KR860700074A - 표준배열의 접촉패드를 가진 집적회로 - Google Patents

표준배열의 접촉패드를 가진 집적회로

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Publication number
KR860700074A
KR860700074A KR1019850700330A KR850700330A KR860700074A KR 860700074 A KR860700074 A KR 860700074A KR 1019850700330 A KR1019850700330 A KR 1019850700330A KR 850700330 A KR850700330 A KR 850700330A KR 860700074 A KR860700074 A KR 860700074A
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KR
South Korea
Prior art keywords
integrated circuit
contact pads
standard array
array
standard
Prior art date
Application number
KR1019850700330A
Other languages
English (en)
Other versions
KR960009090B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of KR860700074A publication Critical patent/KR860700074A/ko
Application granted granted Critical
Publication of KR960009090B1 publication Critical patent/KR960009090B1/ko

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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
KR1019850700330A 1984-03-22 1985-03-19 표준 배열의 접촉 패드를 가진 집적회로 KR960009090B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US59218684A 1984-03-22 1984-03-22
US592186 1984-03-22
PCT/US1985/000457 WO1985004518A1 (en) 1984-03-22 1985-03-19 Integrated circuits with contact pads in a standard array

Publications (2)

Publication Number Publication Date
KR860700074A true KR860700074A (ko) 1986-01-31
KR960009090B1 KR960009090B1 (ko) 1996-07-10

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KR1019850700330A KR960009090B1 (ko) 1984-03-22 1985-03-19 표준 배열의 접촉 패드를 가진 집적회로

Country Status (4)

Country Link
EP (1) EP0179802A4 (ko)
JP (2) JPS61501538A (ko)
KR (1) KR960009090B1 (ko)
WO (1) WO1985004518A1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2604029B1 (fr) * 1986-09-16 1994-08-05 Toshiba Kk Puce de circuit integre possedant des bornes de sortie ameliorees
JPH07111971B2 (ja) * 1989-10-11 1995-11-29 三菱電機株式会社 集積回路装置の製造方法
EP1600249A1 (en) 2004-05-27 2005-11-30 Koninklijke Philips Electronics N.V. Composition of a solder, and method of manufacturing a solder connection
US8169081B1 (en) 2007-12-27 2012-05-01 Volterra Semiconductor Corporation Conductive routings in integrated circuits using under bump metallization
CN106604547B (zh) * 2016-11-22 2018-12-11 深圳市洁简达创新科技有限公司 一种无污染电子线路板制造工艺

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3386008A (en) * 1964-08-31 1968-05-28 Cts Corp Integrated circuit
US3518751A (en) * 1967-05-25 1970-07-07 Hughes Aircraft Co Electrical connection and/or mounting arrays for integrated circuit chips
US3808475A (en) * 1972-07-10 1974-04-30 Amdahl Corp Lsi chip construction and method
US4197555A (en) * 1975-12-29 1980-04-08 Fujitsu Limited Semiconductor device
US4076575A (en) * 1976-06-30 1978-02-28 International Business Machines Corporation Integrated fabrication method of forming connectors through insulative layers

Also Published As

Publication number Publication date
KR960009090B1 (ko) 1996-07-10
EP0179802A1 (en) 1986-05-07
JPH0554694B2 (ko) 1993-08-13
JPH06318615A (ja) 1994-11-15
EP0179802A4 (en) 1987-06-01
WO1985004518A1 (en) 1985-10-10
JPS61501538A (ja) 1986-07-24
JPH0719792B2 (ja) 1995-03-06

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