JP4056482B2 - 静電機械及びこれの製造方法 - Google Patents
静電機械及びこれの製造方法 Download PDFInfo
- Publication number
- JP4056482B2 JP4056482B2 JP2004037233A JP2004037233A JP4056482B2 JP 4056482 B2 JP4056482 B2 JP 4056482B2 JP 2004037233 A JP2004037233 A JP 2004037233A JP 2004037233 A JP2004037233 A JP 2004037233A JP 4056482 B2 JP4056482 B2 JP 4056482B2
- Authority
- JP
- Japan
- Prior art keywords
- micromachine
- layers
- layer
- stack
- hub
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
- H02N1/002—Electrostatic motors
- H02N1/004—Electrostatic motors in which a body is moved along a path due to interaction with an electric field travelling along the path
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
- Weting (AREA)
Description
12 基板
13 マスク
14 穴
15 主平面(上面)
16 固定子構造
17 主平面(上面)
18 回転子構造
20 穴
22 ハブ
24 犠牲層
28 穴
30 穴
40 スタック構造
50 エンドキャップ層
56 絶縁材
58 ハブ構造
60 ギャップ
70 機械
Claims (5)
- 独自に形成されて相互にスタック状に積層された複数の層を含むスタック構造を有し、該スタック構造の前記複数の層は、少なくとも2つのマイクロマシン層を含み、該マイクロマシン層のそれぞれは、ハブ、回転子構造及び該回転子構造の周囲に隣接して配置された複数個の固定子構造を含む同一の形状の超小型構造を有し、前記複数のマイクロマシン層のそれぞれの前記ハブ同士がボンディングされ、前記複数のマイクロマシン層のそれぞれの前記回転子構造同士がボンディングされ、前記複数のマイクロマシン層のそれぞれの前記固定子構造同士がボンディングされていることを特徴とする静電機械。
- 前記少なくとも2つのマイクロマシン層を挟むように2つのエンドキャップ層が設けられ、該2つのエンドキャップ層のそれぞれは、前記ハブに接続し且つ前記回転子構造からギャップを介して配置されているハブ構造を有することを特徴とする請求項1に記載の静電機械。
- 前記2つのエンドキャップ層の少なくとも一方に、前記複数個の固定子構造のそれぞれに接続する電気的接続部が設けられていることを特徴とする請求項2に記載の静電機械。
- 前記回転子構造が前記ハブの周りで回転することを特徴とする請求項1に記載の静電機械。
- 前記回転子構造が前記ハブを介して前記2つのエンドキャップ層の少なくとも一方の前記ハブ構造に接続されており、前記ハブ構造が前記回転子構造により回転されることを特徴とする請求項2に記載の静電機械。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US51092495A | 1995-08-03 | 1995-08-03 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19877796A Division JP3540513B2 (ja) | 1995-08-03 | 1996-07-29 | 複数の超小型構造層から製作された機械 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004201499A JP2004201499A (ja) | 2004-07-15 |
JP4056482B2 true JP4056482B2 (ja) | 2008-03-05 |
Family
ID=24032749
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19877796A Expired - Fee Related JP3540513B2 (ja) | 1995-08-03 | 1996-07-29 | 複数の超小型構造層から製作された機械 |
JP2004037233A Expired - Fee Related JP4056482B2 (ja) | 1995-08-03 | 2004-02-13 | 静電機械及びこれの製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19877796A Expired - Fee Related JP3540513B2 (ja) | 1995-08-03 | 1996-07-29 | 複数の超小型構造層から製作された機械 |
Country Status (5)
Country | Link |
---|---|
US (2) | US5763318A (ja) |
EP (1) | EP0757431A3 (ja) |
JP (2) | JP3540513B2 (ja) |
KR (1) | KR100294741B1 (ja) |
TW (1) | TW374211B (ja) |
Families Citing this family (31)
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US6498074B2 (en) | 1996-10-29 | 2002-12-24 | Tru-Si Technologies, Inc. | Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners |
KR100377033B1 (ko) | 1996-10-29 | 2003-03-26 | 트러시 테크날러지스 엘엘시 | Ic 및 그 제조방법 |
US6882030B2 (en) | 1996-10-29 | 2005-04-19 | Tru-Si Technologies, Inc. | Integrated circuit structures with a conductor formed in a through hole in a semiconductor substrate and protruding from a surface of the substrate |
US6410360B1 (en) | 1999-01-26 | 2002-06-25 | Teledyne Industries, Inc. | Laminate-based apparatus and method of fabrication |
US6500694B1 (en) | 2000-03-22 | 2002-12-31 | Ziptronix, Inc. | Three dimensional device integration method and integrated device |
US6984571B1 (en) | 1999-10-01 | 2006-01-10 | Ziptronix, Inc. | Three dimensional device integration method and integrated device |
US6322903B1 (en) | 1999-12-06 | 2001-11-27 | Tru-Si Technologies, Inc. | Package of integrated circuits and vertical integration |
