KR970030745A - Manufacturing method of multi-chip package with solder pre-plating lead frame - Google Patents
Manufacturing method of multi-chip package with solder pre-plating lead frame Download PDFInfo
- Publication number
- KR970030745A KR970030745A KR1019950043189A KR19950043189A KR970030745A KR 970030745 A KR970030745 A KR 970030745A KR 1019950043189 A KR1019950043189 A KR 1019950043189A KR 19950043189 A KR19950043189 A KR 19950043189A KR 970030745 A KR970030745 A KR 970030745A
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- manufacturing
- substrate
- solder
- chip package
- Prior art date
Links
Abstract
본 발명은 리드프에임을 적용한 멀티 칩 패키지의 제조방법에 관한 것으로, 외부리드 부분에 미리 솔더 프래팅된 리드프레임을 적용하여 패키지를 제조함으로써 제조 공정의 단순화와 자연 오염을 최소화로 할 수 있는 동시에 제조 단가를 낮출 수 있는 특징을 갖는다.The present invention relates to a method for manufacturing a multi-chip package using a lead frame, and by manufacturing a package by applying a solder-framed lead frame to an outer lead portion, the manufacturing process can be simplified and the natural contamination can be minimized. It has the characteristics which can reduce manufacturing cost.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제 1도는 멀티 칩 패키지를 나타내는 단면도.1 is a cross-sectional view showing a multi-chip package.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950043189A KR970030745A (en) | 1995-11-23 | 1995-11-23 | Manufacturing method of multi-chip package with solder pre-plating lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950043189A KR970030745A (en) | 1995-11-23 | 1995-11-23 | Manufacturing method of multi-chip package with solder pre-plating lead frame |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970030745A true KR970030745A (en) | 1997-06-26 |
Family
ID=66588713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950043189A KR970030745A (en) | 1995-11-23 | 1995-11-23 | Manufacturing method of multi-chip package with solder pre-plating lead frame |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970030745A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101231802B1 (en) * | 2011-07-06 | 2013-02-08 | 엘에스파워세미텍 주식회사 | System and method for heterojunction without contacting a heating source |
-
1995
- 1995-11-23 KR KR1019950043189A patent/KR970030745A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101231802B1 (en) * | 2011-07-06 | 2013-02-08 | 엘에스파워세미텍 주식회사 | System and method for heterojunction without contacting a heating source |
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Legal Events
Date | Code | Title | Description |
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WITN | Withdrawal due to no request for examination |