KR970018738A - 집적된 마이크로일렉트로닉 센서 및 그 제조 방법 - Google Patents

집적된 마이크로일렉트로닉 센서 및 그 제조 방법 Download PDF

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Publication number
KR970018738A
KR970018738A KR1019960041003A KR19960041003A KR970018738A KR 970018738 A KR970018738 A KR 970018738A KR 1019960041003 A KR1019960041003 A KR 1019960041003A KR 19960041003 A KR19960041003 A KR 19960041003A KR 970018738 A KR970018738 A KR 970018738A
Authority
KR
South Korea
Prior art keywords
cantilever
integrated
microelectronic sensor
oxide
motion limiting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019960041003A
Other languages
English (en)
Korean (ko)
Inventor
슈테판 콜프.
Original Assignee
로더리히 네테부쉬 ; 롤프 옴케
지멘스 악티엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 로더리히 네테부쉬 ; 롤프 옴케, 지멘스 악티엔게젤샤프트 filed Critical 로더리히 네테부쉬 ; 롤프 옴케
Publication of KR970018738A publication Critical patent/KR970018738A/ko
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/0015—Cantilevers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
    • G01N27/125—Composition of the body, e.g. the composition of its sensitive layer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
    • G01N27/128—Microapparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/304—Beam type
    • H10N30/306—Cantilevers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0136—Growing or depositing of a covering layer

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Pressure Sensors (AREA)
KR1019960041003A 1995-09-28 1996-09-20 집적된 마이크로일렉트로닉 센서 및 그 제조 방법 Ceased KR970018738A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19536228.4 1995-09-28
DE19536228A DE19536228B4 (de) 1995-09-28 1995-09-28 Mikroelektronischer, integrierter Sensor und Verfahren zur Herstellung des Sensors

Publications (1)

Publication Number Publication Date
KR970018738A true KR970018738A (ko) 1997-04-30

Family

ID=7773515

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960041003A Ceased KR970018738A (ko) 1995-09-28 1996-09-20 집적된 마이크로일렉트로닉 센서 및 그 제조 방법

Country Status (5)

Country Link
US (1) US6156586A (enExample)
EP (1) EP0766089B1 (enExample)
JP (1) JPH09129899A (enExample)
KR (1) KR970018738A (enExample)
DE (2) DE19536228B4 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19700290A1 (de) * 1997-01-03 1998-07-16 Siemens Ag Mikromechanische Halbleiteranordnung und Verfahren zur Herstellung einer mikromechanischen Halbleiteranordnung
US6379990B1 (en) 1997-01-03 2002-04-30 Infineon Technologies Ag Method of fabricating a micromechanical semiconductor configuration
TW408417B (en) * 1999-05-03 2000-10-11 Ind Tech Res Inst Planar-shape thin probe having electrostatic actuator manufactured by using sacrificed layer technology and its manufacturing method
DE19949605A1 (de) * 1999-10-15 2001-04-19 Bosch Gmbh Robert Beschleunigungssensor
DE10002363B4 (de) * 2000-01-20 2005-02-03 Infineon Technologies Ag Verfahren zur Herstellung einer mikromechanischen Struktur
GB2369436A (en) * 2000-07-28 2002-05-29 Marconi Applied Techn Ltd Chemical sensing micro-mechanical cantilever
DE10196676B4 (de) * 2001-07-26 2009-11-26 Mitsubishi Denki K.K. Substrat und Herstellungsverfahren dafür sowie Dünnschicht-Strukturkörper
DE10161953A1 (de) * 2001-12-17 2003-06-26 Infineon Technologies Ag Verfahren zum Herstellen einer Mikrostruktur
FR2834282B1 (fr) * 2001-12-28 2004-02-27 Commissariat Energie Atomique Procede de renforcement d'une microstructure mecanique
JP2006175583A (ja) * 2004-11-29 2006-07-06 Chemitoronics Co Ltd マイクロ構造体の製造方法
JP4791766B2 (ja) * 2005-05-30 2011-10-12 株式会社東芝 Ｍｅｍｓ技術を使用した半導体装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5121633A (en) * 1987-12-18 1992-06-16 Nissan Motor Co., Ltd. Semiconductor accelerometer
US4882933A (en) * 1988-06-03 1989-11-28 Novasensor Accelerometer with integral bidirectional shock protection and controllable viscous damping
JPH04186167A (ja) * 1990-11-21 1992-07-02 Mitsubishi Electric Corp 半導体加速度センサー及びその製造方法
JPH057006A (ja) * 1991-06-28 1993-01-14 Mitsubishi Electric Corp 半導体加速度検出装置
US5265474A (en) * 1991-07-11 1993-11-30 Rockwell International Corporation Static electricity resistant accelerometer proof mass
US5181156A (en) * 1992-05-14 1993-01-19 Motorola Inc. Micromachined capacitor structure and method for making
US5241864A (en) * 1992-06-17 1993-09-07 Motorola, Inc. Double pinned sensor utilizing a tensile film
US5258097A (en) * 1992-11-12 1993-11-02 Ford Motor Company Dry-release method for sacrificial layer microstructure fabrication
DE4332843C2 (de) * 1993-09-27 1997-04-24 Siemens Ag Verfahren zur Herstellung einer mikromechanischen Vorrichtung und mikromechanische Vorrichtung
DE4423396C2 (de) * 1994-07-04 2001-10-25 Fraunhofer Ges Forschung Verfahren zum Herstellen einer mikromechanischen Oberflächenstruktur
DE19536250A1 (de) * 1995-09-28 1997-04-03 Siemens Ag Mikroelektronischer, integrierter Sensor und Verfahren zur Herstellung des Sensors

Also Published As

Publication number Publication date
US6156586A (en) 2000-12-05
EP0766089B1 (de) 2001-12-05
DE19536228B4 (de) 2005-06-30
JPH09129899A (ja) 1997-05-16
EP0766089A2 (de) 1997-04-02
DE59608356D1 (de) 2002-01-17
EP0766089A3 (enExample) 1997-04-09
DE19536228A1 (de) 1997-04-03

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