US6902987B1 (en) | 2000-02-16 | 2005-06-07 | Ziptronix, Inc. | Method for low temperature bonding and bonded structure |
US6563133B1 (en) * | 2000-08-09 | 2003-05-13 | Ziptronix, Inc. | Method of epitaxial-like wafer bonding at low temperature and bonded structure |
US6597048B1 (en) * | 2000-12-26 | 2003-07-22 | Cornell Research Foundation | Electrostatically charged microstructures |
US6717254B2 (en) | 2001-02-22 | 2004-04-06 | Tru-Si Technologies, Inc. | Devices having substrates with opening passing through the substrates and conductors in the openings, and methods of manufacture |
US7141812B2 (en) * | 2002-06-05 | 2006-11-28 | Mikro Systems, Inc. | Devices, methods, and systems involving castings |
US7785098B1 (en) | 2001-06-05 | 2010-08-31 | Mikro Systems, Inc. | Systems for large area micro mechanical systems |
CA2448736C (en) * | 2001-06-05 | 2010-08-10 | Mikro Systems, Inc. | Methods for manufacturing three-dimensional devices and devices created thereby |
US6787916B2 (en) | 2001-09-13 | 2004-09-07 | Tru-Si Technologies, Inc. | Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity |
US6990732B2 (en) | 2001-11-29 | 2006-01-31 | Hewlett-Packard Development Company, L.P. | Method of manufacturing a micrometer-scaled electronic-charge-transferring device |
US6908845B2 (en) | 2002-03-28 | 2005-06-21 | Intel Corporation | Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme |
US6848177B2 (en) | 2002-03-28 | 2005-02-01 | Intel Corporation | Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme |
US7109092B2 (en) | 2003-05-19 | 2006-09-19 | Ziptronix, Inc. | Method of room temperature covalent bonding |
SG140447A1 (en) * | 2003-08-12 | 2008-03-28 | Sony Corp | Method of forming a micro-rotating device, and a micro-rotating device produced by the method |
SG139521A1 (en) * | 2003-08-12 | 2008-02-29 | Sony Corp | Method of producing a thin electromagnetic motor |
KR100930178B1 (ko) * | 2004-01-15 | 2009-12-07 | 인터내셔널 비지네스 머신즈 코포레이션 | 온 칩 시스템 |
FR2872501B1 (fr) * | 2004-07-01 | 2006-11-03 | Commissariat Energie Atomique | Microresonateur composite a forte deformation |
US7696102B2 (en) * | 2005-03-31 | 2010-04-13 | Gang Zhang | Methods for fabrication of three-dimensional structures |
US8216931B2 (en) * | 2005-03-31 | 2012-07-10 | Gang Zhang | Methods for forming multi-layer three-dimensional structures |
US7659802B2 (en) * | 2006-03-15 | 2010-02-09 | Honeywell International Inc. | Bi-stable magnetic latch assembly |
US8043931B1 (en) | 2006-09-18 | 2011-10-25 | Gang Zhang | Methods for forming multi-layer silicon structures |
JP5032949B2 (ja) * | 2007-11-14 | 2012-09-26 | エイチジーエスティーネザーランドビーブイ | マイクロアクチュエータ、ヘッド・ジンバル・アセンブリ及びディスク・ドライブ装置 |
US8337141B2 (en) * | 2008-02-14 | 2012-12-25 | The Charles Stark Draper Laboratory, Inc. | Rotary nanotube bearing structure and methods for manufacturing and using the same |
EP2559533B1 (en) | 2008-09-26 | 2020-04-15 | United Technologies Corporation | Casting |
US8813824B2 (en) | 2011-12-06 | 2014-08-26 | Mikro Systems, Inc. | Systems, devices, and/or methods for producing holes |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
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US4761210A (en) * | 1985-09-30 | 1988-08-02 | Siemens Aktiengesellschaft | Method for generating structures in micro-mechanics |
US4928029A (en) * | 1987-02-27 | 1990-05-22 | Maxtor Corporation | In-spindle motor assembly for disk drive and method for fabricating |
KR910000087B1 (ko) * | 1987-03-12 | 1991-01-19 | 미츠비시 덴키 가부시키가이샤 | 직류기의 회전자 |
