KR970006535B1 - Universal semiconductor chip package - Google Patents
Universal semiconductor chip package Download PDFInfo
- Publication number
- KR970006535B1 KR970006535B1 KR88012347A KR880012347A KR970006535B1 KR 970006535 B1 KR970006535 B1 KR 970006535B1 KR 88012347 A KR88012347 A KR 88012347A KR 880012347 A KR880012347 A KR 880012347A KR 970006535 B1 KR970006535 B1 KR 970006535B1
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor chip
- chip package
- package
- connectors
- pads
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5382—Adaptable interconnections, e.g. for engineering changes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11285187A | 1987-10-23 | 1987-10-23 | |
US112,851 | 1987-10-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890007405A KR890007405A (ko) | 1989-06-19 |
KR970006535B1 true KR970006535B1 (en) | 1997-04-29 |
Family
ID=22346175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR88012347A KR970006535B1 (en) | 1987-10-23 | 1988-09-23 | Universal semiconductor chip package |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0312975B1 (ko) |
JP (1) | JP2584298B2 (ko) |
KR (1) | KR970006535B1 (ko) |
CA (1) | CA1315019C (ko) |
DE (1) | DE3856168T2 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5893200A (ja) * | 1981-11-27 | 1983-06-02 | Yokogawa Hokushin Electric Corp | パルス状x線発生装置 |
US4933741A (en) * | 1988-11-14 | 1990-06-12 | Motorola, Inc. | Multifunction ground plane |
FR2647962B1 (fr) * | 1989-05-30 | 1994-04-15 | Thomson Composants Milit Spatiau | Circuit electronique en boitier avec puce sur zone quadrillee de plots conducteurs |
US5060116A (en) * | 1990-04-20 | 1991-10-22 | Grobman Warren D | Electronics system with direct write engineering change capability |
US5250844A (en) * | 1990-09-17 | 1993-10-05 | Motorola, Inc. | Multiple power/ground planes for tab |
KR970053748A (ko) * | 1995-12-30 | 1997-07-31 | 황인길 | 반도체 패키지의 리드프레임 |
KR100342813B1 (ko) * | 1996-11-28 | 2002-11-30 | 앰코 테크놀로지 코리아 주식회사 | 접지선및전원선을갖는에어리어어레이범프드반도체패키지 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4245273A (en) * | 1979-06-29 | 1981-01-13 | International Business Machines Corporation | Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices |
JPS6148994A (ja) * | 1984-08-17 | 1986-03-10 | 株式会社日立製作所 | モジユ−ル基板 |
-
1988
- 1988-09-14 CA CA000577307A patent/CA1315019C/en not_active Expired - Fee Related
- 1988-09-23 KR KR88012347A patent/KR970006535B1/ko not_active IP Right Cessation
- 1988-10-18 EP EP88117298A patent/EP0312975B1/en not_active Expired - Lifetime
- 1988-10-18 DE DE3856168T patent/DE3856168T2/de not_active Expired - Lifetime
- 1988-10-24 JP JP63266288A patent/JP2584298B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE3856168T2 (de) | 1998-11-26 |
CA1315019C (en) | 1993-03-23 |
KR890007405A (ko) | 1989-06-19 |
JPH021148A (ja) | 1990-01-05 |
EP0312975A2 (en) | 1989-04-26 |
JP2584298B2 (ja) | 1997-02-26 |
EP0312975B1 (en) | 1998-04-15 |
DE3856168D1 (de) | 1998-05-20 |
EP0312975A3 (en) | 1990-10-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
N231 | Notification of change of applicant | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20050705 Year of fee payment: 9 |
|
LAPS | Lapse due to unpaid annual fee |