이퍼의 로딩/언로딩 방법 Download PDF

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Publication number
KR970053352A
KR970053352A KR1019950070173A KR19950070173A KR970053352A KR 970053352 A KR970053352 A KR 970053352A KR 1019950070173 A KR1019950070173 A KR 1019950070173A KR 19950070173 A KR19950070173 A KR 19950070173A KR 970053352 A KR970053352 A KR 970053352A
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KR
South Korea
Prior art keywords
wafer
unloading
loading
cassette
completed
Prior art date
Application number
KR1019950070173A
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English (en)
Other versions
KR0167305B1 (ko
Inventor
송기철
Original Assignee
문정환
Lg 반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 문정환, Lg 반도체 주식회사 filed Critical 문정환
Priority to KR1019950070173A priority Critical patent/KR0167305B1/ko
Publication of KR970053352A publication Critical patent/KR970053352A/ko
Application granted granted Critical
Publication of KR0167305B1 publication Critical patent/KR0167305B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 반도체 웨이퍼의 로딩/언로딩 방법에 관한 것으로, 종래의 웨이퍼의 로딩/언로딩 동작은 로보트의 아암(3)이 위치하는 웨이퍼(W)의 하면부위가 그 아래에 위치한 웨이퍼의 상측이므로 아암(3)의 동작시에 파티클이 발생되거나, 하측에 위치한 웨이퍼의 상면에 스크래치가 발생되는 등의 문제가 있는 바, 웨이퍼가 수납되어 있는 카세트를 장치에 장착하는 단계와; 로보트 아암이 최하측에 수납된 웨이퍼부터 로딩하여 공정을 수행하는 로딩 단계와; 공정이 완료된 웨이퍼를 상면이 하측으로 향하도록 뒤집어서 카세트에 언로딩하는 언로딩 단계와; 상기 로딩 및 언로딩 단계를 반복하여 실시하는 단계와; 카세트에 수납되어 있는 모든 웨이퍼의 공정이 완료된 후 카세트를 뒤집어서 다음 공정으로 운반하는 단계의 순서로 수행함을 특징으로 하는 반도체 웨이퍼의로딩/언로딩 방법을 제공하여 공정상의 웨이퍼 불량을 완전히 배제하도록 한 것이다.

Description

반도체 웨이퍼의 로딩/언로딩 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 본 발명에 의한 반도체 웨이퍼의 로딩/언로딩 방법의 설명도.

Claims (1)

  1. 웨이퍼가 수납되어 있는 카세트를 장치에 장착되는 단계와; 로보트 아암이 최하측에 수납된 웨이퍼부터 로딩하여 공정을 수행하는 로딩 단계와; 공정이 완료된 웨이퍼를 상면이 하측으로 향하도록 뒤집어서 카세트에 언로딩하는 언로딩 단계와; 상기 로딩 및 언로딩 단계를 반복하여 실시하는 단계와; 카세트에 수납되어 있는 모든 웨이퍼의 공정이 완료된 후 카세트를 뒤집어서 다음 공정으로 운반하는 단계의 순서로 수행함을 특징으로 하는 반도체 웨이퍼의 로딩/언로딩 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950070173A 1995-12-31 1995-12-31 반도체 웨이퍼의 로딩/언로딩 방법 KR0167305B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950070173A KR0167305B1 (ko) 1995-12-31 1995-12-31 반도체 웨이퍼의 로딩/언로딩 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950070173A KR0167305B1 (ko) 1995-12-31 1995-12-31 반도체 웨이퍼의 로딩/언로딩 방법

Publications (2)

Publication Number Publication Date
KR970053352A true KR970053352A (ko) 1997-07-31
KR0167305B1 KR0167305B1 (ko) 1999-02-01

Family

ID=19448710

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950070173A KR0167305B1 (ko) 1995-12-31 1995-12-31 반도체 웨이퍼의 로딩/언로딩 방법

Country Status (1)

Country Link
KR (1) KR0167305B1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100560817B1 (ko) * 2004-05-07 2006-03-13 삼성전자주식회사 웨이퍼 로딩/언로딩 확인 방법
US8214948B2 (en) 2008-09-17 2012-07-10 Engage Environments Llc Adjustable bed skirt

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100560817B1 (ko) * 2004-05-07 2006-03-13 삼성전자주식회사 웨이퍼 로딩/언로딩 확인 방법
US8214948B2 (en) 2008-09-17 2012-07-10 Engage Environments Llc Adjustable bed skirt

Also Published As

Publication number Publication date
KR0167305B1 (ko) 1999-02-01

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