US4943750A (en) | 1987-05-20 | 1990-07-24 | Massachusetts Institute Of Technology | Electrostatic micromotor |
US4997521A (en) | 1987-05-20 | 1991-03-05 | Massachusetts Institute Of Technology | Electrostatic micromotor |
US4740410A (en) * | 1987-05-28 | 1988-04-26 | The Regents Of The University Of California | Micromechanical elements and methods for their fabrication |
US5001381A (en) * | 1987-12-08 | 1991-03-19 | Akio Takahashi | Electro-static motor |
JPH078149B2 (ja) * | 1989-06-16 | 1995-01-30 | 松下電器産業株式会社 | 静電型マイクロモータの駆動力伝達装置 |
DE4003116A1 (de) * | 1990-02-02 | 1991-08-08 | Fraunhofer Ges Forschung | Dielektrischer motor mit gesteuerter laufrichtung und wahlweise kontinuierlichem oder diskontinuierlichem lauf |
DE4009116A1 (de) * | 1990-03-19 | 1991-09-26 | Festkoerper Laser Inst Berlin | Festkoerperlaseranordnung |
US5093596A (en) * | 1990-10-24 | 1992-03-03 | Ibm Corporation | Combined linear-rotary direct drive step motor |
JP3060639B2 (ja) * | 1991-09-05 | 2000-07-10 | 日本電気株式会社 | 微小可動機械の製造方法 |
US5202754A (en) | 1991-09-13 | 1993-04-13 | International Business Machines Corporation | Three-dimensional multichip packages and methods of fabrication |
US5270261A (en) | 1991-09-13 | 1993-12-14 | International Business Machines Corporation | Three dimensional multichip package methods of fabrication |
JPH0715969B2 (ja) | 1991-09-30 | 1995-02-22 | インターナショナル・ビジネス・マシーンズ・コーポレイション | マルチチツプ集積回路パツケージ及びそのシステム |
US5266859A (en) * | 1991-10-09 | 1993-11-30 | General Electric Company | Skewing of pole laminations of a switched reluctance machine to reduce acoustic noise |
US5378583A (en) * | 1992-12-22 | 1995-01-03 | Wisconsin Alumni Research Foundation | Formation of microstructures using a preformed photoresist sheet |
US5412265A (en) * | 1993-04-05 | 1995-05-02 | Ford Motor Company | Planar micro-motor and method of fabrication |
DE4400315C1 (de) * | 1994-01-07 | 1995-01-12 | Kernforschungsz Karlsruhe | Verfahren zum stufenweisen Aufbau von Mikrostrukturkörpern und damit hergestellter Mikrostrukturkörper |
US5631514A (en) * | 1994-06-09 | 1997-05-20 | The United States Of America As Represented By The United States Department Of Energy | Microfabricated microengine for use as a mechanical drive and power source in the microdomain and fabrication process |
US5649349A (en) * | 1995-05-05 | 1997-07-22 | Greenway; Glenn W. | Method for manufacturing of laminated components |
US5710466A (en) * | 1995-06-19 | 1998-01-20 | Georgia Tech Research Corporation | Fully integrated magnetic micromotors and methods for their fabrication |
-
1996
- 1996-04-05 TW TW085103963A patent/TW374211B/zh not_active IP Right Cessation
- 1996-07-15 KR KR1019960028479A patent/KR100294741B1/ko not_active IP Right Cessation
- 1996-07-15 EP EP96305180A patent/EP0757431A3/en not_active Withdrawn
- 1996-07-29 JP JP19877796A patent/JP3540513B2/ja not_active Expired - Fee Related
- 1996-12-24 US US08/772,841 patent/US5763318A/en not_active Expired - Lifetime
-
1997
- 1997-11-04 US US08/999,871 patent/US5955818A/en not_active Expired - Lifetime
-
2004
- 2004-02-13 JP JP2004037233A patent/JP4056482B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW374211B (en) | 1999-11-11 |
JP3540513B2 (ja) | 2004-07-07 |
JPH09117164A (ja) | 1997-05-02 |
US5763318A (en) | 1998-06-09 |
KR970013583A (ko) | 1997-03-29 |
US5955818A (en) | 1999-09-21 |
KR100294741B1 (ko) | 2001-11-30 |
JP2004201499A (ja) | 2004-07-15 |
EP0757431A2 (en) | 1997-02-05 |
EP0757431A3 (en) | 1997-10-08 |
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