KR970006535B1 - Universal semiconductor chip package - Google Patents

Universal semiconductor chip package Download PDF

Info

Publication number
KR970006535B1
KR970006535B1 KR88012347A KR880012347A KR970006535B1 KR 970006535 B1 KR970006535 B1 KR 970006535B1 KR 88012347 A KR88012347 A KR 88012347A KR 880012347 A KR880012347 A KR 880012347A KR 970006535 B1 KR970006535 B1 KR 970006535B1
Authority
KR
South Korea
Prior art keywords
semiconductor chip
chip package
package
connectors
pads
Prior art date
Application number
KR88012347A
Other languages
English (en)
Other versions
KR890007405A (ko
Inventor
Richard K Spieberger
Tomas J Dunaway
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of KR890007405A publication Critical patent/KR890007405A/ko
Application granted granted Critical
Publication of KR970006535B1 publication Critical patent/KR970006535B1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5382Adaptable interconnections, e.g. for engineering changes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/1517Multilayer substrate
    • H01L2924/15172Fan-out arrangement of the internal vias
    • H01L2924/15173Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/153Connection portion
    • H01L2924/1531Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR88012347A 1987-10-23 1988-09-23 Universal semiconductor chip package KR970006535B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11285187A 1987-10-23 1987-10-23
US112,851 1987-10-23

Publications (2)

Publication Number Publication Date
KR890007405A KR890007405A (ko) 1989-06-19
KR970006535B1 true KR970006535B1 (en) 1997-04-29

Family

ID=22346175

Family Applications (1)

Application Number Title Priority Date Filing Date
KR88012347A KR970006535B1 (en) 1987-10-23 1988-09-23 Universal semiconductor chip package

Country Status (5)

Country Link
EP (1) EP0312975B1 (ko)
JP (1) JP2584298B2 (ko)
KR (1) KR970006535B1 (ko)
CA (1) CA1315019C (ko)
DE (1) DE3856168T2 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5893200A (ja) * 1981-11-27 1983-06-02 Yokogawa Hokushin Electric Corp パルス状x線発生装置
US4933741A (en) * 1988-11-14 1990-06-12 Motorola, Inc. Multifunction ground plane
FR2647962B1 (fr) * 1989-05-30 1994-04-15 Thomson Composants Milit Spatiau Circuit electronique en boitier avec puce sur zone quadrillee de plots conducteurs
US5060116A (en) * 1990-04-20 1991-10-22 Grobman Warren D Electronics system with direct write engineering change capability
US5250844A (en) * 1990-09-17 1993-10-05 Motorola, Inc. Multiple power/ground planes for tab
KR970053748A (ko) * 1995-12-30 1997-07-31 황인길 반도체 패키지의 리드프레임
KR100342813B1 (ko) * 1996-11-28 2002-11-30 앰코 테크놀로지 코리아 주식회사 접지선및전원선을갖는에어리어어레이범프드반도체패키지

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
JPS6148994A (ja) * 1984-08-17 1986-03-10 株式会社日立製作所 モジユ−ル基板

Also Published As

Publication number Publication date
DE3856168T2 (de) 1998-11-26
CA1315019C (en) 1993-03-23
KR890007405A (ko) 1989-06-19
JPH021148A (ja) 1990-01-05
EP0312975A2 (en) 1989-04-26
JP2584298B2 (ja) 1997-02-26
EP0312975B1 (en) 1998-04-15
DE3856168D1 (de) 1998-05-20
EP0312975A3 (en) 1990-10-03

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Legal Events

Date Code Title Description
A201 Request for examination
N231 Notification of change of applicant
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20050705

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee